# US 12,002,751 B2 · Adjustment method and device for chip output characteristics > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,751 B2 - Document ID: US12002751B2 - Status: Granted - Kind: B2 - Application number: 17/446,616 - Filed: 2021-08-31 - Published: 2022-05-05 - Granted: 2024-06-04 - Earliest claimed: 2020-10-29 - Assignees: Changxin Memory Technologies, Inc. - Applicants: Changxin Memory Technologies, Inc. - Inventors: Liang Chen; Yangyang Yin; Bohong Chen - Web page: https://patentgrep.com/patent/US12002751B2 ## CPC - H10W 20/493: {Fuses, i.e. interconnections changeable from conductive to non-conductive} - G01R 31/26: Testing of individual semiconductor devices (testing of photovoltaic devices H02S50/10; testing or measuring during manufacture or treatment {H10P74/00}) - G01R 31/28: Testing of electronic circuits, e.g. by signal tracer ({EMC, EMP or similar testing of electronic circuits G01R31/002;} testing for short-circuits, discontinuities, leakage or incorrect line connection G01R31/50; checking computers {or computer components} G06F11/00; checking static stores for correct operation G11C29/00 {; testing receivers or transmitters of transmission systems H04B17/00}) - G01R 31/2851: {Testing of integrated circuits [IC] (G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801)} - G01R 31/74: Testing of fuses - Y02D 10/00: Energy efficient computing, e.g. low power processors, power management or thermal management - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - Y02D: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE ## Abstract An adjustment method for the chip output characteristics can include the following steps. When adjusting the output characteristics of the chip to be tested, first it is determined whether the output characteristics of the chip to be tested have been adjusted according to the state of each E-fuse. When determining that the output characteristics of the chip to be tested have not been adjusted, the target adjustment solution corresponding to the chip is determined among a plurality of adjustment solutions in a targeted manner according to the output performance of the chip to be tested. The E-fuse in the chip to be tested is subjected to blowing treatment according to the target adjustment solution, so as to adjust the output characteristics of the chip to be tested. ## Claims ### Claim 1 An adjustment method for chip output characteristics, comprising: detecting a state of each of a plurality of Electrically Programmable Fuses (E-fuses) in a chip to be tested; determining a target adjustment solution corresponding to the chip among a plurality of adjustment solutions according to an output performance of the chip to be tested when detecting that no E-fuse is blown; determining a target E-fuse corresponding to the target adjustment solution among the plurality of E-fuses in the chip to be tested according to a mapping relationship between the adjustment solution and the target E-fuse; and blowing the target E-fuse and closing other E-fuses other than the target E-fuse among the plurality of E-fuses in the chip to be tested, so as to adjust an output characteristics of the chip to be tested. ### Claim 2 (depends on 1) The method of claim 1, wherein the output performance is two groups of data description output by a clock signal, and said determining the target adjustment solution corresponding to the chip in the plurality of adjustment solutions according to the output performance of the chip to be tested comprises: respectively calculating absolute differences of the two groups of data of the chip to be tested by adopting the plurality of adjustment solutions; and determining the target adjustment solution corresponding to the chip to be tested in the plurality of adjustment solutions according to the plurality of absolute differences. ### Claim 3 (depends on 2) The method of claim 2, wherein said determining the target adjustment solution corresponding to the chip to be tested in the plurality of adjustment solutions according to the plurality of absolute differences comprises: determining the minimum absolute difference in the plurality of absolute differences; and determining the adjustment solution corresponding to the minimum absolute difference as the target adjustment solution corresponding to the chip to be tested. ### Claim 4 (depends on 1) The method of claim 1, further comprising: turning off the chip to be tested when detecting at least one E-fuse in the chip is blown. ### Claim 5 (depends on 1) The method of claim 1, wherein after said blowing the E-fuse in the chip to be tested according to the target adjustment solution, the method further comprises: detecting the state of each E-fuse in the chip to be tested again; and detecting a blowing result of the E-fuse according to the state of each E-fuse. ### Claim 6 (depends on 1) The method of claim 1, further comprising: testing the initial output characteristics of the chip to be tested, and the initial output characteristics being obtained by testing before the E-fuse in the chip to be tested being subjected to blowing treatment; and comparing the initial output characteristics with the output characteristics of the adjusted chip to be tested, so as to determine the adjustment effect. ### Claim 7 (depends on 1) The method of claim 1, wherein after said blowing the E-fuse in the chip to be tested according to the target adjustment solution, the method further comprises: recovering the output characteristics of the chip to be tested to the initial output characteristics before the blowing treatment. ### Claim 8 (depends on 1) An adjustment device for chip output characteristics, comprising a memory and a processor, wherein the memory is configured to store a computer program; and the processor is configured to read the computer program stored in the memory, and to execute the method claim 1. ### Claim 9 (depends on 8) The adjustment device of claim 8, wherein the output performance is two groups of data description output by a clock signal, and said determining the target adjustment solution corresponding to the chip in the plurality of adjustment solutions according to the output performance of the chip to be tested comprises: respectively calculating absolute differences of the two groups of data of the chip to be tested by adopting the plurality of adjustment solutions; and determining the target adjustment solution corresponding to the chip to be tested in the plurality of adjustment solutions according to the plurality of absolute differences. ### Claim 10 (depends on 9) The adjustment device of claim 9, wherein said determining the target adjustment solution corresponding to the chip to be tested in the plurality of adjustment solutions according to the plurality of absolute differences comprises: determining the minimum absolute difference in the plurality of absolute differences; and determining the adjustment solution corresponding to the minimum absolute difference as the target adjustment solution corresponding to the chip to be tested. ### Claim 11 (depends on 8) The adjustment device of claim 8, wherein the method further comprises: turning off the chip to be tested when detecting at least one E-fuse in the chip is blown. ### Claim 12 (depends on 8) The adjustment device of claim 8, wherein the method further comprises: detecting the state of each E-fuse in the chip to be tested again; and detecting a blowing result of the E-fuse according to the state of each E-fuse. ### Claim 13 (depends on 8) The adjustment device of claim 8, wherein the method further comprises: testing the initial output characteristics of the chip to be tested, and the initial output characteristics being obtained by testing before the E-fuse in the chip to be tested being subjected to blowing treatment; and comparing the initial output characteristics with the output characteristics of the adjusted chip to be tested, so as to determine the adjustment effect. ### Claim 14 (depends on 8) The adjustment device of claim 8, wherein the method further comprises: recovering the output characteristics of the chip to be tested to the initial output characteristics before the blowing treatment. ### Claim 15 An adjustment device for chip output characteristics, comprising: a detector, which is configured to detect the state of each of a plurality of E-fuses in a chip to be tested; and a processor configured to determine a target adjustment solution corresponding to the chip among a plurality of adjustment solutions according to the output performance of the chip to be tested if detecting that no E-fuse is blown; perform blowing treatment on one of the plurality of E-fuses in the chip to be tested according to the target adjustment solution, so as to adjust the output characteristics of the chip to be tested; and recover the output characteristics of the chip to be tested to the initial output characteristics before the blowing treatment. ### Claim 16 An adjustment method for chip output characteristics, comprising: detecting a state of each of a plurality of Electrically Programmable Fuses (E-fuses) in a chip to be tested; determining a target adjustment solution corresponding to the chip among a plurality of adjustment solutions according to an output performance of the chip to be tested when detecting that no E-fuse is blown; and performing blowing treatment on one of the plurality of E-fuses in the chip to be tested according to the target adjustment solution, so as to adjust an output characteristics of the chip to be tested; wherein the output performance is two groups of data description output by a clock signal, and said determining the target adjustment solution corresponding to the chip in the plurality of adjustment solutions according to the output performance of the chip to be tested comprises: respectively calculating absolute differences of the two groups of data of the chip to be tested by adopting the plurality of adjustment solutions; and determining the target adjustment solution corresponding to the chip to be tested in the plurality of adjustment solutions according to the plurality of absolute differences. ### Claim 17 (depends on 16) The method of claim 16, wherein said performing blowing treatment on the E-fuse in the chip to be tested among the plurality of E-fuses according to the target adjustment solution comprises: determining a target E-fuse corresponding to the target adjustment solution among the plurality of E-fuses in the chip to be tested according to a mapping relationship between the adjustment solution and the E-fuse; blowing the target E-fuse and closing other E-fuses other than the target E-fuse among the plurality of E-fuses in the chip to be tested. ### Claim 18 (depends on 16) The method of claim 16, wherein the determining the target adjustment solution corresponding to the chip to be tested in the plurality of adjustment solutions according to the plurality of absolute differences comprises: determining the minimum absolute difference in the plurality of absolute differences; and determining the adjustment solution corresponding to the minimum absolute difference as the target adjustment solution corresponding to the chip to be tested. ### Claim 19 (depends on 16) The method of claim 16, wherein after the blowing the E-fuse in the chip to be tested according to the target adjustment solution, the method further comprises: detecting the state of each E-fuse in the chip to be tested again; and detecting a blowing result of the E-fuse according to the state of each E-fuse; and the method further comprises: testing the initial output characteristics of the chip to be tested, and the initial output characteristics being obtained by testing before the E-fuse in the chip to be tested being subjected to blowing treatment; and comparing the initial output characteristics with the output characteristics of the adjusted chip to be tested, so as to determine the adjustment effect. ### Claim 20 (depends on 16) The method of claim 16, wherein after the blowing the E-fuse in the chip to be tested according to the target adjustment solution, the method further comprises: recovering the output characteristics of the chip to be tested to the initial output characteristics before the blowing treatment.