# US 12,002,762 B2 · High density organic bridge device and method

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- Number: US 12,002,762 B2
- Document ID: US12002762B2
- Status: Granted
- Kind: B2
- Application number: 16/889,190
- Filed: 2020-06-01
- Published: 2020-09-17
- Granted: 2024-06-04
- Earliest claimed: 2012-12-20
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Mihir K Roy; Stefanie M Lotz; Wei-Lun Kane Jen
- Web page: https://patentgrep.com/patent/US12002762B2

## CPC

- H10W 70/65: Shapes or dispositions of interconnections
- H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)}
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/095: {of vias therein}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/618: {the bridge chips being embedded in the package substrates, interposers or redistribution layers}
- H10W 70/635: {Through-vias}
- H10W 70/66: Conductive materials thereof
- H10W 70/68: Shapes or dispositions thereof
- H10W 70/685: comprising multiple insulating layers
- H10W 70/69: Insulating materials thereof
- H10W 70/695: Organic materials
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 1/0313: {Organic insulating material}
- H05K 1/142: {Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit}
- H05K 1/181: associated with surface mounted components
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 3/467: {Adding a circuit layer by thin film methods (H05K3/4647 takes precedence)}
- H05K 2201/048: Second PCB mounted on first PCB by inserting in window or holes of the first PCB
- H05K 2201/049: PCB for one component, e.g. for mounting onto mother PCB
- H05K 2201/10522: Adjacent components
- H05K 2201/10674: Flip chip
- H05K 2203/016: Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10W 70/63: Vias, e.g. via plugs
- H10W 72/072: {of bump connectors}
- H10W 72/07232: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07252: {changes in structures or sizes}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

## Claims

### Claim 1

A microelectronic package, comprising:
a first die;
a second die;
an organic polymer interconnect bridge electrically coupled between an edge of the first die and an edge of the second die, wherein an organic polymer in the organic polymer interconnect bridge electrically separates two or more conductive paths that directly connect the first die to the second die.

### Claim 2 (depends on 1)

The microelectronic package of claim 1, wherein the organic polymer interconnect bridge includes one or more spin-on-glass dielectric layers.

### Claim 3 (depends on 1)

The microelectronic package of claim 1, wherein the organic polymer interconnect bridge includes multiple conductor layers.

### Claim 4 (depends on 1)

The microelectronic package of claim 1, wherein a wire width in the organic polymer interconnect bridge is 3 μm or less.

### Claim 5 (depends on 1)

The microelectronic package of claim 1, wherein a wire width in the organic polymer interconnect bridge includes a region of 3 μm or less width and a region of 10 μm or less width.

### Claim 6 (depends on 1)

The microelectronic package of claim 1, wherein the organic polymer interconnect bridge is 15 μm or less in thickness.

### Claim 7

A microelectronic package, comprising:
a first die coupled to a substrate;
a second die coupled to the substrate adjacent to the first die;
an organic polymer interconnect bridge located beneath the first and second die, and above the substrate, wherein an organic polymer in the organic polymer interconnect bridge electrically separates two or more conductive paths that directly connect the first die to the second die, the organic polymer bridge electrically coupled between an edge of the first die and an edge of the second die.

### Claim 8 (depends on 7)

The microelectronic package of claim 7, wherein the organic polymer interconnect bridge is incorporated into a solder mask cavity on a surface layer of the substrate.

### Claim 9 (depends on 7)

The microelectronic package of claim 7, wherein the organic polymer interconnect bridge includes one or more spin-on-glass dielectric layers.

### Claim 10 (depends on 7)

The microelectronic package of claim 7, wherein the organic polymer interconnect bridge includes multiple conductor layers.

### Claim 11 (depends on 7)

The microelectronic package of claim 7, wherein a wire width in the organic polymer interconnect bridge is 3 μm or less.

### Claim 12 (depends on 7)

The microelectronic package of claim 7, wherein a wire width in the organic polymer interconnect bridge includes a region of 3 μm or less width and a region of 10 μm or less width.

### Claim 13

A microelectronic package, comprising:
a first die coupled to a substrate;
a second die coupled to the substrate adjacent to the first die;
an organic polymer interconnect bridge at least partially embedded in the substrate, wherein an organic polymer in the organic polymer interconnect bridge electrically separates two or more conductive paths that directly connect the first die to the second die, the organic polymer bridge electrically coupled between an edge of the first die and an edge of the second die.

### Claim 14 (depends on 13)

The microelectronic package of claim 13, further including a bonding layer between the organic polymer interconnect bridge and the substrate.

### Claim 15 (depends on 13)

The microelectronic package of claim 13, wherein the organic polymer interconnect bridge includes one or more spin-on-glass dielectric layers.

### Claim 16 (depends on 13)

The microelectronic package of claim 13, wherein the organic polymer interconnect bridge includes multiple conductor layers.

### Claim 17 (depends on 13)

The microelectronic package of claim 13, wherein a wire width in the organic polymer interconnect bridge is 3 μm or less.

### Claim 18 (depends on 13)

The microelectronic package of claim 13, wherein a wire width in the organic polymer interconnect bridge includes a region of 3 μm or less width and a region of 10 μm or less width.

### Claim 19 (depends on 13)

The microelectronic package of claim 13, wherein the organic polymer interconnect bridge is 15 μm or less in thickness.