# US 12,002,776 B2 · Interconnect structure and method for forming the same

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- Number: US 12,002,776 B2
- Document ID: US12002776B2
- Status: Granted
- Kind: B2
- Application number: 17/811,896
- Filed: 2022-07-12
- Published: 2022-10-27
- Granted: 2024-06-04
- Earliest claimed: 2019-08-29
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company Ltd.
- Inventors: Jung-Chou Tsai; Fong-Yuan Chang; Po-Hsiang Huang; Chin-Chou Liu; Yi-Kan Cheng
- Web page: https://patentgrep.com/patent/US12002776B2

## CPC

- H10W 20/43: Layouts of interconnections
- H10W 20/42: Vias, e.g. via plugs
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/635: {Through-vias}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 72/00: Interconnections or connectors in packages
- H10W 72/019: {of bond pads}
- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H10W 72/90: Bond pads, in general
- H10W 90/00: Package configurations
- H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/9445: {Top-view layouts, e.g. mirror arrays}
- H10W 80/312: {characterised by the direct bonding of electrically conductive pads}
- H10W 80/327: {characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers}
- H10W 90/794: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An interconnect structure includes a plurality of first pads arranged to form a first array and a plurality of second pads arranged to form a second array. Each of the first array has a first row, a second row and an mth row extending along a first direction and parallel to each other along a second direction. The first pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction. The second pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction. The interconnect structure further includes a plurality of first conductive lines, a plurality of second conductive lines and a plurality of nth conductive lines.

## Claims

### Claim 1

An interconnect structure comprising:
a plurality of first pads arranged to form a first array, wherein the first array has a first row, a second row and an mth row extending along a first direction and parallel to each other along a second direction, wherein the first pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction, m is an integer equal to or greater than 2, and n is an integer equal to or greater than 2;
a plurality of second pads arranged to form a second array, wherein the second array has a first row, a second row and an mth row extending along the first direction and parallel with each other along the second direction, wherein the second pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction; and
a plurality of first conductive lines disposed in a first layer, a plurality of second conductive lines disposed in a second layer and a plurality of nth conductive lines disposed in an nth layer, wherein the first layer, the second layer and the nth layer are stacked to form a multi-layered structure,
wherein the first pads and the second pads are disposed over the first layer, the second layer and the nth layer,
wherein each of the first pads in the first row in the first group of the first array is electrically connected to one of the second pads in the first row in the first group of the second array by one of the first conductive lines in the first layer, the first pads in the first row in the first group of the first array are electrically isolated from the first pads in other rows in the first group of the first array, and the second pads in the first row in the first group of the second array are electrically isolated from the second pads in other rows in the first group of the second array,
wherein each of the first pads in the second row in the first group of the first array is electrically connected to one of the second pads in the second row in the first group of the second array by one of the first conductive lines in the first layer, the first pads in the second row in the first group of the first array are electrically isolated from the first pads in other rows in the first group of the first array, and the second pads in the second row in the first group of the second array are electrically isolated from the second pads in other rows in the first group of the second array, and
wherein each of the first pads in the mth row in the first group of the first array is electrically connected to one of the second pads in the mth row in the first group of the second array by one of the first conductive lines in the first layer, the first pads in the mth row in the first group of the first array are electrically isolated from the first pads in other rows in the first group of the first array, and the second pads in the mth row in the first group of the second array are electrically isolated from the second pads in other rows in the first group of the second array.

### Claim 2 (depends on 1)

The interconnect structure of claim 1, wherein:
each of the first pads in the first row in the second group of the first array is electrically connected to one of the second pads in the first row in the second group of the second array by one of the second conductive lines in the second layer,
each of the first pads in the second row in the second group of the first array is electrically connected to one of the second pads in the second row in the second group of the second array by one of the second conductive lines in the second layer, and
each of the first pads in the mth row in the second group of the first array is electrically connected to one of the second pads in the mth row in the second group of the second array by one of the second conductive lines in the second layer.

### Claim 3 (depends on 1)

The interconnect structure of claim 1, wherein:
each of the first pads in the first row in the nth group of the first array is electrically connected to one of the second pads in the first row in the nth group of the second array by one of the nth conductive lines in the nth layer,
each of the first pads in the second row in the nth group of the first array is electrically connected to one of the second pads in the second row in the nth group of the second array by one of the nth conductive lines in the nth layer, and
each of the first pads in the mth row in the nth group of the first array is electrically connected to one of the second pads in the mth row in the nth group of the second array by one of the nth conductive lines in the nth layer.

### Claim 4 (depends on 1)

The interconnect structure of claim 1, wherein the first pads in adjacent rows are separated from each other by a first vertical distance, the second pads in adjacent rows are separated from each other by a second vertical distance, and a sum of widths of the first conductive lines electrically connecting the first pads and the second pads in the same row is less than the first vertical distance and the second vertical distance, a sum of widths of the second conductive lines electrically connecting the first pads and the second pads in the same row is less than the first vertical distance and the second vertical distance, and a sum of widths of the nth conductive lines electrically connecting the first pads and the second pads in the same row is less than the first vertical distance and the second vertical distance.

### Claim 5 (depends on 1)

The interconnect structure of claim 1, wherein at least one of the first pads is adjacent to one of the second pads, and the at least one of the first pads is separated from the adjacent second pad by a horizontal distance, wherein the sum of widths of the first conductive lines electrically connecting the first pads and the second pads in the same row is less than the horizontal distance, the sum of widths of the second conductive lines electrically connecting the first pads and the second pads in the same row is less than the horizontal distance, and the sum of widths of the nth conductive lines electrically connecting the first pads and the second pads in the same row is less than the horizontal distance.

### Claim 6 (depends on 1)

The interconnect structure of claim 1, wherein the second layer is disposed over the first layer, and the nth layer is disposed over an (n−1)th layer.

### Claim 7 (depends on 1)

The interconnect structure of claim 1, wherein the second layer is disposed under the first layer, and the nth layer is disposed under an (n−1)th layer.

### Claim 8 (depends on 1)

The interconnect structure of claim 1, further comprising:
a plurality of first conductive pillars electrically connecting one of the first pads in the first row in the first group of the first array to one of the first conductive lines and to one of the second pads in the first row in the first group of the second array, electrically connecting one of the first pads in the second row in the first group of the first array to one of the first conductive lines and to one of the second pads in the second row in the first group of the second array, and electrically connecting one of the first pads in the mth row in the first group of the first array to one of the first conductive lines and to one of the second pads in the mth row in the first group of the second array;
a plurality of second conductive pillars electrically connecting one of the first pads in the first row in the second group of the first array to one of the second conductive lines and to one of the second pads in the first row in the second group of the second array, electrically connecting one of the first pads in the second row in the second group of the first array to one of the second conductive lines and to one of the second pads in the second row in the second group of the second array, and electrically connecting one of the first pads in the mth row in the second group of the first array to one of the second conductive lines and to one of the second pads in the mth row in the second group of the second array; and
a plurality of nth conductive pillars electrically connecting one of the first pads in the first row in the nth group of the first array to one of the nth conductive lines and to one of the second pads in the first row in the nth group of the second array, electrically connecting one of the first pads in the second row in the nth group of the first array to one of the nth conductive lines and to one of the second pads in the second row in the nth group of the second array, and electrically connecting one of the first pads in the mth row in the nth group of the first array to one of the nth conductive lines and to one of the second pads in the mth row in the nth group of the second array,
wherein the first conductive pillars include a first functional portion, the second conductive pillars include a second functional portion, the nth conductive pillars include an nth functional portion, a height of the first functional portion, a height of the second functional portion and a height of the nth functional portion are different from each other.

### Claim 9 (depends on 1)

The interconnect structure of claim 1, wherein at least one of the first pads comprises a subsidiary line extending along a third direction, and the third direction is different from the first direction and the second direction.

### Claim 10

An interconnect structure comprising:
a plurality of first pads arranged to form a first array, wherein the first array has a first row, a second row and an mth row extending along a first direction and parallel to each other along a second direction, wherein the first pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction, m is an integer equal to or greater than 2, and n is an integer equal to or greater than 2;
a plurality of second pads arranged to form a second array, wherein the second array has a first row, a second row and an mth row extending along the first direction and parallel with each other along the second direction, wherein the second pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction; and
a plurality of first conductive lines disposed in a first layer, a plurality of second conductive lines disposed in a second layer and a plurality of nth conductive lines disposed in an nth layer, wherein the first layer, the second layer and the nth layer are stacked to form a multi-layered structure,
wherein the first pads and the second pads are disposed over the first layer, the second layer and the nth layer,
wherein each of the first pads in the first row in the first group of the first array is electrically connected to one of the second pads in the first row in the first group of the second array by one of the first conductive lines in the first layer and electrically isolated from the second pads in the second group and the nth group, the first pads in the first row in the first group of the first array are electrically isolated from the first pads in other rows in the first group of the first array, and the second pads in the first row in the first group of the second array are electrically isolated from the second pads in other rows in the first group of the second array,
wherein each of the first pads in the second row in the first group of the first array is electrically connected to one of the second pads in the second row in the first group of the second array by one of the first conductive lines in the first layer and electrically isolated from the second pads in the second group and the nth group, the first pads in the second row in the first group of the first array are electrically isolated from the first pads in other rows in the first group of the first array, and the second pads in the second row in the first group of the second array are electrically isolated from the second pads in other rows in the first group of the second array, and
wherein each of the first pads in the mth row in the first group of the first array is electrically connected to one of the second pads in the mth row in the first group of the second array by one of the first conductive lines in the first layer and electrically isolated from the second pads in the second group and the nth group, the first pads in the mth row in the first group of the first array are electrically isolated from the first pads in other rows in the first group of the first array, and the second pads in the mth row in the first group of the second array are electrically isolated from the second pads in other rows in the first group of the second array.

### Claim 11 (depends on 10)

The interconnect structure of claim 10, wherein:
each of the first pads in the first row in the second group of the first array is electrically connected to one of the second pads in the first row in the second group of the second array by one of the second conductive lines in the second layer and electrically isolated from the second pads in the first group and the nth group,
each of the first pads in the second row in the second group of the first array is electrically connected to one of the second pads in the second row in the second group of the second array by one of the second conductive lines in the second layer and electrically isolated from the second pads in the first group and the nth group, and
each of the first pads in the mth row in the second group of the first array is electrically connected to one of the second pads in the mth row in the second group of the second array by one of the second conductive lines in the second layer and electrically isolated from the second pads in the first group and the nth group.

### Claim 12 (depends on 10)

The interconnect structure of claim 10, wherein:
each of the first pads in the first row in the nth group of the first array is electrically connected to one of the second pads in the first row in the nth group of the second array by one of the nth conductive lines in the nth layer,
each of the first pads in the second row in the nth group of the first array is electrically connected to one of the second pads in the second row in the nth group of the second array by one of the nth conductive lines in the nth layer, and
each of the first pads in the mth row in the nth group of the first array is electrically connected to one of the second pads in the mth row in the nth group of the second array by one of the nth conductive lines in the nth layer.

### Claim 13 (depends on 10)

The interconnect structure of claim 10, wherein the first pads in adjacent rows are separated from each other by a first vertical distance, the second pads in adjacent rows are separated from each other by a second vertical distance, and a sum of widths of the first conductive lines electrically connecting the first pads and the second pads in the same row is less than the first vertical distance and the second vertical distance, a sum of widths of the second conductive lines electrically connecting the first pads and the second pads in the same row is less than the first vertical distance and the second vertical distance, and a sum of widths of the nth conductive lines electrically connecting the first pads and the second pads in the same row is less than the first vertical distance and the second vertical distance.

### Claim 14 (depends on 10)

The interconnect structure of claim 10, wherein at least one of the first pads is adjacent to one of the second pads, and the at least one of the first pads is separated from the adjacent second pad by a horizontal distance, wherein the sum of widths of the first conductive lines electrically connecting the first pads and the second pads in the same row is less than the horizontal distance, the sum of widths of the second conductive lines electrically connecting the first pads and the second pads in the same row is less than the horizontal distance, and the sum of widths of the nth conductive lines electrically connecting the first pads and the second pads in the same row is less than the horizontal distance.

### Claim 15 (depends on 10)

The interconnect structure of claim 10, wherein the second layer is
disposed under the first layer, and the nth layer is disposed under an (n−1)th layer.

### Claim 16 (depends on 10)

The interconnect structure of claim 10, further comprising:
a plurality of first conductive pillars electrically connecting one of the first pads in the first row in the first group of the first array to one of the first conductive lines and to one of the second pads in the first row in the first group of the second array, electrically connecting one of the first pads in the second row in the first group of the first array to one of the first conductive lines and to one of the second pads in the second row in the first group of the second array, and electrically connecting one of the first pads in the mth row in the first group of the first array to one of the first conductive lines and to one of the second pads in the mth row in the first group of the second array;
a plurality of second conductive pillars electrically connecting one of the first pads in the first row in the second group of the first array to one of the second conductive lines and to one of the second pads in the first row in the second group of the second array, electrically connecting one of the first pads in the second row in the second group of the first array to one of the second conductive lines and to one of the second pads in the second row in the second group of the second array, and electrically connecting one of the first pads in the mth row in the second group of the first array to one of the second conductive lines and to one of the second pads in the mth row in the second group of the second array; and
a plurality of nth conductive pillars electrically connecting one of the first pads in the first row in the nth group of the first array to one of the nth conductive lines and to one of the second pads in the first row in the nth group of the second array, electrically connecting one of the first pads in the second row in the nth group of the first array to one of the nth conductive lines and to one of the second pads in the second row in the nth group of the second array, and electrically connecting one of the first pads in the mth row in the nth group of the first array to one of the nth conductive lines and to one of the second pads in the mth row in the nth group of the second array,
wherein the first conductive pillars include a first functional portion, the second conductive pillars include a second functional portion, the nth conductive pillars include an nth functional portion, a height of the first functional portion, a height of the second functional portion and a height of the nth functional portion are different from each other.

### Claim 17 (depends on 16)

The interconnect structure of claim 16, wherein at least one of the first pads comprises a subsidiary line extending along a third direction, and the third direction is different from the first direction and the second direction.

### Claim 18

An interconnect structure comprising:
a plurality of first pads arranged to form a first array in a first layer, a second layer and an nth layer, wherein each of the first arrays has a first row, a second row and an mth row extending along a first direction and parallel to each other along a second direction, wherein the first pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction, m is an integer equal to or greater than 2, and n is an integer equal to or greater than 2;
a plurality of second pads arranged to form a second array in the first layer, the second layer and the nth layer, wherein each of the second arrays has a first row, a second row and an mth row extending along the first direction and parallel with each other along the second direction, wherein the second pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction; and
a plurality of first conductive lines disposed in the first layer, a plurality of second conductive lines disposed in the second layer and a plurality of nth conductive lines disposed in the nth layer, wherein the first layer, the second layer and the nth layer are stacked to form a multi-layer,
wherein the first pads in adjacent rows in each of the first arrays in each of the first layer, the second layer and the nth layer are separated from each other by a first vertical distance, the second pads in adjacent rows in each of the second arrays in each of the first layer, the second layer and the nth layer are separated from each other by a second vertical distance,
wherein a sum of widths of the first conductive lines electrically connecting the first pads and the second pads in the same row in the first layer is less than the first vertical distance and the second vertical distance from a plan view, a sum of widths of the second conductive lines electrically connecting the first pads and the second pads in the same row in the second layer is less than the first vertical distance and the second vertical distance from the plan view, and a sum of widths of the nth conductive lines electrically connecting the first pads and the second pads in the same row in the nth layer is less than the first vertical distance and the second vertical distanced structure from the plan view.

### Claim 19 (depends on 18)

The interconnect structure of claim 18, wherein at least one of the first pads is adjacent to one of the second pads, and the at least one of the first pads is separated from the adjacent second pad by a horizontal distance, wherein the sum of widths of the first conductive lines electrically connecting the first pads and the second pads in the same row is less than the horizontal distance, the sum of widths of the second conductive lines electrically connecting the first pads and the second pads in the same row is less than the horizontal distance, and the sum of widths of the nth conductive lines electrically connecting the first pads and the second pads in the same row is less than the horizontal distance.

### Claim 20 (depends on 18)

The interconnect structure of claim 18, wherein:
each of the first pads in the first row in the first group of the first array is electrically connected to one of the second pads in the first row in the first group of the second array by one of the first conductive lines in the first layer and electrically isolated from the second pads in the second group and the nth group in the first layer,
each of the first pads in the second row in the first group of the first array is electrically connected to one of the second pads in the second row in the first group of the second array by one of the first conductive lines in the first layer and electrically isolated from the second pads in the second group and the nth group in the first layer, and
each of the first pads in the mth row in the first group of the first array is electrically connected to one of the second pads in the mth row in the first group of the second array by one of the first conductive lines in the first layer and electrically isolated from the second pads in the second group and the nth group in the first layer.