# US 12,002,690 B2 · System for fracturing a plurality of wafer assemblies > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,690 B2 - Document ID: US12002690B2 - Status: Granted - Kind: B2 - Application number: 17/435,899 - Filed: 2020-02-26 - Published: 2022-06-09 - Granted: 2024-06-04 - Earliest claimed: 2019-03-15 - Assignees: Soitec - Applicants: Soitec - Inventors: Didier Landru; Oleg Kononchuk; Nadia Ben Mohamed - Web page: https://patentgrep.com/patent/US12002690B2 ## CPC - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/0404: {for general liquid treatment, e.g. etching followed by cleaning} - H10P 90/1916: {with separation or delamination along an ion implanted layer, e.g. Smart-cut} - H10W 10/181: {Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A system for fracturing a plurality of wafer assemblies, one of the wafers of each assembly comprising a plane of weakness and each assembly comprising a peripheral lateral groove comprises: a cradle for keeping the assemblies of the plurality of assemblies spaced apart and parallel to one another, along a storage axis; a separation device for applying separating forces in the peripheral groove of an assembly arranged in a fracture zone of the separating device, the separating force aiming to separate the wafers of the assembly from one another so as to initiate its fracture at the plane of weakness; and a drive device configured to move along the storage axis of the cradle opposite the separating device so as to successively place an assembly of the cradle in the fracture zone of the separation device. ## Claims ### Claim 1 A system for fracturing a plurality of wafer assemblies, one wafer of each assembly comprising an embrittlement plane and each assembly comprising a peripheral side groove, the system comprising: a cradle configured to keep the assemblies of the plurality of wafer assemblies spaced apart from and parallel to each other along a storage axis; a separation device configured to apply separation forces in the peripheral side groove of an assembly disposed in a fracture zone of the separation device, the separation forces being intended to separate wafers of the assembly from each other so as to initiate the fracturing thereof on the embrittlement plane; and a drive device configured to move along an axis for storing the cradle opposite the separation device so as to successively place an assembly of the cradle in the fracture zone of the separation device. ### Claim 2 (depends on 1) The system of claim 1, wherein a distance separating two assemblies in the cradle is constant. ### Claim 3 (depends on 1) The system of claim 1, wherein the fracture zone is configured to accommodate a single assembly and the separation device processes one assembly at a time. ### Claim 4 (depends on 1) The system of claim 1, wherein the drive device is configured to provide relative movement between the cradle and the separation device at a constant speed. ### Claim 5 (depends on 1) The system of claim 1, wherein the drive device is configured to provide relative movement between the cradle and the separation device in a step-by-step manner. ### Claim 6 (depends on 1) The system of claim 1, wherein the drive device is a cradle support of a furnace. ### Claim 7 (depends on 6) The system of claim 6, wherein the cradle rests on the cradle support. ### Claim 8 (depends on 1) The system of claim 1, wherein the separation device is fixed. ### Claim 9 (depends on 1) The system of claim 1, wherein the separation device comprises a compressor configured to generate a high-pressure fluid jet. ### Claim 10 (depends on 9) The system of claim 9, wherein the separation device further comprises a nozzle for shaping the fluid jet. ### Claim 11 (depends on 1) The system of claim 1, wherein the separation device comprises a tool disposed at an end of a movable arm. ### Claim 12 (depends on 1) The system of claim 1, wherein the cradle comprises a separation part. ### Claim 13 (depends on 12) The system of claim 12, wherein the separation part has a plurality of blades engaged in the peripheral side grooves of the plurality of wafer assemblies, when the wafer assemblies of the plurality are housed in the cradle. ### Claim 14 (depends on 13) The system of claim 13, wherein the separation device is comprises a presser device configured to apply a force on an assembly guided toward the separation part. ### Claim 15 (depends on 1) The system of claim 1, wherein the separation device comprises an endless screw having a helical thread, with a blade being disposed in the helical thread adjacent the fracture zone. ### Claim 16 A method for fracturing a plurality of assemblies of wafers disposed in a cradle, wherein the plurality of assemblies of wafers are kept spaced apart from and parallel to each other, one of the wafers of each assembly comprising an embrittlement plane and each assembly comprising a peripheral side groove, the method comprising the following steps: moving the cradle along an axis so that the cradle is opposite a separation device so as to successively place an assembly of the cradle in a fracture zone of the separation device; and applying, using the separation device, separation forces in the peripheral side groove of the assembly disposed in the fracture zone, the separation forces separating the wafers of the assembly from each other so as to initiate the fracturing thereof on the embrittlement plane. ### Claim 17 (depends on 2) The system of claim 2, wherein the fracture zone is configured to accommodate a single assembly and the separation device processes one assembly at a time. ### Claim 18 (depends on 17) The system of claim 17, wherein the drive device is a cradle support of a furnace, and wherein the cradle is carried by the cradle support. ### Claim 19 (depends on 18) The system of claim 18, wherein the separation device comprises a compressor configured to generate a high-pressure fluid jet. ### Claim 20 (depends on 18) The system of claim 18, wherein the separation device comprises a tool disposed at an end of a movable arm.