# US 11,999,875 B2 · Polishing solution and polishing method

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- Number: US 11,999,875 B2
- Document ID: US11999875B2
- Status: Granted
- Kind: B2
- Application number: 17/438,808
- Filed: 2019-06-06
- Published: 2022-08-11
- Granted: 2024-06-04
- Earliest claimed: 2019-06-06
- Assignees: Resonac Corporation
- Applicants: Showa Denko Materials Co., Ltd.
- Inventors: Yuya Otsuka; Hisataka Minami; Shingo Kobayashi; Mayumi Komine; Hisato Takahashi
- Web page: https://patentgrep.com/patent/US11999875B2

## CPC

- C09G 1/02: containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)}
- H10P 95/062: {involving a dielectric removal step}
- C09G: POLISHING COMPOSITIONS (French polish C09F11/00); SKI WAXES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A polishing liquid containing: abrasive grains containing a metal oxide; at least one hydroxy acid compound selected from the group consisting of a hydroxy acid having a structure represented by General Formula (A1) below and a salt thereof; and water: [In the formula, R11 represents a hydrogen atom or a hydroxy group, R12 represents a hydrogen atom, an alkyl group, or an aryl group, n11 represents an integer of 0 or more, and n12 represents an integer of 0 or more; however, a case where both of R11 and R12 are a hydrogen atom is excluded.]

## Claims

### Claim 1

A polishing liquid comprising: abrasive grains containing a metal oxide; at least one hydroxy acid compound selected from the group consisting of a hydroxy acid having a structure represented by General Formula (A1) below and a salt thereof; and water:
wherein in the formula, R11 represents a hydrogen atom or a hydroxy group, R12 represents a hydrogen atom, an alkyl group, or an aryl group, n11 represents an integer of 0 or more, and n12 represents an integer of 0 or more; however, a case where both of R11 and R12 are a hydrogen atom is excluded and a case where R11 is a hydrogen atom, R12 is a methyl group, n11 is 0, and n12 is 0 is excluded, and
a ratio of a content of the hydroxy acid compound with respect to a content of the abrasive grains is 0.01 to 0.50.

### Claim 2 (depends on 1)

The polishing liquid according to claim 1, wherein the n11 in the General Formula (A1) is 0 or 1.

### Claim 3 (depends on 1)

The polishing liquid according to claim 1, wherein the n12 in the General Formula (A1) is 1.

### Claim 4 (depends on 1)

The polishing liquid according to claim 1, wherein the hydroxy acid compound contains at least one selected from the group consisting of glyceric acid, 2,2-bis(hydroxymethyl)propionic acid, 2,2-bis(hydroxymethyl)butyric acid, and hydroxyisobutyric acid.

### Claim 5 (depends on 1)

The polishing liquid according to claim 1, wherein a content of the hydroxy acid compound is 0.01 to 1.0% by mass.

### Claim 6 (depends on 1)

The polishing liquid according to claim 1, wherein the metal oxide contains cerium oxide.

### Claim 7 (depends on 1)

The polishing liquid according to claim 1, wherein a content of the abrasive grains is 0.10 to 3.0% by mass.

### Claim 8 (depends on 1)

The polishing liquid according to claim 1, further comprising an amino acid component.

### Claim 9 (depends on 8)

The polishing liquid according to claim 8, wherein the amino acid component contains glycine.

### Claim 10 (depends on 1)

The polishing liquid according to claim 1, wherein a pH is 1.0 to 7.0.

### Claim 11 (depends on 1)

The polishing liquid according to claim 1, wherein a pH is 3.0 to 5.0.

### Claim 12 (depends on 1)

The polishing liquid according to claim 1, further comprising an alkali component.

### Claim 13 (depends on 12)

The polishing liquid according to claim 12, wherein the alkali component contains aminothiazole.

### Claim 14 (depends on 12)

The polishing liquid according to claim 12, wherein the alkali component contains dimethylpyrazole.

### Claim 15 (depends on 1)

The polishing liquid according to claim 1, wherein the hydroxy acid compound contains at least one selected from the group consisting of glyceric acid, 2,2-bis(hydroxymethyl)propionic acid, 2,2-bis(hydroxymethyl)butyric acid, mandelic acid, and hydroxyisobutyric acid.

### Claim 16 (depends on 1)

A polishing method comprising a step of polishing a material to be polished by using the polishing liquid according to claim 1.

### Claim 17 (depends on 16)

The polishing method according to claim 16, wherein the material to be polished contains silicon oxide.

### Claim 18 (depends on 1)

The polishing liquid according to claim 1, wherein the hydroxy acid compound contains hydroxyisobutyric acid.

### Claim 19 (depends on 1)

The polishing liquid according to claim 1, wherein the hydroxy acid compound contains mandelic acid.