# US 12,002,743 B2 · Electronic carrier and method of manufacturing the same

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- Number: US 12,002,743 B2
- Document ID: US12002743B2
- Status: Granted
- Kind: B2
- Application number: 17/402,239
- Filed: 2021-08-13
- Published: 2023-02-16
- Granted: 2024-06-04
- Earliest claimed: 2021-08-13
- Assignees: Advanced Semiconductor Engineering, Inc.
- Applicants: Advanced Semiconductor Engineering, Inc.
- Inventors: You-Lung Yen; Bernd Karl Appelt
- Web page: https://patentgrep.com/patent/US12002743B2

## CPC

- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/6565: {recessed into the surface of the package substrates, interposers, or redistribution layers}
- H10W 70/685: comprising multiple insulating layers
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic carrier and a method of manufacturing an electronic carrier are provided. The electronic carrier includes a first interconnection structure and a second interconnection structure. The first interconnection structure includes a first patterned conductive layer having a first pattern density. The second interconnection structure is laminated to the first interconnection structure and includes a second patterned conductive layer having a second pattern density higher than the first pattern density. The first interconnection structure is electrically coupled to the second interconnection structure through a first non-soldering joint between and outside of the first interconnection structure and the second interconnection structure.

## Claims

### Claim 1

An electronic carrier, comprising:
a first interconnection structure comprising a first patterned conductive layer having a first pattern density; and
a second interconnection structure disposed over the first interconnection structure and comprising a second patterned conductive layer having a second pattern density higher than the first pattern density;
wherein the first interconnection structure is electrically connected to the second interconnection structure through a first non-soldering joint between and outside of the first interconnection structure and the second interconnection structure,
wherein the first interconnection structure comprises a conductive portion including a wide part and a narrow part between the wide part and the first non-soldering joint, and the narrow part contacts the first non-soldering joint,
wherein the narrow part has a width decreasing in toward the second interconnection structure,
wherein a lateral surface of the narrow part comprises a curved surface,
wherein the second interconnection structure comprises a conductive layer protruded beyond a surface of the second interconnection structure that faces the first interconnection structure,
wherein a thickness of the narrow part is greater than a thickness of the conductive layer,
wherein a portion of a bottom surface of the conductive layer is facing and exposed by the first non-soldering joint, and
wherein in a cross-sectional view perspective, a portion of a top surface of the narrow part facing and exposed by the first non-soldering joint has a first width, and the portion of the bottom surface of the conductive layer exposed by the first non-soldering joint has a second width greater than the first width.

### Claim 2 (depends on 1)

The electronic carrier of claim 1, wherein the portion of the top surface of the narrow part exposed by the first non-soldering joint has a first region and a second region distinct from the first region, and a width of the first region is different from a width of the second region.

### Claim 3 (depends on 1)

The electronic carrier of claim 1, wherein the conductive portion is a single layer, and a thickness of the conductive portion is greater than a thickness of the first non-soldering joint.

### Claim 4 (depends on 3)

The electronic carrier of claim 3, further comprising a solder mask contacting the wide part and spaced apart from the top surface of the narrow part.

### Claim 5 (depends on 1)

The electronic carrier of claim 1, further comprising a pad under the wide part, wherein a lateral surface of the pad is substantially aligned with a lateral surface of the wide part.