# US 12,001,095 B2 · Backlight module, manufacturing method thereof, and liquid crystal display device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,001,095 B2
- Document ID: US12001095B2
- Status: Granted
- Kind: B2
- Application number: 17/288,664
- Filed: 2021-03-15
- Published: 2023-05-11
- Granted: 2024-06-04
- Earliest claimed: 2021-02-10
- Assignees: Tcl China Star Optoelectronics Technology Co., Ltd.
- Applicants: Tcl China Star Optoelectronics Technology Co., Ltd.
- Inventors: Juncheng Xiao; Yan Li; Bin Zhao; Ji Li
- Web page: https://patentgrep.com/patent/US12001095B2

## CPC

- G02F 1/133603: {with LEDs}
- H10H 20/856: Reflecting means
- G02F 1/133605: {including specially adapted reflectors}
- H10H 20/01: Manufacture or treatment
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- G02F 1/133612: {Electrical details}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/0364: {of interconnections}
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

The application provides a backlight module, a manufacturing method thereof, and a liquid crystal display device. The backlight module includes a substrate, and a light-emitting chip and a reflective layer disposed on the substrate. Wherein, the reflective layer has a hollowed-out region, the light-emitting chip is electrically connected to the substrate in the hollowed-out region, and a projection of an edge of the hollowed-out region on the substrate is at least partially within a coverage of a projection of the light-emitting chip on the substrate to improve luminous efficiency.

## Claims

### Claim 1

A backlight module, comprising:
a substrate and a light-emitting chip and a reflective layer disposed on the substrate; wherein the reflective layer comprises a hollowed-out region, the light-emitting chip is electrically connected to the substrate in the hollowed-out region, and a projection of an edge of the hollowed-out region on the substrate is at least partially positioned within a coverage of a projection of the light-emitting chip on the substrate, the light-emitting chip comprises a chip body and a pin layer electrically connected to the chip body, a top surface of the reflective layer is located below the bottom surface of the chip body, a surface of the substrate is disposed with a pad layer, and the pin layer is electrically connected to the pad layer through a conductive layer in the hollowed-out region, a distance between a projection of any one of the conductive layer or the pin layer on the substrate and the projection of the edge of the hollowed-out region on the substrate is greater than a third predetermined value, the pin layer comprises a first pin and a second pin, the conductive layer comprises a first conductor and a second conductor, and any one of the first conductor, the second conductor, the first pin, and the second pin are spaced from the reflective layer.

### Claim 2 (depends on 1)

The backlight module according to claim 1, wherein
the projection of the edge of the hollowed-out region on the substrate is positioned within the projection of the light-emitting chip on the substrate, and a distance between the edge of the hollowed-out region and the projection of the light-emitting chip on the substrate is greater than a first predetermined value.

### Claim 3 (depends on 1)

The backlight module according to claim 1, wherein
the pad layer comprises a first pad and a second pad, and the hollowed-out region comprises a first hollowed-out sub-region and a second hollowed-out sub-region, wherein the first pin in the first hollowed-out sub-region is electrically connected to the first pad through the first conductor, the second pin in the second hollowed-out sub-region is electrically connected to the second pad through the second conductor, and the reflective layer is further disposed between the first hollowed-out sub-region and the second hollowed-out sub-region.

### Claim 4 (depends on 3)

The backlight module according to claim 3, wherein a thickness of the second conductor is about 35 microns, a thickness of the reflective material is 1-30 microns, the thicknesses of the first pin and the second pin range between 0.1-50 microns, and the thicknesses of the first pad and the second pad range between 0.1-50 microns.

### Claim 5 (depends on 3)

The backlight module according to claim 3, wherein a length of the light-emitting chip is defined as M, a distance between an edge of the light-emitting chip and an edge of the first pin is defined as L, a distance between an edge of the reflective layer and an edge of the first pin is defined as D, a thickness of the reflective layer is defined as T, a thickness of the first pin is defined as Tp, a thickness of the conductor is defined as Tw, a distance between the first pin and the second pin is defined as A, and a width of the first pin is defined as W, where W=(M−2L−A)/2, wherein, W>15 microns, L>33 microns, A>21 microns, and M>80 microns.

### Claim 6 (depends on 1)

The backlight module according to claim 1, wherein
a projection of the chip body on the substrate covers a part of a projection of the pad layer on the substrate, and the reflective layer is at least partially disposed on a surface of the pad layer.

### Claim 7 (depends on 1)

The backlight module according to claim 1, wherein
a projection of the chip body on the substrate entirely covers a projection of the pad layer on the substrate, and the reflective layer is at least partially disposed on the surface of the substrate.

### Claim 8 (depends on 1)

The backlight module according to claim 1, wherein part of the reflective layer is partially disposed on a surface of the substrate, and another part of the reflective layer is disposed on surfaces of the first pad and the second pad; or
an entire one of the reflective layer is disposed on a surface of the substrate.

### Claim 9

A manufacturing method of a backlight module, comprising:
providing a substrate, and fabricating a reflective layer with a hollowed-out region on the substrate; and
electrically connecting a light-emitting chip to the substrate in the hollowed-out region,
wherein a projection of an edge of the hollowed-out region on the substrate is at least partially positioned within a coverage of a projection of the light-emitting chip on the substrate, and the light-emitting chip comprises a chip body and a pin layer electrically connected to the chip body, a top surface of the reflective layer is located below the bottom surface of the chip body, a surface of the substrate is disposed with a pad layer, and the pin layer is electrically connected to the pad layer through a conductive layer in the hollowed-out region, a distance between a projection of any one of the conductive layer or the pin layer on the substrate and the projection of the edge of the hollowed-out region on the substrate is greater than a third predetermined value, the pin layer comprises a first pin and a second pin, the conductive layer comprises a first conductor and a second conductor, and any one of the first conductor, the second conductor, the first pin, and the second pin are spaced from the reflective layer.

### Claim 10 (depends on 9)

The manufacturing method of the backlight module according to claim 9, wherein
the projection of the edge of the hollowed-out region on the substrate is positioned within the projection of the light-emitting chip on the substrate, and a distance between the edge of the hollowed-out region and the projection of the light-emitting chip on the substrate is greater than a first predetermined value.

### Claim 11

A liquid crystal display device, comprising:
a liquid crystal display panel and a backlight module;
wherein the backlight module comprises a substrate and a light-emitting chip and a reflective layer disposed on the substrate, the reflective layer comprises a hollowed-out region, the light-emitting chip is electrically connected to the substrate in the hollowed-out region, and a projection of an edge of the hollowed-out region on the substrate is at least partially positioned within a coverage of a projection of the light-emitting chip on the substrate, and the light-emitting chip comprises a chip body and a pin layer electrically connected to the chip body, a top surface of the reflective layer is located below the bottom surface of the chip body, a surface of the substrate is disposed with a pad layer, and the pin layer is electrically connected to the pad layer through a conductive layer in the hollowed-out region, a distance between a projection of any one of the conductive layer or the pin layer on the substrate and the projection of the edge of the hollowed-out region on the substrate is greater than a third predetermined value, the pin layer comprises a first pin and a second pin, the conductive layer comprises a first conductor and a second conductor, and any one of the first conductor, the second conductor, the first pin, and the second pin are spaced from the reflective layer.

### Claim 12 (depends on 11)

The liquid crystal display device according to claim 11, wherein
the projection of the edge of the hollowed-out region on the substrate is positioned within the projection of the light-emitting chip on the substrate, and a distance between the edge of the hollowed-out region and the projection of the light-emitting chip on the substrate is greater than a first predetermined value.

### Claim 13 (depends on 11)

The liquid crystal display device according to claim 11, wherein
the pad layer comprises a first pad and a second pad, and the hollowed-out region comprises a first hollowed-out sub-region and a second hollowed-out sub-region, wherein the first pin in the first hollowed-out sub-region is electrically connected to the first pad through the first conductor, the second pin in the second hollowed-out sub-region is electrically connected to the second pad through the second conductor, and the reflective layer is further disposed between the first hollowed-out sub-region and the second hollowed-out sub-region.

### Claim 14 (depends on 11)

The liquid crystal display device according to claim 11, wherein
a projection of the chip body on the substrate covers a part of a projection of the pad layer on the substrate, and the reflective layer is at least partially disposed on a surface of the pad layer.

### Claim 15 (depends on 11)

The liquid crystal display device according to claim 11, wherein
a projection of the chip body on the substrate entirely covers a projection of the pad layer on the substrate, and the reflective layer is at least partially disposed on the surface of the substrate.

### Claim 16 (depends on 11)

The liquid crystal display device according to claim 11, wherein part of the reflective layer is partially disposed on a surface of the substrate, and another part of the reflective layer is disposed on surfaces of the first pad and the second pad; or
an entire one of the reflective layer is disposed on a surface of the substrate.