# US 12,002,677 B2 · Processing device and processing method for solid structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,677 B2 - Document ID: US12002677B2 - Status: Granted - Kind: B2 - Application number: 17/742,440 - Filed: 2022-05-12 - Published: 2022-11-17 - Granted: 2024-06-04 - Earliest claimed: 2021-05-14 - Assignees: Highlight Tech Corp.; Finesse Technology Co., Ltd. - Applicants: Highlight Tech Corp.; Finesse Technology Co., Ltd. - Inventors: Chwung-Shan Kou; Wen-Yung Yeh - Web page: https://patentgrep.com/patent/US12002677B2 ## CPC - B23K 26/0622: by shaping pulses - H10P 34/42: with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) - B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)} - B23K 26/122: in a liquid, e.g. underwater - B23K 26/127: {in an enclosure} - B23K 26/346: in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding - B23K 26/359: by providing a line or line pattern, e.g. a dotted break initiation line - B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks - H10P 72/0436: {mainly by radiation} - B23K 2101/40: Semiconductor devices - B23K 2103/56: {being semiconducting} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas. ## Claims ### Claim 1 A processing device for a solid structure for performing a processing procedure, at least comprising: a laser source for providing a laser energy to a processing target area of the solid structure in a modification step of the processing procedure; and a microwave or radio-frequency source for providing a microwave or radio-frequency energy to the solid structure in the modification step of the processing procedure, wherein the processing target area of the solid structure weaken atomic bond structures or change a crystallinity of the processing target area by the laser energy and the microwave or radio-frequency energy, which achieve a forward cycle effect on the processing target area, to become a modified layer. ### Claim 2 (depends on 1) The processing device for the solid structure as claimed in claim 1, further comprising a heat source for heating the solid structure in the modification step of the processing procedure. ### Claim 3 (depends on 2) The processing device for the solid structure as claimed in claim 2, wherein the heat source is the laser source, the microwave or radio-frequency source, a heated liquid tank, another laser source, another microwave or radio-frequency source or an infrared light source. ### Claim 4 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein the solid structure is immersed in a liquid. ### Claim 5 (depends on 1) The processing device for the solid structure as claimed in claim 1, further comprising a detection and control unit for detecting a formation state of the modified layer of the solid structure in a detection and control step of the processing procedure, thereby the laser energy provided by the laser source being fed back and controlled, the microwave or radio-frequency energy provided by the microwave or radio-frequency source being fed back and controlled or the laser energy provided by the laser source and the microwave or radio-frequency energy provided by the microwave or radio-frequency source being fed back and controlled. ### Claim 6 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein the laser energy provided by the laser source is correspondingly adjusted according to the microwave or radio-frequency energy provided by the microwave or radio-frequency source. ### Claim 7 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein the microwave or radio-frequency energy provided by the microwave or radio-frequency source is correspondingly adjusted according to the laser energy provided by the laser source. ### Claim 8 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein the laser source provides the laser energy by generating a pulsed light, and the microwave or radio-frequency source provides the microwave or radio-frequency energy by continuously or intermittently generating an electromagnetic wave. ### Claim 9 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein the laser source and the microwave or radio-frequency source are capable of respectively providing the laser energy and the microwave or radio-frequency energy in sequence or simultaneously to make the processing target area of the solid structure become the modified layer. ### Claim 10 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein the laser source is capable of adjusting a depth at which a focal point of a pulsed light generated by the laser source correspondingly to irradiate the solid structure according to a form of the solid structure. ### Claim 11 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein the laser source uses a single pulsed light or a plurality of pulsed lights to form a plurality of focal points to irradiate the processing target area of the solid structure. ### Claim 12 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein the laser source irradiates the processing target area of the solid structure with a plurality of pulsed lights of different wavelengths. ### Claim 13 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein a direction in which the microwave or radio-frequency source provides the microwave or radio-frequency energy to the solid structure is the same as a direction in which the laser source provides the laser energy to the solid structure. ### Claim 14 (depends on 1) The processing device for the solid structure as claimed in claim 1, wherein a direction in which the microwave or radio-frequency source provides the microwave or radio-frequency energy to the solid structure is different from a direction in which the laser source provides the laser energy to the solid structure. ### Claim 15 A processing method for a solid structure for performing a processing procedure, the processing procedure comprising a following step of: performing a modification step, wherein the modification step comprises: using a laser source to provide a laser energy to a processing target area of the solid structure; and using a microwave or radio-frequency source to provide a microwave or radio-frequency energy to the solid structure, wherein the processing target area of the solid structure weaken atomic bond structures or change a crystallinity of the processing target area by the laser energy and the microwave or radio-frequency energy, which achieve a forward cycle effect on the processing target area, to become a modified layer. ### Claim 16 (depends on 15) The processing method for the solid structure as claimed in claim 15, wherein in or after the modification step, further comprising performing a heating step to heat the solid structure with a heat source. ### Claim 17 (depends on 15) The processing method for the solid structure as claimed in claim 15, wherein a hardness or a stress of the modified layer of the solid structure is different from that of other areas of the solid structure. ### Claim 18 (depends on 15) The processing method for the solid structure as claimed in claim 15, wherein after the modification step is performed, further comprising performing a subsequent step on the solid structure, the subsequent step is selected from a group consisting of cutting, slicing, thinning, grinding, polishing, coating, vapor deposition, lithography, photolithography, etching and diffusion. ### Claim 19 (depends on 15) The processing method for the solid structure as claimed in claim 15, wherein the processing target area is located in a depth or on a surface of the solid structure. ### Claim 20 (depends on 19) The processing method for the solid structure as claimed in claim 19, wherein the processing target area is located in partial areas of the solid structure. ### Claim 21 (depends on 15) The processing method for the solid structure as claimed in claim 15, wherein the laser energy provided by the laser source for modifying the processing target area is correspondingly adjusted according to the microwave or radio-frequency energy provided by the microwave or radio-frequency source, or the microwave or radio-frequency energy provided by the microwave or radio-frequency source for heating the processing target area is correspondingly adjusted according to the laser energy provided by the laser source.