# US 12,002,700 B2 · Substrate bonding apparatus and method of manufacturing a semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,700 B2 - Document ID: US12002700B2 - Status: Granted - Kind: B2 - Application number: 17/346,743 - Filed: 2021-06-14 - Published: 2022-03-10 - Granted: 2024-06-04 - Earliest claimed: 2020-09-08 - Assignees: Kioxia Corporation - Applicants: Kioxia Corporation - Inventors: Sho Kawadahara - Web page: https://patentgrep.com/patent/US12002700B2 ## CPC - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/70: for supporting or gripping - H10P 72/0616: {Monitoring of warpages, curvatures, damages, defects or the like} - H10P 72/53: {using optical controlling means} - H10P 72/722: {Details of electrostatic chucks} - H10P 72/7611: {characterised by edge profile or support profile} - H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks - H10W 72/011: {Apparatus therefor} - H10W 72/0113: {Apparatus for manufacturing die-attach connectors} - H10W 72/0116: {Apparatus for manufacturing strap connectors} - H10W 72/0198: {batch processes} - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10P 10/128: {by direct semiconductor to semiconductor bonding} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07178: {Means for aligning} - H10W 72/07183: {Means for monitoring} - H10W 72/07188: {Apparatus chuck} - H10W 72/07235: {Applying EM radiation, e.g. induction heating or using a laser} - H10W 72/07335: {Applying EM radiation, e.g. induction heating or using a laser} - H10W 72/07635: {Applying EM radiation, e.g. induction heating or using a laser} - H10W 80/338: {using EM radiation or electron beams, e.g. using lasers} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract According to one embodiment, there is provided a substrate bonding apparatus including a first chuck stage and a second chuck stage. The first chuck stage includes a first electromagnetic force generation unit. The first chuck stage is chuckable for a first substrate. The second chuck stage includes a second electromagnetic force generation unit. The second electromagnetic force generation unit faces the first electromagnetic force generation unit. The second chuck stage is chuckable for a second substrate. ## Claims ### Claim 1 A substrate bonding apparatus comprising: a first chuck stage including a first electromagnetic force generation unit, the first chuck stage being chuckable for a first substrate; and a second chuck stage including a second electromagnetic force generation unit, the second electromagnetic force generation unit facing the first electromagnetic force generation unit, the second chuck stage being chuckable for a second substrate. ### Claim 2 (depends on 1) The substrate bonding apparatus according to claim 1, wherein the first chuck stage has a first chuck surface, the first electromagnetic force generation unit includes a plurality of first electromagnetic elements arranged along a direction parallel to the first chuck surface, the second chuck stage has a second chuck surface, and the second electromagnetic force generation unit includes a plurality of second electromagnetic elements arranged along a direction parallel to the second chuck surface. ### Claim 3 (depends on 2) The substrate bonding apparatus according to claim 2, further comprising a controller that controls the first electromagnetic force generation unit and the second electromagnetic force generation unit independently of each other. ### Claim 4 (depends on 2) The substrate bonding apparatus according to claim 2, wherein the first chuck stage further includes a first chuck unit, the first chuck unit being disposed between the first electromagnetic elements and capable of chucking the first substrate, and the second chuck stage further includes a second chuck unit, the second chuck unit being disposed between the second electromagnetic elements and capable of chucking the second substrate. ### Claim 5 (depends on 4) The substrate bonding apparatus according to claim 4, wherein the first chuck stage further includes a first image sensor, the first image sensor being disposed between the first electromagnetic elements and capable of capturing an image of a reference mark on the first substrate, and the second chuck stage further includes a second image sensor, the second image sensor being disposed between the second electromagnetic elements and capable of capturing an image of a reference mark on the second substrate. ### Claim 6 (depends on 4) The substrate bonding apparatus according to claim 4, further comprising a controller that controls one element of the first electromagnetic elements and another element different from the one element of the first electromagnetic elements independently of each other and that controls one element of the second electromagnetic elements and another element different from the one element of the second electromagnetic elements independently of each other. ### Claim 7 (depends on 6) The substrate bonding apparatus according to claim 6, wherein the controller controls adjoining two elements among the plurality of first electromagnetic elements to become different poles, and controls adjoining two elements among the plurality of second electromagnetic elements to become different poles. ### Claim 8 (depends on 6) The substrate bonding apparatus according to claim 6, wherein the controller increases, as time passes, the number of the first electromagnetic elements to generate electromagnetic force among the plurality of the first electromagnetic elements, and increases, as time passes, the number of the second electromagnetic elements to generate electromagnetic force among the plurality of the second electromagnetic elements. ### Claim 9 (depends on 6) The substrate bonding apparatus according to claim 6, wherein the controller changes, as time passes, the first electromagnetic elements to generate electromagnetic force among the plurality of the first electromagnetic elements from that in a center region of the first chuck surface to that in an outer region of the first chuck surface, and changes, as time passes, the second electromagnetic elements to generate electromagnetic force among the plurality of the second electromagnetic elements from that in a center region of the second chuck surface to that in an outer region of the second chuck surface. ### Claim 10 (depends on 6) The substrate bonding apparatus according to claim 6, wherein the controller causes one pair of the first electromagnetic element and the second electromagnetic element among multiple pairs of the first electromagnetic elements and the second electromagnetic elements, each pair of the first electromagnetic element and the second electromagnetic element facing each other to generate magnetic forces of opposite polarities. ### Claim 11 (depends on 6) The substrate bonding apparatus according to claim 6, wherein the controller causes one pair of the first electromagnetic element and the second electromagnetic element among multiple pairs of the first electromagnetic elements and the second electromagnetic elements, each pair of the first electromagnetic element and the second electromagnetic element facing each other to generate magnetic forces of the same polarity. ### Claim 12 (depends on 1) The substrate bonding apparatus according to claim 1, wherein the first chuck stage further includes a first elastic member covering the first electromagnetic force generation unit on a side corresponding to the first substrate, and the second chuck stage further includes a second elastic member covering the second electromagnetic force generation unit on a side corresponding to the second substrate. ### Claim 13 (depends on 2) The substrate bonding apparatus according to claim 2, wherein the first chuck stage further includes a first elastic member covering the plurality of first electromagnetic elements on a side corresponding to the first substrate, the first elastic member being constructed integrally, and the second chuck stage further includes a second elastic member covering the plurality of second electromagnetic elements on a side corresponding to the second substrate, the second elastic member being constructed integrally. ### Claim 14 (depends on 13) The substrate bonding apparatus according to claim 13, further comprising a controller that controls the first electromagnetic elements independently of each other according to a back surface shape of the first substrate and that controls the second electromagnetic elements independently of each other according to a back surface shape of the second substrate. ### Claim 15 (depends on 14) The substrate bonding apparatus according to claim 14, wherein the controller causes one pair of the first electromagnetic element and the second electromagnetic element among multiple pairs of the first electromagnetic elements and the second electromagnetic elements, each pair of the first electromagnetic element and the second electromagnetic element facing each other to generate magnetic forces of opposite polarities. ### Claim 16 (depends on 14) The substrate bonding apparatus according to claim 14, wherein the controller causes one pair of the first electromagnetic element and the second electromagnetic element among multiple pairs of the first electromagnetic elements and the second electromagnetic elements, each pair of the first electromagnetic element and the second electromagnetic element facing each other to generate magnetic forces of the same polarity. ### Claim 17 (depends on 2) The substrate bonding apparatus according to claim 2, wherein the plurality of first electromagnetic elements are controlled independently of each other, the plurality of second electromagnetic elements are controlled independently of each other, a first electromagnetic element supplied with a current among the plurality of first electromagnetic elements generates electromagnetic force, a second electromagnetic element supplied with a current among the plurality of second electromagnetic elements generates electromagnetic force.