# US 12,002,704 B2 · Substrate holding apparatus, substrate processing apparatus having substrate holding apparatus, and substrate processing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,704 B2 - Document ID: US12002704B2 - Status: Granted - Kind: B2 - Application number: 16/168,301 - Filed: 2018-10-23 - Published: 2019-05-02 - Granted: 2024-06-04 - Earliest claimed: 2017-10-27 - Assignees: Ebara Corporation - Applicants: Ebara Corporation - Inventors: Makoto Kashiwagi; Manao Hoshina - Web page: https://patentgrep.com/patent/US12002704B2 ## CPC - H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel} - B24B 37/105: {the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement} - B24B 41/067: {radially supporting workpieces} - G03F 7/707: {Chucks, e.g. chucking or un-chucking operations or structural details} - G03F 7/70758: {Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving} - H10P 72/3202: {Mechanical details, e.g. rollers or belts} - H10P 72/7608: {characterised by a plurality of separate clamping members, e.g. clamping fingers} - H10P 72/7626: {characterised by the construction of the shaft} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer, is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers capable of contacting a periphery of the substrate; a roller rotating mechanism configured to rotate the rollers; and eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively. ## Claims ### Claim 1 A substrate holding apparatus for holding a substrate and rotating the substrate, comprising: rollers capable of contacting a periphery of the substrate; a roller rotating mechanism configured to rotate the rollers; and eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions, intermediate shaft portions, and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, the rollers being fixed to the second shaft portions, respectively, the intermediate shaft portions being connected between the first shaft portions and the second shaft portions, wherein the first shaft portion is connected on a bottom surface of the intermediate shaft portion, the second shaft portion is connected on a top surface of the intermediate shaft portion, and a central axis of each second shaft portion being located apart from a rotating axis of each first shaft portion, and each second shaft portion being configured to be rotatable 360 degrees around each first shaft portion. ### Claim 2 (depends on 1) The substrate holding apparatus according to claim 1, wherein the roller rotating mechanism includes motors coupled to the first shaft portions, respectively, and an operation controller configured to instruct the motors to rotate the first shaft portions, the second shaft portions, and the intermediate shaft portions in the same direction, at the same speed and in the same phase. ### Claim 3 (depends on 1) The substrate holding apparatus according to claim 1, further comprising counter weights secured to the eccentric shafts, respectively, each of the counter weights and corresponding one of the rollers being arranged symmetrically with respect to corresponding one of the first shaft portions. ### Claim 4 (depends on 1) A substrate processing apparatus comprising: the substrate holding apparatus according to claim 1; and a processing head for bringing a processing tool into contact with a first surface of a substrate to process the first surface. ### Claim 5 (depends on 1) The substrate processing apparatus according to claim 1 wherein the first shaft portion is connected at an offset to a geometric center on a bottom surface of the intermediate shaft portion, the second shaft portion is connected at an offset to a geometric center on a top surface of the intermediate shaft portion. ### Claim 6 (depends on 5) The substrate processing apparatus according to claim 5 wherein the offset to a geometric center on a bottom surface and the offset to a geometric center on a bottom surface are not aligned with each other.