# US 12,002,667 B2 · Sputtering apparatus and method of controlling sputtering apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,667 B2 - Document ID: US12002667B2 - Status: Granted - Kind: B2 - Application number: 17/556,025 - Filed: 2021-12-20 - Published: 2022-06-30 - Granted: 2024-06-04 - Earliest claimed: 2020-12-24 - Assignees: Tokyo Electron Limited - Applicants: Tokyo Electron Limited - Inventors: Masato Shinada; Tetsuya Miyashita; Einstein Noel Abarra - Web page: https://patentgrep.com/patent/US12002667B2 ## CPC - H01J 37/3441: {Dark space shields} - C23C 14/044: {using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient} - C23C 14/34: Sputtering - C23C 14/50: Substrate holders - C23C 14/54: Controlling or regulating the coating process - H01J 37/32715: {Workpiece holder} - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) ## Abstract There is provided a sputtering apparatus comprising: a target from which sputtered particles are emitted; a substrate support configured to support a substrate; a substrate moving mechanism configured to move the substrate in one direction; and a shielding member disposed between the target and the substrate support and having an opening through which the sputtered particles pass. The shielding member includes a first shielding member and a second shielding member disposed in a vertical direction. ## Claims ### Claim 1 A sputtering apparatus comprising: a processing chamber including: a chamber main body with an open upper portion; and a cover provided to close the open upper portion of the chamber main body; a target from which sputtered particles are emitted; a substrate support configured to support a substrate; a substrate moving mechanism configured to move the substrate in horizontal direction; a shielding member disposed between the target and the substrate support and having an opening through which the sputtered particles pass, wherein the shielding member includes a first shielding member, a second shielding member, and a third shielding member, the first shielding member arranged over the second shielding member, the second shielding member arranged over the third shielding member, and the third shielding member being apart from the substrate, and wherein an edge portion of the third shielding member is fixed to a side wall of the chamber main body; a target holder fixed on the cover, wherein the target holder holds the target on a front side of the target holder; a magnet disposed on a back side of the target holder and configured to reciprocate; a first driver configured to drive the first shielding member in horizontal direction; and a second driver configured to rotate the second shielding member, the second shielding member having a plate shape and rotating horizontally about an axis which is perpendicular to a top surface of the second shielding member. ### Claim 2 (depends on 1) The sputtering apparatus of claim 1, wherein the first driver moves the first shielding member in a moving direction of the substrate with respect to the second shielding member. ### Claim 3 (depends on 1) The sputtering apparatus of claim 1, wherein the first driver moves the first shielding member in a direction in which the first shielding member moves away from or approaches the second shielding member. ### Claim 4 (depends on 2) The sputtering apparatus of claim 2, wherein the first driver moves the first shielding member in a direction in which the first shielding member moves away from or approaches the second shielding member. ### Claim 5 (depends on 1) The sputtering apparatus of claim 1, further comprising a controller configured to control the driver, wherein the controller is configured to control the first driver and the second driver based on progress of consumption of the target. ### Claim 6 (depends on 2) The sputtering apparatus of claim 2, further comprising a controller configured to control the driver, wherein the controller is configured to control the first driver and the second driver based on progress of consumption of the target. ### Claim 7 (depends on 5) The sputtering apparatus of claim 5, wherein the first shielding member has a first opening having a protruding part, the second shielding member has a second opening, and the opening of the shielding member is formed by the first opening and the second opening. ### Claim 8 (depends on 7) The sputtering apparatus of claim 7, wherein the controller is configured to control the protruding part to protrude into the second opening based on the progress of consumption of the target. ### Claim 9 (depends on 5) The sputtering apparatus of claim 5, wherein the controller is configured to control the first driver and the second driver based on at least one of electric power supplied to the target, a discharge voltage, a current value supplied to the target, a temperature of cathode cooling water, and a torque of a motor of a magnet scanning mechanism. ### Claim 10 (depends on 7) The sputtering apparatus of claim 7, wherein the controller is configured to control the first driver and the second driver based on at least one of electric power supplied to the target, a discharge voltage, a current value supplied to the target, a temperature of cathode cooling water, and a torque of a motor of a magnet scanning mechanism. ### Claim 11 (depends on 5) The sputtering apparatus of claim 5, wherein the controller is configured to control the first driver and the second driver to close the opening of the shielding member. ### Claim 12 (depends on 7) The sputtering apparatus of claim 7, wherein the controller is configured to control the first driver and the second driver to close the opening of the shielding member. ### Claim 13 A method of controlling a sputtering apparatus which includes: a processing chamber including: a chamber main body with an open upper portion; and a cover provided to close the open upper portion of the chamber main body; a target from which sputtered particles are emitted; a substrate support configured to support a substrate; a substrate moving mechanism configured to slide the substrate in horizontal direction; a shielding member disposed between the target and the substrate support, having an opening through which the sputtered particles pass, and including a first shielding member, a second shielding member, and a third shielding member, the first shielding member arranged over the second shielding member, the second shielding member arranged over the third shielding member, and the third shielding member being apart from the substrate, wherein an edge portion of the third shielding member is fixed to a side wall of the chamber main body; a target holder fixed on the cover, wherein the target holder holds the target on a front side of the target holder; a magnet disposed on a back side of the target holder and configured to reciprocate; a first driver configured to drive the first shielding member in horizontal direction; and a second driver configured to rotate the second shielding member, the second shielding member having a plate shape and rotating horizontally about an axis which is perpendicular to a top surface of the second shielding member, wherein the method comprises controlling the driver based on progress of consumption of the target.