# US 12,000,735 B2 · Substrate for sensing, a method of fabricating the substrate, and analyzing apparatus including the substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,000,735 B2 - Document ID: US12000735B2 - Status: Granted - Kind: B2 - Application number: 17/406,863 - Filed: 2021-08-19 - Published: 2021-12-09 - Granted: 2024-06-04 - Earliest claimed: 2017-05-25 - Assignees: Samsung Electronics Co., Ltd.; California Institute of Technology - Applicants: Samsung Electronics Co., Ltd.; California Institute of Technology - Inventors: Daejong Yang; Hyunjun Cho; Youngzoon Yoon; Hyuck Choo - Web page: https://patentgrep.com/patent/US12000735B2 ## CPC - G01J 3/4412: {Scattering spectrometry (particle sizing by light scattering G01N15/0205; optical velocimetry of particles G01P5/20, G01P5/26)} - B81C 1/00206: {Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties} - B82Y 15/00: Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors - B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites - C23C 18/06: Coating on selected surface areas, e.g. using masks - C23C 18/08: characterised by the deposition of metallic material - G01N 21/658: {enhancement Raman, e.g. surface plasmons} - B81B 2203/0361: Tips, pillars - B81B 2207/056: of static structures - B81C 2201/0104: Chemical-mechanical polishing [CMP] - G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A substrate for sensing, a method of manufacturing the substrate, and an analyzing apparatus including the substrate are provided. The substrate for sensing includes: a support layer; a plurality of metal nanoparticle clusters arranged on the support layer; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters. The plurality of metal nanoparticle clusters each comprise a plurality of metal nanoparticles stacked in a three-dimensional structure. Each of the plurality of perforations transmits incident light therethrough. ## Claims ### Claim 1 A substrate for sensing, comprising: a support layer; a seed layer on the support layer; a plurality of metal nanoparticle clusters arranged on the seed layer, each of the plurality of metal nanoparticle clusters comprising a plurality of conductive metal nanoparticles, and the plurality of conductive metal nanoparticles being stacked in a three-dimensional structure; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters, wherein each of the plurality of perforations transmits incident light therethrough such that the light excites conductive metal nanoparticles between an upper part of each of the plurality of metal nanoparticle clusters and a lower part of each of the plurality of metal nanoparticle clusters while the light is transmitted along each of the plurality of perforations, and wherein a mean size of each perforation from among the plurality of perforations defined by a mean interval between adjacent ones of the plurality of metal nanoparticle clusters is 8 nm to 20 nm. ### Claim 2 (depends on 1) The substrate for sensing of claim 1, wherein the support layer comprises a semiconductor wafer. ### Claim 3 (depends on 1) The substrate for sensing of claim 1, wherein the plurality of conductive metal nanoparticles comprise at least one conductive metal selected from gold (Au), silver (Ag), copper (Cu), and aluminum (Al). ### Claim 4 (depends on 1) The substrate for sensing of claim 1, wherein each of the plurality of metal nanoparticle clusters extends vertically from a surface of the seed layer. ### Claim 5 (depends on 4) The substrate for sensing of claim 4, wherein a thickness of each of the plurality of metal nanoparticle clusters is 50 nm to 1 μm. ### Claim 6 (depends on 1) The substrate for sensing of claim 1, wherein each of the plurality of perforations extend to a surface of the seed layer, such that each of the plurality of perforations transmits the incident light to the surface of the seed layer. ### Claim 7 (depends on 1) The substrate for sensing of claim 1, wherein a mean diameter of the plurality of conductive metal nanoparticles is 10 nm to 20 nm. ### Claim 8 (depends on 1) The substrate for sensing of claim 1, wherein the plurality of perforations are arranged at regular intervals. ### Claim 9 (depends on 1) The substrate for sensing of claim 1, wherein each perforation from among the plurality of perforations is positioned in a space remaining after a respective nanowire from among a plurality of nanowires has been dissolved during arrangement of the respective metal nanoparticle cluster. ### Claim 10 An analyzing apparatus comprising a substrate for sensing, wherein the substrate comprises: a support layer; a seed layer on the support layer; a plurality of metal nanoparticle clusters arranged on the seed layer, each of the plurality of metal nanoparticle clusters comprising a plurality of conductive metal nanoparticles, and the plurality of conductive metal nanoparticles being stacked in a three-dimensional structure; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters, wherein each of the plurality of perforations transmits incident light therethrough such that the light excites conductive metal nanoparticles between an upper part of each of the plurality of metal nanoparticle clusters and a lower part of each of the plurality of metal nanoparticle clusters while the light is transmitted along each of the plurality of perforations, and wherein a mean size of each perforation from among the plurality of perforations defined by a mean interval between adjacent ones of the plurality of metal nanoparticle clusters is 8 nm to 20 nm.