# US 12,002,733 B2 · Heat dissipation structure, manufacturing method for heat dissipation structure, and electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,733 B2 - Document ID: US12002733B2 - Status: Granted - Kind: B2 - Application number: 17/983,561 - Filed: 2022-11-09 - Published: 2023-06-29 - Granted: 2024-06-04 - Earliest claimed: 2021-12-27 - Assignees: Lenovo (Singapore) Pte. Ltd. - Applicants: Lenovo (Singapore) Pte. Ltd. - Inventors: Masahiro Kitamura; Takuroh Kamimura; Junki Hashiba; Takateru Adachi - Web page: https://patentgrep.com/patent/US12002733B2 ## CPC - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 40/10: Arrangements for heating - H10W 40/611: {Bolts or screws} - H10W 72/30: Die-attach connectors - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/383: {Reinforcing structures, e.g. collars} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 90/00: Package configurations - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal. ## Claims ### Claim 1 A heat dissipation structure of an electric component that generates heat, the heat dissipation structure comprising: a semiconductor chip that includes a substrate, a die disposed on a surface of the substrate, and one or more electric elements disposed on the surface of the substrate, where the electric component is the die; a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal, wherein the fencing body has an exhaust gap that is open laterally along a plane parallel to the surface of the substrate, wherein the exhaust gap is located in an angular range that is half of a maximum angular interval of the one or more electric elements with respect to a center of the die along the plane parallel to the surface of the substrate. ### Claim 2 (depends on 1) The heat dissipation structure according to claim 1, wherein the fencing body is a grease. ### Claim 3 (depends on 1) The heat dissipation structure according to claim 1, further comprising: a board, wherein the semiconductor chip is mounted on the board. ### Claim 4 (depends on 1) The heat dissipation structure according to claim 1, wherein a surface of the die has a shape in which a central part is raised relative to a peripheral part. ### Claim 5 (depends on 1) An electronic apparatus comprising the heat dissipation structure according to claim 1. ### Claim 6 A manufacturing method for a heat dissipation structure of an electric component that generates heat, the manufacturing method comprising: a grease application step of applying a grease to a peripheral part of a surface of the electric component, where a semiconductor chip includes a substrate and a die and the electric component is the die, and the grease includes an exhaust gap on the surface of the electric component that is open laterally; a liquid metal application step of applying a liquid metal to an area of the surface of the electric component surrounded by the grease; and a heat dissipator contact step of pressing a heat dissipator against the surface of the electric component to bring the liquid metal into contact with the heat dissipator while crushing the grease, where excess air is discharged through the exhaust gap during the heat dissipator contact step, wherein one or more electric elements are provided on the substrate, and wherein the exhaust gap is located in a range in which an angular interval of the one or more electric elements with respect to a center of the die is largest. ### Claim 7 (depends on 6) The manufacturing method for the heat dissipation structure according to claim 6, wherein in the liquid metal application step, the liquid metal is applied with a gap between the liquid metal and the grease. ### Claim 8 (depends on 6) The manufacturing method for the heat dissipation structure according to claim 6, wherein in the grease application step, the grease is applied using a silk screen. ### Claim 9 (depends on 6) The manufacturing method for the heat dissipation structure according to claim 6, wherein in the heat dissipater contact step, the grease is crushed to form a constricted portion in the gap that has a narrower width than the remainder of the grease.