# US 12,002,775 B2 · Electronic device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,002,775 B2
- Document ID: US12002775B2
- Status: Granted
- Kind: B2
- Application number: 17/956,029
- Filed: 2022-09-29
- Published: 2023-01-26
- Granted: 2024-06-04
- Earliest claimed: 2021-01-12
- Assignees: Innolux Corporation
- Applicants: Innolux Corporation
- Inventors: Maggy Hsu; Pierre Chen
- Web page: https://patentgrep.com/patent/US12002775B2

## CPC

- H10W 72/30: Die-attach connectors
- H10W 72/90: Bond pads, in general
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/234: {Cross-sectional shape, i.e. in side view}
- H10W 72/242: {relative to the surface, e.g. recessed, protruding}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/931: {Shapes of bond pads}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/934: {Cross-sectional shape, i.e. in side view}
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic device is provided. The electronic device includes a substrate including an active region and a border region adjacent to the active region. The electronic device includes a plurality of pixels disposed in the active region. The electronic device includes a conductive structure disposed in the border region and including a first conductive layer, a second conductive layer, and a third conductive layer disposed between the first conductive layer and the second conductive layer, wherein the third conductive layer overlaps with a part of the first conductive layer and overlaps a part of the second conductive layer. The electronic device includes an insulating layer disposed between the first conductive layer and the second conductive layer, and the insulating layer has a first opening and a second opening through which the first conductive layer and the second conductive layer are electrically connected with each other.

## Claims

### Claim 1

An electronic device, comprising:
a substrate, comprising an active region and a border region adjacent to the active region,
a plurality of pixels disposed in the active region;
a conductive structure disposed in the border region, comprising:
a first conductive layer;
a second conductive layer;
a third conductive layer disposed between the first conductive layer and the second conductive layer, wherein the third conductive layer overlaps with a part of the first conductive layer and overlaps a part of the second conductive layer; and
an insulating layer disposed between the first conductive layer and the second conductive layer, and having a first opening and a second opening through which the first conductive layer and the second conductive layer are electrically connected with each other.

### Claim 2 (depends on 1)

The electronic device as claimed in claim 1, wherein the first conductive layer comprises metal.

### Claim 3 (depends on 1)

The electronic device as claimed in claim 1, wherein the second conductive layer is transparent.

### Claim 4 (depends on 1)

The electronic device as claimed in claim 1, wherein from a top view, an edge of the first opening has a curved shape.

### Claim 5 (depends on 1)

The electronic device as claimed in claim 1, wherein the insulating layer comprises a partition disposed between the first opening and the second opening, and a top surface of the partition and a bottom surface of the partition have different widths.

### Claim 6 (depends on 1)

The electronic device as claimed in claim 1, wherein one of the plurality of pixels is electrically connected to the conductive structure.

### Claim 7 (depends on 1)

The electronic device as claimed in claim 1, wherein the electronic device is a display device.

### Claim 8 (depends on 1)

The electronic device as claimed in claim 1, wherein the electronic device is a liquid crystal device.

### Claim 9 (depends on 1)

The electronic device as claimed in claim 1, wherein the electronic device is an organic light-emitting diode device.