# US 12,002,703 B2 · Lift pin assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,703 B2 - Document ID: US12002703B2 - Status: Granted - Kind: B2 - Application number: 17/227,066 - Filed: 2021-04-09 - Published: 2021-07-29 - Granted: 2024-06-04 - Earliest claimed: 2017-07-20 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Yogananda Sarode Vishwanath; Anand Kumar - Web page: https://patentgrep.com/patent/US12002703B2 ## CPC - H10P 72/7612: {characterised by lifting arrangements, e.g. lift pins} - C23C 16/4401: {Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber} - H01J 37/32715: {Workpiece holder} - H10P 72/0402: {Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence)} - H10P 72/0432: {mainly by conduction} - H10P 72/0434: {mainly by convection} - H10P 72/72: using electrostatic chucks - H10P 72/722: {Details of electrostatic chucks} - H10P 72/7616: {characterised by a coating, a hardness or a material} - H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support} - H01J 37/32449: {Gas control, e.g. control of the gas flow} - H10P 72/0421: {for drying etching} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion. ## Claims ### Claim 1 A lift pin assembly comprising: a lift pin guide; a purge cylinder disposed adjacent the lift pin guide, the lift pin guide and the purge cylinder having a passage formed therethrough that is configured to receive a lift pin suitable for lifting a substrate, wherein the purge cylinder comprises: a plurality of nozzles configured to direct a flow of gas radially inward into a portion of the passage disposed in the purge cylinder that receives the lift pin, each nozzle included in the plurality of nozzles having an outer diameter of about 20 mil to about 80 mil; and a bushing, wherein the lift pin guide is disposed between the purge cylinder and the bushing. ### Claim 2 (depends on 1) The lift pin assembly of claim 1, wherein the purge cylinder is a ceramic material. ### Claim 3 (depends on 1) The lift pin assembly of claim 1, wherein the lift pin guide is disposed below the purge cylinder. ### Claim 4 (depends on 1) The lift pin assembly of claim 1, further comprising the lift pin disposed in the passage. ### Claim 5 (depends on 4) The lift pin assembly of claim 4, wherein the plurality of nozzles are disposed radially outward from the lift pin. ### Claim 6 (depends on 4) The lift pin assembly of claim 4, wherein the lift pin is fabricated from sapphire. ### Claim 7 (depends on 4) The lift pin assembly of claim 4, wherein the plurality of nozzles are disposed in a staggered pattern surrounding the lift pin. ### Claim 8 (depends on 4) The lift pin assembly of claim 4, wherein the plurality of nozzles comprise at least two nozzles that are disposed at an angle of about 120 degrees to about 180 degrees circumferentially around the lift pin. ### Claim 9 (depends on 1) The lift pin assembly of claim 1, further comprising a hoop assembly disposed below the purge cylinder. ### Claim 10 (depends on 9) The lift pin assembly of claim 9, wherein the lift pin guide is disposed between the purge cylinder and the hoop assembly. ### Claim 11 An assembly comprising: a substrate support; a facility plate disposed below the substrate support; and a lift pin assembly disposed within the substrate support and the facility plate comprising: a lift pin guide; a purge cylinder disposed adjacent the lift pin guide, the lift pin guide and the purge cylinder having a passage formed therethrough, wherein the purge cylinder comprises: a plurality of nozzles configured to direct a flow of gas radially inward into a portion of the passage disposed in the purge cylinder, each nozzle included in the plurality of nozzles having an outer diameter of about 20 mil to about 80 mil to reduce particle deposition on a substrate; a lift pin disposed in the passage; and a bushing, wherein the lift pin guide is disposed between the purge cylinder and the bushing. ### Claim 12 (depends on 11) The lift pin assembly of claim 11, wherein the lift pin is fabricated from sapphire. ### Claim 13 (depends on 11) The lift pin assembly of claim 11, wherein the plurality of nozzles are disposed in a staggered pattern surrounding the lift pin. ### Claim 14 (depends on 11) The lift pin assembly of claim 11, wherein the purge cylinder is a ceramic material. ### Claim 15 (depends on 11) The lift pin assembly of claim 11, wherein the plurality of nozzles are disposed radially outward from the lift pin. ### Claim 16 (depends on 11) The lift pin assembly of claim 11, wherein the lift pin guide is disposed below the purge cylinder. ### Claim 17 (depends on 11) The lift pin assembly of claim 11, wherein the plurality of nozzles comprise at least two nozzles that are disposed at an angle of about 120 degrees to about 180 degrees circumferentially around the lift pin. ### Claim 18 (depends on 11) The lift pin assembly of claim 11, further comprising a hoop assembly disposed below the purge cylinder. ### Claim 19 (depends on 18) The lift pin assembly of claim 18, wherein the lift pin guide is disposed between the purge cylinder and the hoop assembly. ### Claim 20 A lift pin assembly comprising: a lift pin configured to lift a substrate; a lift pin guide; a purge cylinder disposed adjacent the lift pin guide, the lift pin guide and the purge cylinder having a passage formed therethrough, wherein the lift pin guide is disposed below the purge cylinder, and wherein the purge cylinder comprises: a plurality of nozzles configured to direct a flow of gas radially inward into a portion of the passage disposed in the purge cylinder, each nozzle included in the plurality of nozzles having an outer diameter of about 20 mil to about 80 mil to reduce particle deposition on the substrate, wherein the lift pin is disposed in the passage; and a bushing, wherein the lift pin guide is disposed between the purge cylinder and the bushing.