# US 12,000,036 B2 · Substrate treating apparatus and substrate treating method

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,000,036 B2
- Document ID: US12000036B2
- Status: Granted
- Kind: B2
- Application number: 17/524,797
- Filed: 2021-11-12
- Published: 2022-06-02
- Granted: 2024-06-04
- Earliest claimed: 2020-11-30
- Assignees: SCREEN Holdings Co., Ltd.
- Applicants: SCREEN Holdings Co., Ltd.
- Inventors: Hirofumi Tonai
- Web page: https://patentgrep.com/patent/US12000036B2

## CPC

- C23C 14/351: {using a magnetic field in close vicinity to the substrate}
- H10P 72/7608: {characterised by a plurality of separate clamping members, e.g. clamping fingers}
- B25B 11/00: Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders (for holding or positioning work for welding, soldering, or cutting by applying heat locally B23K37/04; specially adapted to machine tools B23Q3/00)
- C23C 14/505: {for rotation of the substrates}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/7626: {characterised by the construction of the shaft}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B25B: TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING

## Abstract

Disclosed is a substrate treating apparatus for performing a predetermined treatment on a substrate. The apparatus includes: a holding mechanism including a plurality of support pins configured to rotate between a holding position and a delivery position, a first magnetic part configured to rotate the support pins individually between the holding position and the delivery position by switching surrounding magnetic poles, and a second magnetic part configured to rotate the support pins individually to the holding position by constantly applying a magnetic field to the first magnetic part; and a switching mechanism configured to apply no magnetic field of a third magnetic part to the first magnetic part normally and apply a magnetic field of the third magnetic part to the first magnetic part to rotate the support pins individually to the delivery position only when the substrate is delivered.

## Claims

### Claim 1

A substrate treating apparatus for performing a predetermined treatment on a substrate, the apparatus comprising:
a spin table configured to be rotatable around a vertical axis;
a rotational driving device configured to rotate the spin table in a horizontal plane;
a holding mechanism configured to hold the substrate in a horizontal posture while the substrate is spaced apart from a top face of the spin table, the holding mechanism including:
a plurality of support pins provided so as to be rotatable freely around the vertical axis on a part of the top face of the spin table adjacent to an outer circumference, and configured to rotate between a holding position contacting a periphery edge of the substrate for restricting movement of the substrate in a horizontal direction, and a delivery position spaced apart from the periphery edge of the substrate for allowing movement of the substrate;
a first magnetic part configured to rotate the support pins individually between the holding position and the delivery position by switching surrounding magnetic poles; and
a second magnetic part configured to rotate the support pins individually to the holding position by constantly applying a magnetic field to the first magnetic part; and
a switching mechanism provided with a third magnetic part having a larger magnetic force than that of the second magnetic part and configured to apply no magnetic field of the third magnetic part to the first magnetic part when the substrate is not being delivered and to apply a magnetic field of the third magnetic part to the first magnetic part to rotate the support pins individually to the delivery position only when the substrate is delivered;
wherein the first magnetic part and the second magnetic part are located concyclically around a rotation center of the spin table in plan view.

### Claim 2 (depends on 1)

The apparatus according to claim 1, wherein
the first magnetic part is connected to lower ends of the support pins protruding on a lower face of the spin table, and
the second magnetic part is located on the lower face of the spin table laterally of the first magnetic part.

### Claim 3 (depends on 2)

The apparatus according to claim 2, wherein
the switching mechanism includes a lifting mechanism configured to move the third magnetic part upward and downward, and
wherein the lifting mechanism rotates the support pins to the delivery position by approaching the third magnetic part to the first magnetic part through upward movement to approach the spin table, and rotates the support pins to the holding position by moving the third magnetic part away from the first magnetic part through downward movement to move away from the spin table, the downward movement being performed when the substrate is not being delivered.

### Claim 4 (depends on 2)

The apparatus according to claim 2, wherein
the third magnetic part is located closer to the rotation center of the spin table than the first magnetic part and the second magnetic part in plan view.

### Claim 5 (depends on 1)

The apparatus according to claim 1, wherein
the switching mechanism includes a lifting mechanism configured to move the third magnetic part upward and downward, and
wherein the lifting mechanism rotates the support pins to the delivery position by approaching the third magnetic part to the first magnetic part through upward movement to approach the spin table, and rotates the support pins to the holding position by moving the third magnetic part away from the first magnetic part through downward movement to move away from the spin table, the downward movement being performed when the substrate is not being delivered.

### Claim 6 (depends on 1)

The apparatus according to claim 1, wherein
the third magnetic part is located closer to the rotation center of the spin table than the first magnetic part and the second magnetic part in plan view.

### Claim 7 (depends on 1)

The apparatus according to claim 1, further comprising:
a cover that is located so as to cover the rotational driving device below the spin table and has resistance to a treatment liquid supplied to the substrate, wherein
the third magnetic part is located within the cover.

### Claim 8 (depends on 1)

The apparatus according to claim 1, wherein
the spin table has a plurality of through holes penetrating from the top face to a lower face thereof, into which the support pins are individually inserted, and
the spin table includes notches that are formed such that portions thereof around the through holes are each lower than the top face and are cut out toward an outer circumferential face of the spin table.

### Claim 9 (depends on 1)

The apparatus according to claim 1, wherein
the support pins each include a cylindrical shaft, and a support piece formed on an upper portion of the shaft and configured to contact a rear face and an outer periphery edge adjacent to the outer circumference of the substrate to support the substrate, and
the support piece has an elliptical shape in plan view, and a longitudinal axis of the support piece is brought into a posture along an outer periphery edge of the spin table when the support pins are rotated into the holding position.

### Claim 10

A substrate treating apparatus for performing a predetermined treatment on a substrate, the apparatus comprising:
a spin table configured to be rotatable around a vertical axis;
a rotational driving device configured to rotate the spin table in a horizontal plane;
a holding mechanism configured to hold the substrate in a horizontal posture while the substrate is spaced apart from a top face of the spin table, the holding mechanism including:
a plurality of support pins provided so as to be rotatable freely around the vertical axis on a part of the top face of the spin table adjacent to an outer circumference, and configured to rotate between a holding position contacting a periphery edge of the substrate for restricting movement of the substrate in a horizontal direction, and a delivery position spaced apart from the periphery edge of the substrate for allowing movement of the substrate;
a first magnetic part configured to rotate the support pins individually between the holding position and the delivery position by switching surrounding magnetic poles; and
a second magnetic part configured to rotate the support pins individually to the holding position by constantly applying a magnetic field to the first magnetic part; and
a switching mechanism provided with a third magnetic part having a larger magnetic force than that of the second magnetic part and configured to apply no magnetic field of the third magnetic part to the first magnetic part when the substrate is not being delivered and to apply a magnetic field of the third magnetic part to the first magnetic part to rotate the support pins individually to the delivery position only when the substrate is delivered;
wherein:
the spin table includes a carrier plate on a lower face of arrangement of the support pins that is configured to support the support pins,
the carrier plate includes a first end along an arc of the spin table, a second end opposite to the first end relative to the arc of the spin table, an attachment part for the support pins, the attachment part being formed adjacent to the first end, a round screw hole formed adjacent to the first end and configured to perform screwing and fixation to the spin table, a long threaded screw hole having a longitudinal axis in a radial direction of the spin table, formed adjacent to the second end, and configured to screw to the spin table, and
the first end is moved in the radial direction of the spin table while a screw in the long threaded screw hole is released for adjusting positions of the support pins in the radial direction of the spin table.
