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US 12,002,643 B2Granted
Ceramic printed fuse fabrication
AssigneeEaton Intelligent Power Limited
InventorsVenkat raman Thenkarai Narayanan, Miroslav Horky, Robert Stephen Douglass, John Trublowski
Life of this patent
Estimating the term…
Abstract
A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible operation of the fusible element, respectively separated by portions of increased printed thickness.
Claims20
A printed fuse fabrication comprising:
- a substrate;
- a fusible element coupled to a top portion of the substrate in successive layers of conductive material, the fusible element including a series of portions of reduced thickness respectively separated by portions of increased thickness, the portions of reduced thickness defining weak spots for fusible operation of the fusible element, wherein the portions of reduced thickness correspond to a number of layers of the fusible element on top of the substrate that is less than a number of layers of the fusible element on top of the substrate corresponding to the portions of increased thickness;
- and
- a dielectric layer coupled to the substrate beneath the fusible element, the dielectric layer underlying only the portions of reduced thickness defining the weak spots of the fusible element.
1 more element
A printed fuse fabrication comprising:
- a substrate;
- a fusible element coupled to a top portion of the substrate, the fusible element including a series of portions of reduced thickness respectively separated by portions of increased thickness, the portions of reduced thickness defining weak spots for fusible operation of the fusible element, wherein the fusible element comprises a base layer coupled to the top portion of the substrate and a plurality of intermediate layers coupled to sections on top of the base layer, wherein the portions of reduced thickness correspond to the base layer and the portions of increased thickness correspond to the plurality of intermediate layers coupled to the sections on top of the base layer;
- and
- a dielectric layer coupled to the substrate beneath the fusible element, the dielectric layer underlying only the portions of reduced thickness defining the weak spots of the fusible element.
1 more element
Dependencies are inferred from the claim text.