# US 12,002,770 B2 · Power management semiconductor package and manufacturing method thereof

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,002,770 B2
- Document ID: US12002770B2
- Status: Granted
- Kind: B2
- Application number: 16/787,644
- Filed: 2020-02-11
- Published: 2021-08-12
- Granted: 2024-06-04
- Earliest claimed: 2020-02-11
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company Ltd.
- Inventors: Ying-Chih Hsu; Wen-Shiang Liao
- Web page: https://patentgrep.com/patent/US12002770B2

## CPC

- H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)}
- H01F 17/0033: {with the coil helically wound around a magnetic core}
- H01F 41/046: {structurally combined with ferromagnetic material}
- H10D 1/20: Inductors
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 20/44: Conductive materials thereof
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/635: {Through-vias}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 74/016: {using moulds}
- H10W 74/10: characterised by their shape or disposition
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers}
- H10P 72/7436: {used to support a device or a wafer when forming electrical connections thereto}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/685: comprising multiple insulating layers
- H10W 72/073: {of die-attach connectors}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/874: {On different surfaces}
- H10W 72/9413: {on encapsulations}
- H10W 74/014: {using batch processing}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 90/00: Package configurations
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A package includes first and second redistribution structures, a die, a permalloy structure, a molding material and a plurality of through vias. The first redistribution structure includes a first metal pattern. The die is disposed over the first redistribution structure. The molding material is disposed over the first redistribution structure and surrounds the die and the permalloy structure. The second redistribution structure is disposed over the die, the permalloy structure and the molding material, and includes a second metal pattern. The through vias penetrate the molding material and connects the first metal pattern to the second metal pattern. The permalloy structure includes a first member and a second member isolated from the first member, the first member and the second member are surrounded by the plurality of through vias and sandwiched between the first metal pattern and the second metal pattern. A method for forming a package is also provided.

## Claims

### Claim 1

A package, comprising:
a first redistribution structure, including a first metal pattern and a dielectric layer covering the first metal pattern, wherein the first metal pattern is separated from a top surface of the first redistribution structure by the dielectric layer;
a die, disposed on the top surface of the first redistribution structure;
a permalloy structure, disposed on the top surface of the first redistribution structure;
a molding material, disposed over the first redistribution structure and surrounding the die and the permalloy structure;
a second redistribution structure, disposed over the die, the permalloy structure and the molding material, and including a second metal pattern; and
a plurality of through vias, penetrating the molding material and the top surface of the first redistribution structure, and connecting the first metal pattern to the second metal pattern,
wherein the permalloy structure includes a first member and a second member isolated from the first member, the first member and the second member are surrounded by the plurality of through vias and sandwiched between the first metal pattern and the second metal pattern, and the first member elongates substantially in parallel to a side of the die from a top view perspective.

### Claim 2 (depends on 1)

The package of claim 1, wherein the permalloy structure comprises nickel (Ni), iron (Fe), cobalt (Co), molybdenum (Mo), silicon (Si), niobium (Nb), boron (B), or a combination thereof.

### Claim 3 (depends on 1)

The package of claim 1, wherein a magnetic permeability (μm) of the permalloy structure is between 500 and 1,000,000.

### Claim 4 (depends on 1)

The package of claim 1, wherein the first member or the second member of the permalloy structure has a straight bar configuration from the top view perspective.

### Claim 5 (depends on 1)

The package of claim 1, wherein a width of the first member and a width of the second member are respectively in a range of 5-50 micrometers.

### Claim 6 (depends on 1)

The package of claim 1, wherein the first member and the second member are elongated laterally over the first redistribution structure.

### Claim 7 (depends on 6)

The package of claim 6, wherein the first member and the second member are elongated parallel to each other.

### Claim 8 (depends on 1)

The package of claim 1, further comprising an adhesive layer disposed between the permalloy structure and the first redistribution structure.

### Claim 9

A package, comprising:
a first redistribution structure;
a second redistribution structure;
a molding structure, disposed between the first redistribution structure and the second redistribution structure;
a die, encapsulated in the molding structure; and
a first inductor, disposed between the first redistribution structure and the second redistribution structure and adjacent to a first side wall of the die, and comprising:
a first permalloy core, disposed in the molding structure; and
a first coil structure, winding the first permalloy core, extending through the molding structure and at least partially disposed within the first redistribution structure and the second redistribution structure, wherein the first permalloy core elongates substantially in parallel to a side of the die from a top view perspective, the first coil structure includes a plurality first conductive lines disposed below the first permalloy core and within the first redistribution structure, and the plurality of first conductive lines are separated from a top surface of the first redistribution structure.

### Claim 10 (depends on 9)

The package of claim 9, wherein the first coil structure comprises:
a plurality of first vias, penetrating the molding structure and disposed on two opposite sides of the first permalloy core, wherein each of the plurality of first vias includes an upper portion disposed in the molding structure and a lower portion disposed in the dielectric layer, and a width of the upper portion is greater than a width of the lower portion;
the plurality of first conductive lines, extending across the first permalloy core; and
a plurality of second conductive lines, disposed in the second redistribution structure and extending across the first permalloy core.

### Claim 11 (depends on 9)

The package of claim 9, further comprises:
a second inductor, disposed between the first redistribution structure and the second redistribution structure and adjacent to a second sidewall of the die.

### Claim 12 (depends on 11)

The package of claim 11, wherein the first inductor is separated from the second inductor, and the first sidewall is opposite to the second sidewall.

### Claim 13 (depends on 11)

The package of claim 11, wherein the first inductor is separated from the second inductor, and the first sidewall is adjacent to the second sidewall.

### Claim 14 (depends on 11)

The package of claim 11, wherein the second inductor comprises:
a second permalloy core, disposed in the molding structure; and
a second coil structure, winding the second permalloy core.

### Claim 15 (depends on 11)

The package of claim 11, wherein the second inductor and the first inductor are substantially symmetrical with respect to the die.

### Claim 16 (depends on 11)

The package of claim 11, wherein the second permalloy core has a length different from a length of the first permalloy core.

### Claim 17 (depends on 11)

The package of claim 11, wherein the second inductor is separated from the first inductor by the molding structure.

### Claim 18 (depends on 11)

The package of claim 11, further comprises:
a third inductor, disposed between the first redistribution structure and the second redistribution structure and separated from the first inductor and the second inductor by the molding structure.

### Claim 19

A package, comprising:
a first dielectric layer;
a first conductive structure, disposed in and covered by the first dielectric layer, wherein a top surface of the first conductive structure is below a top surface of the first dielectric layer;
a die, disposed over the first dielectric layer;
a permalloy core, disposed over the first dielectric layer and adjacent to the die;
a first via, disposed between the die and the permalloy core, wherein the first via penetrates an upper portion of the first dielectric layer above the first conductive structure and connects the first conductive structure;
a second via, disposed opposite to the first via with respect to the permalloy core, wherein the second via penetrates the upper portion of the first dielectric structure and connects the first conductive structure;
a second dielectric layer, disposed over the first via, the second via and the permalloy core; and
a second conductive structure, disposed in the second dielectric layer and electrically connecting the first via and the second via, wherein the first via, the second via, and the second conductive structure are separated from the permalloy core.

### Claim 20 (depends on 19)

The package of claim 19, wherein the permalloy core is attached to a surface of the first dielectric layer, and the first via and the second via penetrate the surface of the first dielectric layer.