# US 12,000,158 B2 · Low-dust products using a wax emulsion > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,000,158 B2 - Document ID: US12000158B2 - Status: Granted - Kind: B2 - Application number: 17/068,169 - Filed: 2020-10-12 - Published: 2021-07-29 - Granted: 2024-06-04 - Earliest claimed: 2016-06-29 - Assignees: Henry Company, LLC - Applicants: Henry Company, LLC - Inventors: Amba Ayambem - Web page: https://patentgrep.com/patent/US12000158B2 ## CPC - E04F 21/1652: {for smoothing and shaping joint compound to a desired contour} - C09D 191/08: Mineral waxes - E04F 13/0889: {characterised by the joints between neighbouring elements, e.g. with joint fillings or with tongue and groove connections} - E04F 21/165: for finishing joints, e.g. implements for raking or filling joints, jointers (bricklayers' tools E04G21/16; repairing, e.g. filling cracks, E04G23/02 {; wallpaper scrapers or the like B44C7/02; implements for cleaning joints A47L13/10}) - E04F: FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS (windows, doors E06B) - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) ## Abstract The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound that comprises a dust-reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust-reduction additive also synergistically imparts water resistance and adhesion to the wall repair compounds to which it is added. More specifically, in one embodiment, the dust-reduction additive is an emulsion comprising colloidally-protected, wax-based microstructures comprising paraffin that is chemically encapsulated by polyvinyl alcohol. ## Claims ### Claim 1 A low-dust joint compound composition comprising: (i) a dust reduction additive emulsion comprising colloidally-protected wax-based (CPWB) microstructures: and (ii) a first water, wherein said dust reduction additive emulsion comprises said CPWB microstructure comprising: (A) a wax core, wherein said wax core comprises a paraffin component and a non-paraffin component, wherein said paraffin component comprises at least one linear alkane wax defined by the general formula CnH2n+2, where n ranges from 13-80, wherein said non-paraffin component comprises at least one wax selected from the group consisting of animal-based wax, plant-based wax, mineral wax, synthetic wax, a wax containing organic acids and/or esters, anhydrides, an emulsifier containing a mixture of organic acids and/or esters, and combinations thereof; and B) a polymeric shell, wherein said polymeric shell comprises at least one polymer selected from polyvinyl alcohol, polyvinyl alcohol copolymers, polyvinyl alcohol terpolymers, polyvinyl acetate, polyvinyl acetate copolymers, polyvinyl acetate terpolymers, cellulose ethers, polyethylene oxide, polyethyleneimines, polyvinylpyrrolidone, polyvinylpyrrolidone copolymers, polyethylene glycol, polyacrylamides and poly (N-isopropylamides), pullulan, sodium alginate, gelatin, starches, and combinations thereof. ### Claim 2 (depends on 1) The low-dust joint compound composition as recited in claim 1, wherein said polymeric shell comprises polyvinyl alcohol. ### Claim 3 (depends on 1) The low-dust joint compound composition as recited in claim 1, further comprising at least one component from a filler; a binder; a thickener; a non-leveling agent; a preservative; a rheology modifier; and a surfactant. ### Claim 4 (depends on 3) The low-dust joint compound composition as recited in claim 3, wherein: said filler is selected from the group consisting of calcium carbonate (CaCO3), calcium sulfate dihydrate (CaSO4 2H2O), calcium sulfate hemihydrate (CaSO4-1/2H2O), glass micro bubbles, mica, perlite, talc, limestone, pyrophyllite, silica, diatomaceous earth, and combinations thereof; said binder is selected from the group consisting of polyvinyl acetate, polyvinyl alcohol, ethylene vinyl acetate co-polymer, vinylacrylic copolymer, styrene butadiene, polyacrylamide, acrylic polymers, latex, natural starch, synthetic starch, casein, and combinations thereof; said thickener is selected from the group consisting of methyl cellulose, hydroxypropyl cellulose, hydroxypropyl methyl cellulose, hydroxyethyl cellulose, hydroxyethyl methyl cellulose, hydroxyethyl hydroxypropyl cellulose, ethyl hydroxyethyl cellulose, sodium carboxymethyl cellulose, and combinations thereof; and said non-leveling agent is selected from the group consisting of attapulgite clay, bentonite, illite, kaolin, sepiolite, clays mixed with starches, and combinations thereof. ### Claim 5 (depends on 3) The low-dust joint compound composition as recited in claim 3, further comprising at least one of cristobalite, a micro-roughened filler, clay, expanded perlite, and combinations thereof. ### Claim 6 (depends on 1) The low-dust joint compound composition as recited in claim 1, wherein said dust-reduction additive emulsion further comprises a second water; a base; and a dispersant. ### Claim 7 (depends on 6) The low-dust joint compound composition as recited in claim 6, wherein said dispersant is selected from a dispersant having sulfur; a dispersant having a sulfur-containing group in the compound; sulfonic acid (R—S(═O)2—OH); sulfonic acid salts, wherein the R groups is functionalized with hydroxyl, or carboxyl; lignosulfonate; lignosulfonic acid; naphthalene sulfonic acid; sulfonate salt of lignosulfonic acid; sulfonate salt of naphthalene sulfonic acid; derivatized lignosulfonic acid; derivatized naphthalene sulfonic acid; functionalized lignosulfonic acid; functionalized naphthalene sulfonic acid; magnesium sulfate; polycarboxylate; ammonium hepta molybdate; combination of ammonium hepta molybdate and starch; alkyl quaternary ammonium; montmorillonite clay; non-ionic surfactants; ionic surfactants; zwitterionic surfactants; and mixtures thereof. ### Claim 8 (depends on 6) The low-dust joint compound composition as recited in claim 6, wherein said base is selected from the group consisting of monoethanol amine; diethanol amine; triethanol amine; imidazole; potassium siliconate; and combinations thereof. ### Claim 9 (depends on 1) The low-dust joint compound composition as recited in claim 1, wherein the weight of said dust reduction additive emulsion is in the range of from about 0.1% to about 20% by weight of said low-dust joint compound composition. ### Claim 10 (depends on 9) The low-dust joint compound composition as recited in claim 9, wherein the weight of said dust reduction additive emulsion is in the range of from about 0.1% to about 10% by weight of said low-dust joint compound composition. ### Claim 11 (depends on 1) The low-dust joint compound composition as recited in claim 1, wherein the peak air-borne dust generation of said low-dust joint compound is less than 100 mg/m3. ### Claim 12 (depends on 1) The low-dust joint compound composition as recited in claim 1, wherein the quantity of dust generated upon sanding of said low-dust joint compound composition is reduced at least by 5%. ### Claim 13 (depends on 1) The low-dust joint compound composition as recited in claim 1, wherein the quantity of dust generated upon sanding of said low-dust joint compound composition is reduced at least by 80%. ### Claim 14 (depends on 1) The low-dust joint compound composition as recited in claim 1, further comprising at least one component from a silicone, a siliconate, a fluorinated compound, a stearate, or a combination thereof. ### Claim 15 (depends on 14) The low-dust joint compound of claim 14, wherein the silicones, siliconates, fluorinated compounds, or stearates are selected from the group consisting of metal siliconate salts, potassium siliconate, poly hydrogen methyl siloxane, polydimethyl siloxane, stearate-based salts, and combinations thereof. ### Claim 16 (depends on 1) A method of using said low-dust joint compound composition as recited in claim 1, said method comprising: (I) applying said composition to a joint between adjacent wallboard panels; (II) allowing said composition to dry; and (III) sanding said dried composition. ### Claim 17 (depends on 2) A method for reducing the quantity of dust generated by a joint-compound composition, said method comprising the steps of: (I) providing a joint-compound composition comprising a filler, a first water, binder, and at least one of a defoamer, wetting agent, preservative, fungicide, thickener, non-leveling agent, surfactant, and a solvent; and (II) subsequently adding a sufficient quantity of a dust-reduction additive emulsion as described in claim 2 to said joint-compound composition to reduce the quantity of dust generated by sanding the hardened joint-compound composition by at least 5%. ### Claim 18 (depends on 17) The method for reducing the quantity of dust generated by a joint compound as recited in claim 17, wherein the quantity of dust generated by sanding said hardened drywall joint-compound is reduced by at least 80%. ### Claim 19 (depends on 16) The method of claim 16, wherein said joint compound composition has a contact angle of about 60° to about 150°; and/or wherein said joint compound composition has a Cobb value of about 5.0 to about 100 g/m2.