# US 12,002,780 B2 · Package structure including a base and a lid disposed over the base and method of forming the package structure

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- Number: US 12,002,780 B2
- Document ID: US12002780B2
- Status: Granted
- Kind: B2
- Application number: 17/211,623
- Filed: 2021-03-24
- Published: 2022-05-12
- Granted: 2024-06-04
- Earliest claimed: 2020-11-12
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company Ltd.
- Inventors: Kuei-Sung Chang
- Web page: https://patentgrep.com/patent/US12002780B2

## CPC

- H10W 72/072: {of bump connectors}
- H10W 76/12: characterised by their shape
- H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00)
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 76/42: Fillings
- H10W 76/60: Seals
- H10W 90/00: Package configurations
- H10W 95/00: Packaging processes not covered by the other groups of this subclass
- H10W 72/01225: {in solid form, e.g. by using a powder or by stud bumping}
- H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present disclosure provides a package structure. The package structure includes a base, a device disposed on the base, a lid disposed over the base and the device and spaced apart from the device, and a first metal component disposed between the device and the lid, wherein the first metal component contacts the device and the lid. The present disclosure also provides a method for forming a package structure.

## Claims

### Claim 1

A package structure, comprising:
a base;
a device disposed on the base and having a top surface;
a lid disposed over the base and the device, spaced apart from the device, and having an interior surface facing to the top surface;
a first metal component disposed between the top surface and the interior surface, and free of surrounding material, wherein a surface of the first metal component is tapered from the top surface towards the interior surface, or tapered from the interior surface towards the top surface, an upper surface of the first metal component is separated from the interior surface, a lower surface of the first metal component contacts the top surface; and
a second metal component disposed between the device and the lid, wherein the second metal component contacts the interior surface and the top surface.

### Claim 2 (depends on 1)

The package structure according to claim 1, wherein a distance between the top surface of the device and the interior surface of the lid facing the top surface of the device is between about 5 um and about 500 um, and the device has a substantially flat bottom surface entirely contacting the base.

### Claim 3 (depends on 1)

The package structure according to claim 1, wherein a distance between the top surface and the interior surface is between about 5 micrometer (μm) and about 500 μm.

### Claim 4 (depends on 1)

The package structure according to claim 1, wherein the second metal component is free of surrounding material.

### Claim 5 (depends on 1)

The package structure according to claim 1, wherein the first metal component is in same or different configuration from the second metal component.

### Claim 6 (depends on 1)

The package structure according to claim 1, wherein a height of the second metal component is different from a height of the first metal component.

### Claim 7 (depends on 1)

The package structure according to claim 1, wherein the first metal component and the second metal component are disposed on the device.

### Claim 8 (depends on 1)

The package structure according to claim 1, wherein a width of the base is substantially same as a width of the lid.

### Claim 9 (depends on 4)

The package structure according to claim 4, wherein the first metal component and the second metal component are disposed on an interconnect structure on or within the lid.

### Claim 10 (depends on 1)

The package structure according to claim 1, wherein the second metal component vertically extends between the device and the lid.

### Claim 11 (depends on 1)

The package structure according to claim 1, further comprising a filling material surrounding the first metal component or the second metal component.

### Claim 12

A package structure, comprising:
a base;
a first device disposed on the base;
a second device disposed on the first device;
a lid disposed over the base, the first device and the second device, and spaced apart from the first device and the second device;
a first metal component disposed between the first device and the lid,
wherein the first metal component contacts the lid and the first device, is free of surrounding material and vertically extends between the first device and the lid, and
the first metal component has a height substantially greater than a thickness of the second device; and
a second metal component disposed on the second device, wherein the second metal component is separated from the lid.

### Claim 13 (depends on 12)

The package structure according to claim 12, wherein the first metal component is disposed on the first device, and the first device has a bottom surface contacting the base.

### Claim 14 (depends on 12)

The package structure according to claim 12, wherein the height of the first metal component is substantially equal to a total of the thickness of the second device and a gap between the second device and the lid.

### Claim 15 (depends on 12)

The package structure according to claim 12, wherein the second metal component is tapered towards the lid.

### Claim 16 (depends on 12)

The package structure according to claim 12, wherein the second metal component is configured as a stud, and the first metal component is configured as a pillar.

### Claim 17 (depends on 15)

The package structure according to claim 15, wherein the second metal component is disposed on an interior surface of the lid facing to the second device, and separated from the second device.

### Claim 18 (depends on 12)

The package structure according to claim 12, wherein a width of the first device is substantially greater than a width of the second device.

### Claim 19

A method, comprising:
providing a base and a device disposed on the base;
disposing a first metal component over the device, wherein the first metal component is free of surrounding material;
disposing a second metal component over the device and adjacent to the first metal component;
disposing a lid over the base and the device to contact the first metal component, wherein
an upper surface of the first metal component is separated from an interior surface of the lid,
a lower surface of the first metal component contacts a top surface of the device,
and the second metal component contacts the interior surface and the top surface; and
deriving a distance based on a first height of the second metal component, wherein
a surface of the first metal component tapers from a top surface of the device towards an interior surface of the lid, or tapers from the interior surface towards the top surface.

### Claim 20 (depends on 19)

The method according to claim 19, wherein the disposing of the lid includes controlling the distance between the top surface of the device and the interior surface of the lid facing the top surface of the device.