# US 12,002,779 B2 · Multilayer body and method of manufacturing the same

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- Number: US 12,002,779 B2
- Document ID: US12002779B2
- Status: Granted
- Kind: B2
- Application number: 17/203,850
- Filed: 2021-03-17
- Published: 2021-07-01
- Granted: 2024-06-04
- Earliest claimed: 2018-09-28
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Takashi Iwamoto
- Web page: https://patentgrep.com/patent/US12002779B2

## CPC

- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 74/014: {using batch processing}
- H10W 90/00: Package configurations
- H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves
- H03H 9/0547: {consisting of a vertical arrangement (H03H9/0566 takes precedence)}
- H03H 9/0557: {the other elements being buried in the substrate}
- H03H 9/059: {consisting of mounting pads or bumps}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7422: {used to protect an active side of a device or wafer}
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/652: Cross-sectional shapes
- H10W 70/655: Fan-out layouts
- H10W 72/01: {Manufacture or treatment}
- H10W 72/019: {of bond pads}
- H10W 72/07252: {changes in structures or sizes}
- H10W 72/07253: {changes in shapes}
- H10W 72/07254: {changes in dispositions}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/234: {Cross-sectional shape, i.e. in side view}
- H10W 72/237: {Multiple bump connectors having different shapes}
- H10W 72/247: {Dispositions of multiple bumps}
- H10W 72/248: {Top-view layouts, e.g. mirror arrays}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/823: {Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip}
- H10W 72/9223: {with redistribution layers [RDL]}
- H10W 72/923: {Bond pads having multiple stacked layers}
- H10W 72/934: {Cross-sectional shape, i.e. in side view}
- H10W 72/9413: {on encapsulations}
- H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/9445: {Top-view layouts, e.g. mirror arrays}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/20: Configurations of stacked chips
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)

## Abstract

A multilayer body includes a first electronic component and a structural body including first and second regions. The first electronic component is in the second region. The multilayer body includes a second electronic component mounted via a solder bump onto the structural body with a connection pad interposed therebetween. An outer surface of the first region and an outer surface of the first electronic component have a step difference therebetween in a height direction of the structural body. The connection pad is on the outer surface of the first region, an outer surface of the first electronic component, and a step-difference surface of a portion of the step difference.

## Claims

### Claim 1

A multilayer body comprising:
a first electronic component;
a structural body including a first region and a second region, the first electronic component being in the second region; and
a second electronic component mounted via a solder bump onto the structural body with a connection pad interposed therebetween; wherein
an outer surface of the first region and an outer surface of the second region have a step difference therebetween in a height direction of the structural body; and
the connection pad is on the outer surface of the first region, the outer surface of the first electronic component, and a step-difference surface of a portion of the step difference.

### Claim 2 (depends on 1)

The multilayer body according to claim 1, wherein the outer surface of the first region is higher than the outer surface of the second region in the height direction of the structural body.

### Claim 3 (depends on 1)

The multilayer body according to claim 1, wherein the outer surface of the first region is lower than the outer surface of the second region in the height direction of the structural body.

### Claim 4 (depends on 1)

The multilayer body according to claim 1, wherein a resin film is between the portion of the step difference and the connection pad.

### Claim 5 (depends on 4)

The multilayer body according to claim 4, wherein the resin film includes multiple layers that are laminated.

### Claim 6 (depends on 1)

The multilayer body according to claim 1, wherein the connection pad includes a plurality of auxiliary structures provided thereon.

### Claim 7 (depends on 1)

The multilayer body according to claim 1, wherein
the multilayer body includes a plurality of the connection pads on the outer surface of the first region, the outer surface of the second region, and the step-difference surface; and
the first electronic component is mounted onto the structural body with the plurality of the connection pads interposed therebetween.

### Claim 8 (depends on 7)

The multilayer body according to claim 7, wherein
the multilayer body includes a plurality of the step-difference surfaces;
the structural body includes a first side surface and a second side surface opposite to each other;
the structural body includes a third side surface and a fourth side surface opposite to each other and extending in a direction connecting the first side surface and the second side surface to each other;
the plurality of the step-difference surfaces includes a first step-difference surface at at least one of a position at or adjacent to the first side surface and a position at or adjacent to the second side surface, and a second step-difference surface at at least one of a position at or adjacent to the third side surface and a position at or adjacent to the fourth side surface; and
the connection pads are on the first step-difference surface, the second step-difference surface or both of the first step-difference surface and the second step-difference surface.

### Claim 9 (depends on 1)

The multilayer body according to claim 1, wherein the structural body is made of resin.

### Claim 10 (depends on 1)

The multilayer body according to claim 1, wherein each of the first and second electronic components is an IC device including a semiconductor or a surface acoustic wave device including a piezoelectric substrate.

### Claim 11 (depends on 1)

The multilayer body according to claim 1, further comprising:
a circuit electrode on the outer surface of the structural body;
a terminal electrode on another surface of the structural body opposite to the outer surface; and
at least one penetrating electrode in the structural body electrically connecting the circuit electrode to the terminal electrode.

### Claim 12 (depends on 11)

The multilayer body according to claim 11, wherein the circuit electrode crosses the step-difference surface.

### Claim 13 (depends on 11)

The multilayer body according to claim 11, wherein the connection pad is on a surface of the circuit element.

### Claim 14 (depends on 1)

The multilayer body according to claim 1, wherein the solder bump straddles the first and second regions of the structural body.

### Claim 15 (depends on 4)

The multilayer body according to claim 4, wherein the resin film covers a corner between the step-difference surface and the outer surface structural body, and a corner between the step-difference surface and the outer surface of the first electronic component.

### Claim 16 (depends on 4)

The multilayer body according to claim 4, wherein the resin film include a slope portion.