# US 12,002,729 B2 · Electronic package and method of manufacturing the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,002,729 B2
- Document ID: US12002729B2
- Status: Granted
- Kind: B2
- Application number: 17/390,697
- Filed: 2021-07-30
- Published: 2023-02-02
- Granted: 2024-06-04
- Earliest claimed: 2021-07-30
- Assignees: Advanced Semiconductor Engineering, Inc.
- Applicants: Advanced Semiconductor Engineering, Inc.
- Inventors: You-Lung Yen; Bernd Karl Appelt
- Web page: https://patentgrep.com/patent/US12002729B2

## CPC

- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/10: Arrangements for heating
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 74/01: Manufacture or treatment
- H10W 74/016: {using moulds}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 70/635: {Through-vias}
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/752: {between stacked chips}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A electronic package and a method of manufacturing the same are provided. The electronic package includes an electronic component, a thermal spreading element, and an encapsulant. The electronic component has a first surface. The thermal spreading element is disposed over the electronic component and has a first surface facing the first surface of the electronic component. The encapsulant covers the electronic component and has a first surface closer to the first surface of the thermal spreading element than the first surface of the electronic component.

## Claims

### Claim 1

An electronic package, comprising:
an electronic component having a first surface and a second surface opposite to the first surface;
a thermal spreading element disposed over the electronic component and having a first surface facing the first surface of the electronic component; and
a first encapsulant covering the electronic component and having a first surface closer to the first surface of the thermal spreading element than the first surface of the electronic component, wherein the second surface of the electronic component is recessed with respect to a bottom surface of the thermal spreading element.

### Claim 2 (depends on 1)

The electronic package of claim 1, wherein the first encapsulant further has a second surface opposite to the first surface, the thermal spreading element comprises a base disposed over the electronic component and a sidewall extending from the base toward the second surface of the first encapsulant, the electronic package further comprises a redistribution layer disposed on the second surface of the first encapsulant, and a thickness of the redistribution layer is less than a thickness of the base of the thermal spreading element.

### Claim 3 (depends on 1)

The electronic package of claim 1, wherein the thermal spreading element is disposed at five surfaces of the electronic component.

### Claim 4 (depends on 3)

The electronic package of claim 3, wherein the thermal spreading element comprises a plurality of protrusions extending outwards from a sidewall of the thermal spreading element and disposed separately on a same side of the electronic component.

### Claim 5 (depends on 4)

The electronic package of claim 4, further comprising a second encapsulant disposed between at least two of the protrusions of the thermal spreading element.

### Claim 6 (depends on 1)

The electronic package of claim 1, wherein the first encapsulant further has a second surface opposite to the first surface, and the second surface is a ground surface.

### Claim 7 (depends on 1)

The electronic package of claim 1, wherein the electronic component comprises a plurality of electrical connectors, and at least one of the electrical connectors directly contacts the first encapsulant.

### Claim 8 (depends on 1)

The electronic package of claim 1, further comprising a first electrical connector, a second electrical connector, and a third electrical connector connected to the second surface of the electronic component, wherein the first electrical connector and the second electrical connector are an adjacent pair, the second electrical connector and the third electrical connector are an adjacent pair, and a distance between the first electrical connector and the second electrical connector is different from a distance between the third electrical connector and the second electrical connector.

### Claim 9 (depends on 1)

The electronic package of claim 1, further comprising a first electrical connector and a second electrical connector connected to the second surface of the electronic component, wherein a portion of the first encapsulant is between the first electrical connector and the second electrical connector.

### Claim 10 (depends on 9)

The electronic package of claim 9, wherein the portion of the first encapsulant directly contacts the second surface of the electronic component.

### Claim 11 (depends on 9)

The electronic package of claim 9, wherein the first encapsulant comprises a step structure directly contacting the first electrical connector.

### Claim 12 (depends on 9)

The electronic package of claim 9, wherein a height of the portion of the first encapsulant is substantially the same as a height of the first electrical connector.

### Claim 13

An electronic package, comprising:
a thermal spreading element;
a first electronic component attached to the thermal spreading element and including a plurality of first electrical connectors, wherein the first electrical connectors are protruded beyond a bottom surface of the first electronic component;
an encapsulant encapsulating the first electronic component, wherein a surface of the encapsulant and an end surface of the first electrical connectors are substantially coplanar; and
a second electronic component encapsulated by the encapsulant and including a plurality of second electrical connectors protruded beyond a bottom surface of the second electronic component,
wherein a width of the first electrical connectors and a width of the second electrical connectors are different.

### Claim 14 (depends on 13)

The electronic package of claim 13, wherein a pitch of the first electrical connectors and a pitch of the second electrical connectors are different.

### Claim 15 (depends on 13)

The electronic package of claim 13, wherein a thickness of the first electronic component and a thickness of the second electronic component are different.

### Claim 16 (depends on 13)

The electronic package of claim 13, wherein a width of the first electronic component and a width of the second electronic component are different.

### Claim 17 (depends on 13)

The electronic package of claim 13, wherein the thermal spreading element comprises a first sidewall adjacent to the first electronic component and a second sidewall adjacent to the second electronic component, the encapsulant comprises a first portion between the first sidewall and the first electronic component and a second portion between the second sidewall and the second electronic component, and a width of the first portion is different from a width of the second portion.

### Claim 18 (depends on 13)

The electronic package of claim 13, further comprising an intermediate layer between the thermal spreading element and the first electronic component, wherein a thickness of the intermediate layer is less than a thickness of the first electrical connectors.