# US 12,002,749 B2 · Barrier and air-gap scheme for high performance interconnects

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- Number: US 12,002,749 B2
- Document ID: US12002749B2
- Status: Granted
- Kind: B2
- Application number: 17/412,403
- Filed: 2021-08-26
- Published: 2023-03-02
- Granted: 2024-06-04
- Earliest claimed: 2021-08-26
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Hsin-Yen Huang; Ting-Ya Lo; Shao-Kuan Lee; Chi-Lin Teng; Cheng-Chin Lee; Shau-Lin Shue; Hsiao-Kang Chang
- Web page: https://patentgrep.com/patent/US12002749B2

## CPC

- H10W 20/063: {by forming conductive members before forming protective insulating material}
- H10W 20/42: Vias, e.g. via plugs
- H10W 20/039: {also covering sidewalls of the conductive structures}
- H10W 20/0633: {using subtractive patterning of the conductive members}
- H10W 20/072: {of dielectric parts comprising air gaps}
- H10W 20/075: {of multilayered thin functional dielectric layers}
- H10W 20/076: {in via holes or trenches}
- H10W 20/46: comprising air gaps
- H10W 20/47: comprising two or more dielectric layers having different properties, e.g. different dielectric constants
- H10W 20/495: {Capacitive arrangements or effects of, or between wiring layers}
- H10W 20/037: {the barrier, adhesion or liner layers being on top of a main fill metal}
- H10W 20/084: {for dual-damascene structures}
- H10W 20/098: {by filling between adjacent conductive parts}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Some embodiments of the present disclosure relate to an integrated chip, including a semiconductor substrate and a dielectric layer disposed over the semiconductor substrate. A pair of metal lines are disposed over the dielectric layer and laterally spaced apart from one another by a cavity. A barrier layer structure extends along nearest neighboring sidewalls of the pair of metal lines such that the cavity is defined by inner sidewalls of the barrier layer structure and a top surface of the dielectric layer.

## Claims

### Claim 1

An integrated chip, comprising:
a semiconductor substrate;
a dielectric layer disposed over the semiconductor substrate;
a pair of metal lines disposed over an upper surface of the dielectric layer and laterally spaced apart from one another by a cavity, wherein the pair of metal lines have bottom surfaces that are co-planar with the upper surface of the dielectric layer, and a bottom extent of the cavity between the pair of metal lines is defined by the upper surface of the dielectric layer; and
a barrier layer structure extending only along nearest neighboring sidewalls of the pair of metal lines such that lateral extents of the cavity are defined by inner sidewalls of the barrier layer structure.

### Claim 2 (depends on 1)

The integrated chip of claim 1, wherein the inner sidewalls of the barrier layer structure directly contact the dielectric layer.

### Claim 3 (depends on 1)

The integrated chip of claim 1, further comprising:
a dielectric liner wherein the dielectric liner is U shaped and extends over a top of the cavity between the inner sidewalls of the barrier layer structure; and
a dielectric cap disposed within inner sidewalls of the dielectric liner and extending from a first top surface of the dielectric liner to a top surface of the barrier layer structure.

### Claim 4 (depends on 3)

The integrated chip of claim 3, wherein a glue layer structure extends from a top surface of the dielectric layer and along outer sidewalls of the barrier layer structure to the pair of metal lines; and
the pair of metal lines extend to the top surface of the barrier layer structure.

### Claim 5 (depends on 4)

The integrated chip of claim 4, wherein a bottom surface of the dielectric liner is above a top surface of the glue layer structure.

### Claim 6 (depends on 1)

The integrated chip of claim 1, further comprising a via, wherein the via is disposed within the dielectric layer and extends from one of the pair of metal lines, wherein the barrier layer structure does not extend into the dielectric layer and does not extend along sidewalls of the via.

### Claim 7

A semiconductor structure, comprising:
a semiconductor substrate;
a dielectric layer disposed over the semiconductor substrate;
a first via disposed within the dielectric layer extending from the semiconductor substrate to a bottom surface of a first metal cap, wherein the first metal cap extends from a top surface of the first via to a top surface of the dielectric layer;
a glue layer structure disposed over the first metal cap;
a metal line extending from the glue layer structure to a second via;
a first pair of barrier layer structures disposed along sidewalls of the glue layer structure and metal line from above the dielectric layer to a top surface of the metal line; and
a second pair of barrier layer structures separated from the first pair of barrier layer structures by a pair of cavities, wherein the pair of cavities are along a top surface of the dielectric layer and inner sidewalls of the second pair of barrier layer structures and outer sidewalls of the first pair of barrier layer structures.

### Claim 8 (depends on 7)

The semiconductor structure of claim 7, wherein bottom surfaces of the first and second pair of barrier layer structures directly contact the dielectric layer.

### Claim 9 (depends on 7)

The semiconductor structure of claim 7, wherein a bottom surface of the first and second pair of barrier layer structures are vertically separated from the top surface of the dielectric layer.

### Claim 10 (depends on 7)

The semiconductor structure of claim 7, wherein a pair of dielectric liners are disposed over the pair of cavities and between the first pair and second pair of barrier layer structures, extending to a top surface of the first and second pair of barrier layer structures.

### Claim 11 (depends on 10)

The semiconductor structure of claim 10, wherein the pair of dielectric liners individually comprise a first upper surface and a second upper surface below the first upper surface, and wherein the second upper surface is between inner sidewalls of the pair of dielectric liners.

### Claim 12 (depends on 11)

The semiconductor structure of claim 11, wherein a dielectric cap extends from the second upper surface to the first upper surface of the pair of dielectric liners.

### Claim 13 (depends on 11)

The semiconductor structure of claim 11, wherein a top surface of the glue layer structure is below a bottom surface of the pair of dielectric liners.

### Claim 14 (depends on 7)

The semiconductor structure of claim 7, wherein a pair of glue layer structures are disposed over the dielectric layer and extend along outer sidewalls of the second pair of barrier layer structures to a bottom surface of a pair of metal lines; and
the pair of metal lines extend from a top surface of the pair of glue layer structures and along outer sidewalls of the second pair of barrier layer structures to a top surface of the second pair of barrier layer structures.

### Claim 15

A method of forming a semiconductor device, comprising:
forming a dielectric layer over a semiconductor substrate;
forming a metal layer above the dielectric layer;
forming a hard mask layer over the metal layer;
patterning the metal layer and hard mask layer to expose a top surface of the dielectric layer and define a pair of metal lines laterally separated from one another;
forming a blocking structure along the top surface of the dielectric layer, and along a top surface and sidewalls of the hard mask layer while leaving inner sidewalls of the pair of metal lines exposed;
while the blocking structure is present, selectively forming a barrier layer structure along the inner sidewalls of the pair of metal lines; and
removing the blocking structure to form a cavity defined by the top surface of the dielectric layer and inner sidewalls of the barrier layer structure.

### Claim 16 (depends on 15)

The method of claim 15, further comprising:
prior to forming the metal layer, forming a glue layer structure over the dielectric layer, such that the metal layer is subsequently formed over the glue layer structure and the glue layer structure is patterned with the metal layer and hard mask layer.

### Claim 17 (depends on 15)

The method of claim 15, wherein the removing of the blocking structure forms a gap between the dielectric layer and a bottom surface of the barrier layer structure.

### Claim 18 (depends on 15)

The method of claim 15, wherein the blocking structure is only partially removed from the top surface of the dielectric layer.

### Claim 19 (depends on 15)

The method of claim 15, further comprising:
forming a thermal degradable polymer in the cavity recessed below a top surface of the barrier layer structure;
forming a second dielectric layer on an upper surface of the thermal degradable polymer, sidewalls of the barrier layer structure, and an upper surface of the barrier layer structure; and
removing the thermal degradable polymer after the second dielectric layer is formed, such that the cavity is further defined by a bottom surface of the second dielectric layer.

### Claim 20 (depends on 19)

The method of claim 19, further comprising:
forming a third dielectric layer along the upper surface and sidewalls of the second dielectric layer.