# US 12,001,056 B2 · Light coupling between stacked photonics chips

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- Number: US 12,001,056 B2
- Document ID: US12001056B2
- Status: Granted
- Kind: B2
- Application number: 17/834,375
- Filed: 2022-06-07
- Published: 2023-12-07
- Granted: 2024-06-04
- Earliest claimed: 2022-06-07
- Assignees: GlobalFoundries U.S. Inc.
- Applicants: GlobalFoundries U.S. Inc.
- Inventors: Bartlomiej Jan Pawlak; Michal Rakowski; Yusheng Bian
- Web page: https://patentgrep.com/patent/US12001056B2

## CPC

- G02B 6/12002: {Three-dimensional structures}
- G02B 6/2934: {Fibre ring resonators, e.g. fibre coils}
- G02B 6/12004: {Combinations of two or more optical elements}
- G02B 6/4215: {the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers (G02B6/4246 takes precedence)}
- G02B 6/1228: {Tapered waveguides, e.g. integrated spot-size transformers (for coupling with fibres G02B6/305)}
- G02B 2006/12147: {Coupler}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

Structures including stacked photonics chips and methods of fabricating a structure including stacked photonics chips. The structure comprises a first chip including a first waveguide core, a ring resonator adjacent to a portion of the first waveguide core, and a first dielectric layer over the first waveguide core and the ring resonator. The first dielectric layer has a first surface. The structure further comprises a second chip including a second waveguide core and a second dielectric layer over the second waveguide core. The second dielectric layer has a second surface adjacent to the first surface of the first dielectric layer, and the second waveguide core is positioned adjacent to the ring resonator.

## Claims

### Claim 1

A structure comprising:
a first chip including a first waveguide core, a first ring resonator adjacent to a portion of the first waveguide core, a first dielectric layer over the first waveguide core and the first ring resonator, a first semiconductor substrate, and a first buried oxide layer, the first semiconductor substrate separated from the first waveguide core and the first ring resonator by the first buried oxide layer, and the first dielectric layer having a first surface; and
a second chip including a second waveguide core, a second dielectric layer over the second waveguide core, a second ring resonator in the second dielectric layer, a second semiconductor substrate, and a second buried oxide layer, the second semiconductor substrate separated from the second waveguide core and the second ring resonator by the second buried oxide layer, the second dielectric layer having a second surface bonded to the first surface of the first dielectric layer, and the second ring resonator positioned adjacent to a portion of the second waveguide core.

### Claim 2 (depends on 1)

The structure of claim 1 wherein the first ring resonator is spaced in a lateral direction from the portion of the first waveguide core, and the second ring resonator is spaced in the lateral direction from a portion of the second waveguide core.

### Claim 3 (depends on 2)

The structure of claim 2 wherein the first ring resonator is spaced in a vertical direction from the second ring resonator.

### Claim 4 (depends on 1)

The structure of claim 1 wherein the first ring resonator has a first diameter and the second ring resonator has a second diameter that is equal to the first diameter.

### Claim 5 (depends on 1)

The structure of claim 1 wherein the first waveguide core and the first ring resonator have a first height, the first dielectric layer has a first thickness that is greater than the first height, the second waveguide core and the second ring resonator have a second height, and the second dielectric layer has a thickness that is greater than the second height.

### Claim 6 (depends on 1)

The structure of claim 1 wherein the first surface of the first dielectric layer directly contacts the second surface of the second dielectric layer.

### Claim 7 (depends on 1)

The structure of claim 1 wherein the first chip includes a first splitter, a third waveguide core coupled by the first splitter to the first waveguide core, and a third ring resonator adjacent to a portion of the third waveguide core, the first splitter is configured to divert a portion of the light propagating in the first waveguide core from the first waveguide core to the third waveguide core, and the first dielectric layer is positioned over the third waveguide core and the third ring resonator.

### Claim 8 (depends on 7)

The structure of claim 7 wherein the second chip includes a fourth ring resonator in a second overlapping relationship with the third ring resonator, and the third waveguide core includes a plurality of curved bends configured to laterally offset the routing of the third waveguide core relative to the first waveguide core.

### Claim 9 (depends on 8)

The structure of claim 8 wherein the first ring resonator is spaced in a vertical direction from the second ring resonator, and the fourth ring resonator is spaced in the vertical direction from the third ring resonator.

### Claim 10 (depends on 8)

The structure of claim 8 wherein the first chip includes a second splitter, a fourth waveguide core coupled by the second splitter to the first waveguide core, and a fifth ring resonator adjacent to a portion of the fourth waveguide core, the second splitter is configured to divert a portion of the light propagating in the first waveguide core from the first waveguide core to the fourth waveguide core, and the first dielectric layer is positioned over the fourth waveguide core and the fifth ring resonator.

### Claim 11 (depends on 10)

The structure of claim 10 wherein the second chip includes a sixth ring resonator in a third overlapping relationship with the fourth ring resonator, and the fourth waveguide core includes a plurality of curved bends configured to laterally offset the routing of the fourth waveguide core relative to the first waveguide core and relative to the third waveguide core.

### Claim 12 (depends on 8)

The structure of claim 8 wherein the first ring resonator has a first diameter, the second ring resonator has a second diameter equal to the first diameter, the third ring resonator has a third diameter equal to the first diameter, and the fourth ring resonator has a fourth diameter equal to the second diameter.

### Claim 13 (depends on 1)

The structure of claim 1 wherein the first waveguide core and the first ring resonator comprise silicon, and the second waveguide core and the second ring resonator comprise silicon.

### Claim 14 (depends on 1)

The structure of claim 1 wherein the first waveguide core and the first ring resonator comprise silicon nitride, and the second waveguide core and the second ring resonator comprise silicon nitride.

### Claim 15 (depends on 1)

The structure of claim 1 wherein the first ring resonator and the second ring resonator each comprise an annular waveguide core.

### Claim 16 (depends on 15)

The structure of claim 15 wherein the first ring resonator and the second ring resonator have an inner diameter in a range from 4 microns to 40 microns, the first ring resonator and the second ring resonator have an outer diameter in a range from 4 microns to 40 microns, and the outer diameter is greater than the inner diameter.

### Claim 17 (depends on 1)

The structure of claim 1 wherein the first ring resonator has a first center point, and the second ring resonator has a second center point that is laterally offset from the first center point of the first ring resonator.

### Claim 18

A method comprising:
forming a first chip including a first waveguide core, a first ring resonator adjacent to a portion of the first waveguide core, a first dielectric layer over the first waveguide core and the first ring resonator, a first semiconductor substrate, and a first buried oxide layer;
forming a second chip including a second waveguide core, a second dielectric layer over the second waveguide core, a second ring resonator in the second dielectric layer, a second semiconductor substrate, and a second buried oxide layer; and
bonding a first surface of the first dielectric layer to a second surface of the second dielectric layer,
wherein the first semiconductor substrate is separated from the first waveguide core and the first ring resonator by the first buried oxide layer, the second semiconductor substrate is separated from the second waveguide core and the second ring resonator by the second buried oxide layer, the second ring resonator is positioned adjacent to a portion of the second waveguide core, and the first ring resonator is positioned adjacent to the second ring resonator.

### Claim 19 (depends on 18)

The method of claim 18 wherein the first waveguide core and the first ring resonator are concurrently formed when forming the first chip, and the second waveguide core and the second ring resonator are concurrently formed when forming the second chip.

### Claim 20 (depends on 18)

The method of claim 18 wherein the first surface of the first dielectric layer is bonded to the second surface of the second dielectric layer after forming the first chip and the second chip.