# US 12,000,048 B2 · Pedestal for substrate processing chambers

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- Number: US 12,000,048 B2
- Document ID: US12000048B2
- Status: Granted
- Kind: B2
- Application number: 18/111,842
- Filed: 2023-02-20
- Published: 2023-06-29
- Granted: 2024-06-04
- Earliest claimed: 2019-01-15
- Assignees: Applied Materials, Inc.
- Applicants: Applied Materials, Inc.
- Inventors: Sarah Michelle Bobek; Venkata Sharat Chandra Parimi; Prashant Kumar Kulshreshtha; Vinay K. Prabhakar; Kwangduk Douglas Lee; Sungwon Ha; Jian Li
- Web page: https://patentgrep.com/patent/US12000048B2

## CPC

- C23C 16/4586: {Elements in the interior of the support, e.g. electrodes, heating or cooling devices}
- C23C 16/505: using radio frequency discharges
- C23C 16/4585: {Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds}
- C23C 16/46: characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence)
- H01J 37/32532: {Electrodes}
- H01J 37/32642: {Focus rings}
- H01J 37/32715: {Workpiece holder}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

Aspects of the present disclosure relate generally to pedestals, components thereof, and methods of using the same for substrate processing chambers. In one implementation, a pedestal for disposition in a substrate processing chamber includes a body. The body includes a support surface. The body also includes a stepped surface that protrudes upwards from the support surface. The stepped surface is disposed about the support surface to surround the support surface. The stepped surface defines an edge ring such that the edge ring is integrated with the pedestal to form the body that is monolithic. The pedestal also includes an electrode disposed in the body, and one or more heaters disposed in the body.

## Claims

### Claim 1

A pedestal for disposition in a substrate processing chamber suitable for use in semiconductor manufacturing, comprising:
a body, the body comprising a support surface, a stepped surface that protrudes upwards from the support surface, the stepped surface having an innermost surface extending upwards from the support surface, the stepped surface being disposed about the support surface to surround the support surface, and the stepped surface defining an edge ring such that the edge ring is monolithically integrated with the body;
a plurality of electrodes disposed in the body at a depth below the support surface, a first electrode of the plurality of electrodes being uncoated and contacting the body, a second electrode of the plurality of electrodes disposed at a second depth below the first electrode, the second electrode having a coating composed of a different material than the body and disposed radially outward of a distal end of the first electrode, the coating having a volumetric electrical resistivity that is greater than a volumetric electrical resistivity of the second electrode, the coating disposed on a first surface of the second electrode and a second surface of the second electrode opposite the first surface, and the coating having:
an inner radius aligned radially outward of a center of the body and inward of the innermost surface, and
an outer radius aligned radially outwardly of the innermost surface; and one or more heaters disposed in the body.

### Claim 2 (depends on 1)

The pedestal of claim 1, wherein the edge ring comprises a bevel on an upper end of the innermost surface.

### Claim 3 (depends on 2)

The pedestal of claim 2, wherein the edge ring has a volumetric electrical resistivity that is different than a volumetric electrical resistivity of the support surface.

### Claim 4 (depends on 3)

The pedestal of claim 3, wherein the volumetric electrical resistivity of the edge ring is less than the volumetric electrical resistivity of the support surface.

### Claim 5 (depends on 2)

The pedestal of claim 2, wherein the bevel extends between the innermost surface and the stepped surface.

### Claim 6 (depends on 1)

The pedestal of claim 1, wherein the coating is formed of one or more of a refractory oxide or a polymer.

### Claim 7 (depends on 1)

The pedestal of claim 1, wherein the inner radius of the coating is about 100 mm to about 140 mm.

### Claim 8

A pedestal for disposition in a substrate processing chamber suitable for use in semiconductor manufacturing, comprising:
a body comprising a support surface, the support surface comprising an inner region configured to support a substrate and an outer region to configured to support an edge ring, the outer region disposed outwardly of the inner region;
a first electrode disposed in the body at a first depth below the support surface, the first electrode being uncoated and contacting the body; and
a second electrode disposed in the body at a second depth below the support surface, the second depth greater than the first depth, the second electrode having a coating composed of a different material than the body and disposed radially outward of a distal end of the first electrode, the coating having a volumetric electrical resistivity that is greater than a volumetric electrical resistivity of the second electrode, the coating disposed on a first surface of the second electrode and a second surface of the second electrode opposite the first surface, and the coating having:
an inner radius aligned radially outward of a center of the body and inward of the outer region of the support surface, and
an outer radius aligned under the outer region of the support surface.

### Claim 9 (depends on 8)

The pedestal of claim 8, wherein the second depth is within a range of 1.25 mm to 7 mm.

### Claim 10 (depends on 8)

The pedestal of claim 8, wherein the second depth is greater than the first depth by about 1 mm.

### Claim 11 (depends on 8)

The pedestal of claim 8, wherein the coating is coated on the second electrode using one or more of skin coating, surface chemistry modification, electroplating, etching, oxidizing, vacuum-based metal deposition, plastic coating, and/or acid dipping.

### Claim 12 (depends on 8)

The pedestal of claim 8, wherein the second electrode that is aligned radially inside of the outer region of the support surface.

### Claim 13 (depends on 12)

The pedestal of claim 12, wherein the second electrode that is aligned under the outer region of the support surface.

### Claim 14

A pedestal body suitable for use in semiconductor manufacturing, comprising:
a support surface; and
a plurality of electrodes disposed at a depth below the support surface, a first electrode of the plurality of electrodes being uncoated and contacting the pedestal body, a second electrode of the plurality of electrodes having a coating composed of a different material than the pedestal body and disposed radially outward of the first electrode, the coating having a volumetric electrical resistivity that is greater than a volumetric electrical resistivity of the second electrode, the coating disposed on a first surface of the second electrode and a second surface of the second electrode opposite the first surface, the coating having an inner radius and an outer radius, the inner radius of the coating aligned radially outward of a center of the pedestal body.

### Claim 15 (depends on 14)

The pedestal body of claim 14, further comprising an edge ring, the edge ring comprising an innermost surface, an outer surface, an upper surface, and a bevel on an upper end of the innermost surface, the bevel extending between the innermost surface and the upper surface, the bevel includes a sloped profile that extends at an angle between the innermost surface and the upper surface of the edge ring, and the angle is measured between a first axis that extends upward and orthogonally from the support surface and a second axis that extends along the sloped profile of the bevel.

### Claim 16 (depends on 15)

The pedestal body of claim 15, wherein the angle is within a range of 10 degrees to 90 degrees.

### Claim 17 (depends on 16)

The pedestal body of claim 16, wherein the angle is within a range of 12 degrees to 18 degrees.

### Claim 18 (depends on 16)

The pedestal body of claim 16, wherein the edge ring is integrated with the pedestal body to form a body that is monolithic, the upper surface of the edge ring being disposed about the support surface to surround the support surface.

### Claim 19 (depends on 15)

The pedestal body of claim 15, wherein a volumetric electrical resistivity of the edge ring is less than a volumetric electrical resistivity of the pedestal body.

### Claim 20 (depends on 15)

The pedestal body of claim 15, wherein a first portion of the pedestal body having the edge ring comprises a first material, and a second portion of the pedestal body having the support surface comprises a second material that is different than the first material.
