# US 12,002,744 B2 · Film package and display device including film package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,744 B2 - Document ID: US12002744B2 - Status: Granted - Kind: B2 - Application number: 17/356,899 - Filed: 2021-06-24 - Published: 2022-03-03 - Granted: 2024-06-04 - Earliest claimed: 2020-08-25 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Myong-Soo Oh; Minsung Kim; Juno Song; Heejong Shin - Web page: https://patentgrep.com/patent/US12002744B2 ## CPC - G09G 3/3233: with pixel circuitry controlling the current through the light-emitting element - G09G 3/3241: the current through the light-emitting element being set using a data current provided by the data driver, e.g. by using a two-transistor current mirror - H10K 50/88: Terminals, e.g. bond pads - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes} - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/688: {Flexible insulating substrates} - H10W 99/00: Subject matter not provided for in other groups of this subclass - G09G 2300/0426: Layout of electrodes and connections - G09G 2310/0243: Details of the generation of driving signals - G09G 2330/00: Aspects of power supply; Aspects of display protection and defect management - G09G 2330/02: Details of power systems and of start or stop of display operation - H10W 90/00: Package configurations - G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A film package includes a base substrate having a bottom surface that includes a first portion and a second portion that are spaced apart from each other. First pad wires are disposed on the first portion of the bottom surface of the base substrate. Second pad wires are disposed on the second portion of the bottom surface of the base substrate. A light blocking member is disposed between the first pad wires and the second pad wires. ## Claims ### Claim 1 A film package comprising: a base substrate having a bottom surface that includes a first portion and a second portion that are spaced apart from each other in a first direction; first pad wires disposed on the first portion of the bottom surface of the base substrate and extending in a second direction perpendicular to the first direction; second pad wires disposed on the second portion of the bottom surface of the base substrate and extending in the second direction; a light blocking member disposed between the first pad wires and the second pad wires in the first direction; first dummy patterns disposed on the bottom surface of the base substrate adjacent to and spaced apart from a first side of the light blocking member in the second direction, the first dummy patterns being disposed between the first pad wires and the second pad wires in the first direction, each of the first dummy patterns extending parallel to the first pad wires and the second pad wires; and second dummy patterns disposed on the bottom surface of the base substrate adjacent to and spaced apart from a second side of the light blocking member in the second direction, the second dummy patterns being disposed between the first pad wires and the second pad wires in the first direction, each of the second dummy patterns extending parallel to the first pad wires and the second pad wires, wherein the first and second pad wires are configured for receiving a power supply voltage, and the first and second dummy patterns are not configured for receiving the power supply voltage, wherein the first and second pad wires and the first and second dummy patterns are composed of a similar material as each other. ### Claim 2 (depends on 1) The film package of claim 1, wherein the light blocking member is disposed on the bottom surface of the base substrate and is spaced apart from the first pad wires and the second pad wires. ### Claim 3 (depends on 1) The film package of claim 1, further comprising: third pad wires disposed on the bottom surface of the base substrate and positioned between the light blocking member and the first pad wires, the third pad wires having a first bent part disposed along a profile of an outer periphery of the light blocking member at a portion where the light blocking member is located; and fourth pad wires disposed on the bottom surface of the base substrate and positioned between the light blocking member and the second pad wires, the fourth pad wires having a second bent part disposed along a profile of an outer periphery of the light blocking member at a portion where the light blocking member is located. ### Claim 4 (depends on 1) The film package of claim 1, wherein: the film package is configured to block external light from being transmitted through a partial portion of the base substrate in which the first and second pad wires and the light blocking member are disposed; and the film package is configured to transmit external light through a partial portion of the base substrate in which the first and second pad wires and the light blocking member are not disposed. ### Claim 5 A display device comprising: a substrate having a display area, a first pad area disposed on a first side of the display area, and a second pad area disposed on a second side of the display area; display structures disposed on the substrate in the display area; first pad electrodes disposed on the substrate in the first pad area; second pad electrodes disposed on the substrate in the second pad area; and a first film package electrically connected to the first pad electrode, and including a first base substrate having a bottom surface that includes a first portion and a second portion that are spaced apart from each other in a first direction; first pad wires disposed on the first portion of the bottom surface of the first base substrate and extending in a second direction perpendicular to the first direction, second pad wires disposed on the second portion of the bottom surface of the first base substrate and extending in the second direction, a light blocking member disposed between the first pad wires and the second pad wires in the first direction, first dummy patterns disposed on the bottom surface of the base substrate adjacent to and spaced apart from a first side of the light blocking member in the second direction, the first dummy patterns being disposed between the first pad wires and the second pad wires in the first direction, each of the first dummy patterns extending parallel to the first pad wires and the second pad wires, and second dummy patterns disposed on the bottom surface of the base substrate adjacent to and spaced apart from a second side of the light blocking member in the second direction, the second dummy patterns being disposed between the first pad wires and the second pad wires in the first direction, each of the second dummy patterns extending parallel to the first pad wires and the second pad wires, wherein the first and second pad wires are configured for receiving a power supply voltage from the first and second pad electrodes, wherein the first and second dummy patterns are not configured for receiving the power supply voltage from the first and second pad electrodes, wherein the first and second pad wires and the first and second dummy patterns are composed of a similar material as each other. ### Claim 6 (depends on 5) The display device of claim 5, wherein the first film package does not include a driver IC chip. ### Claim 7 (depends on 5) The display device of claim 5, wherein: the first pad electrodes are configured to receive the power supply voltage, the power supply voltage is generated by an external device through the first film package; and the first pad electrodes are configured to provide the power supply voltage to the display structure. ### Claim 8 (depends on 7) The display device of claim 7, wherein power supply voltage includes: a low power supply voltage having a first power level; and a high power supply voltage having a second power level that is higher than the first power level. ### Claim 9 (depends on 8) The display device of claim 8, further comprising first semiconductor elements disposed between the substrate and the display structure, the first semiconductor elements are configured to be electrically connected to the display structures. ### Claim 10 (depends on 9) The display device of claim 9, wherein the high power supply voltage is provided in the second direction from the first pad area to the second pad area, and is sequentially provided in the second direction to the first semiconductor elements disposed in the display area. ### Claim 11 (depends on 5) The display device of claim 5, further comprising: a second film package that is configured to be electrically connected to the second pad electrode, the second film package including: a second base substrate; pad wires disposed on a bottom surface of the second base substrate; and a driver IC chip that is configured to be electrically connected to the pad wires. ### Claim 12 (depends on 11) The display device of claim 11, further comprising second semiconductor elements disposed between the substrate and the display structure, wherein the second semiconductor elements are configured to be electrically connected to the display structures. ### Claim 13 (depends on 12) The display device of claim 12, wherein: the second pad electrodes are configured to receive a driving signal generated by an external device; and the second pad electrodes are configured to provide the driving signal to the second semiconductor element. ### Claim 14 (depends on 13) The display device of claim 13, wherein the driving signal includes a data signal. ### Claim 15 (depends on 12) The display device of claim 12, wherein the driving signal is provided in the second direction from the second pad area to the first pad area, and sequentially provided in the second direction to the second semiconductor elements disposed in the display area. ### Claim 16 (depends on 5) The display device of claim 5, wherein the light blocking member is spaced apart from the first pad wires and the second pad wires. ### Claim 17 (depends on 5) The display device of claim 5, further comprising: third pad wires disposed between the light blocking member and the first pad wires, the third pad wires having a first bent part disposed along a profile of an outer periphery of the light blocking member at a portion where the light blocking member is located; and fourth pad wires disposed between the light blocking member and the second pad wires, the fourth pad wires having a second bent part disposed along a profile of an outer periphery of the light blocking member at a portion where the light blocking member is located. ### Claim 18 (depends on 5) The display device of claim 5, wherein: the first film package is configured to block external light from being transmitted through a partial portion of the first base substrate in which the first and second pad wires and the light blocking member are disposed; and the first film package is configured to transmit external light through a portion of the first base substrate in which the first and second pad wires and the light blocking member are not disposed.