# US 12,002,721 B2 · Method of fabricating semiconductor structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,721 B2 - Document ID: US12002721B2 - Status: Granted - Kind: B2 - Application number: 17/874,326 - Filed: 2022-07-27 - Published: 2022-11-24 - Granted: 2024-06-04 - Earliest claimed: 2019-12-24 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Kuan-Yu Huang; Sung-Hui Huang; Shang-Yun Hou; Chien-Yuan Huang - Web page: https://patentgrep.com/patent/US12002721B2 ## CPC - H10W 76/12: characterised by their shape - H10W 76/60: Seals - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/611: {for connecting multiple chips together} - H10W 72/071: {Connecting or disconnecting} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/00: Package configurations - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 72/072: {of bump connectors} - H10W 72/07254: {changes in dispositions} - H10W 72/073: {of die-attach connectors} - H10W 72/247: {Dispositions of multiple bumps} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/288: {characterised by arrangements for thermal management of the stacked chips} - H10W 90/291: {characterised by containers, encapsulations, or other housings for the stacked chips} - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of fabricating a semiconductor structure includes providing a first substrate comprising a first side and a second side opposite to the first side. A package is attached to the first side of the first substrate. A second substrate is attached to the second side of the first substrate. A plurality of electrical connectors is bonded between the second side of the first substrate and the second substrate. A lid is attached to the first substrate and the second substrate. The lid includes a ring part and a plurality of overhang parts. The ring part is over the first side of the first substrate. The plurality of overhang parts extends from corner sidewalls of the ring part toward the second substrate. The plurality of overhang parts are laterally aside the plurality of electrical connectors. ## Claims ### Claim 1 A method of fabricating a semiconductor structure, comprising: providing a first substrate comprising a first side and a second side opposite to the first side; attaching a package to the first side of the first substrate; attaching a second substrate to the second side of the first substrate; bonding a plurality of electrical connectors between the second side of the first substrate and the second substrate; and attaching a lid to the first substrate and the second substrate, wherein the lid comprises: a ring part over the first side of the first substrate; and a plurality of overhang parts extended from corner sidewalls of the ring part toward the second substrate, wherein the plurality of overhang parts are laterally aside the plurality of electrical connectors. ### Claim 2 (depends on 1) The method of claim 1, wherein the attaching the lid to the first substrate and the second substrate comprises: attaching a bottom surface of the ring part of the lid to the first side of the first substrate, wherein the ring part and the first substrate define a space and the package is accommodated in the space. ### Claim 3 (depends on 2) The method of claim 2, wherein the attaching a bottom surface of the ring part of the lid to the first side of the first substrate vias a first adhesive. ### Claim 4 (depends on 3) The method of claim 3, wherein the attaching the lid to the first substrate and the second substrate further comprises: attaching inner sidewalls of the plurality of overhang parts of the lid to sidewalls of the first substrate through the first adhesive. ### Claim 5 (depends on 3) The method of claim 3, wherein the attaching the lid to the first substrate and the second substrate further comprises: attaching inner sidewalls of the plurality of overhang parts of the lid to sidewalls of the first substrate through a second adhesive. ### Claim 6 (depends on 2) The method of claim 2, wherein the attaching the lid to the first substrate and the second substrate further comprises: contacting inner sidewalls of the plurality of overhang parts of the lid to sidewalls of the first substrate. ### Claim 7 (depends on 2) The method of claim 2, wherein the attaching the lid to the first substrate and the second substrate further comprises: attaching bottom surfaces of the plurality of overhang parts of the lid to the second substrate. ### Claim 8 (depends on 7) The method of claim 7, wherein the attaching bottom surfaces of the plurality of overhang parts of the lid to the second substrate vias a plurality of third adhesives. ### Claim 9 (depends on 8) The method of claim 8, wherein the plurality of third adhesives are spaced apart from the plurality of electrical connectors. ### Claim 10 (depends on 8) The method of claim 8, wherein the attaching the lid to the first substrate and the second substrate further comprises attaching bottom surfaces of a plurality of protrusion parts of the lid to the second substrate vias the plurality of third adhesives, wherein the plurality of protrusion parts extends from outer sidewalls of the plurality of overhang parts toward edges of the second substrate. ### Claim 11 (depends on 10) The method of claim 10, wherein one of the plurality of protrusion parts has a bottom surface, and an area of the bottom surface is less than an area of a bottom surface of the ring part. ### Claim 12 (depends on 1) The method of claim 1, wherein one of the plurality of overhang parts has a bottom surface, and an area of the bottom surface is less than an area of a bottom surface of the ring part. ### Claim 13 (depends on 1) The method of claim 1, wherein the attaching the lid to the first substrate and the second substrate further comprises attaching bottom surfaces of a cap part of the lid to the package via a thermal interface material, wherein the ring part extends from a bottom surface of the cap part toward the first substrate, and the ring part, the cap part and the first substrate define a space, and the package is accommodated in the space. ### Claim 14 A method of fabricating a semiconductor structure, comprising: providing a plurality of substrates stacked in a direction; attaching a package to one of the plurality of substrates; bonding the plurality of substrates through a plurality of electrical connectors; and attaching a lid to at least two top surfaces of the plurality of substrates through a plurality of first adhesives, wherein the lid is positioned laterally beside the plurality of electrical connectors. ### Claim 15 (depends on 14) The method of claim 14, further comprising attaching the lid to corner sidewalls of the one of the plurality of substrates. ### Claim 16 (depends on 15) The method of claim 15, wherein the attaching the lid to the corner sidewalls of the one of the plurality of substrates vias a second adhesive. ### Claim 17 (depends on 14) The method of claim 14, further comprising: attaching the lid to a top surface of the package through a thermal interface material. ### Claim 18 A method of fabricating a semiconductor structure, comprising: attaching a package to a first side of a first substrate; providing a lid, wherein the lid comprises a ring part and a plurality of overhang parts; attaching a bottom surface of the ring part of the lid to the first side of the first substrate by a first adhesive; attaching a second side opposite to the first side of the first substrate to a second substrate through a plurality of electrical connectors; and attaching bottom surfaces of the plurality of overhang parts of the lid to the second substrate by a second adhesive, the plurality of overhang parts extending from corner sidewalls of the ring part toward the second substrate to cover corner sidewalls of the first substrate. ### Claim 19 (depends on 18) The method of claim 18, further comprising bonding the plurality of electrical connectors on the second side of the first substrate before the attaching the second side opposite to the first side of the first substrate to the second substrate and after attaching the bottom surface of the ring part of the lid. ### Claim 20 (depends on 18) The method of claim 18, further comprising: attaching sidewalls of the plurality of overhang parts of the lid to the corner sidewalls of the first substrate by the first adhesive.