Molecular ink and method for printing resistive film coatings
AssigneeLiquid X Printed Metals, Inc.
InventorRobert Swisher
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Abstract
Described herein are molecular inks, methods for printing the molecular inks on flexible substrates, and methods for forming printed electronic elements, such as resistive heaters, force sensors, motion sensors, and devices that include these elements, such as force responsive conductive heaters. The methods include printing a molecular ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The molecular inks generally include a particle-fee metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material, and/or surfactant.
Claims23
A particle free molecular ink comprising:
- 75-99 wt. % of a first metal complex comprising a metal, at least one first ligand, and at least one second ligand;
- 1-25 wt. % of a second metal complex comprising a metal, at least one first ligand, and at least one second ligand;
- and
- two or more polar protic solvents,
- wherein the wt. % is based on the total weight of the first and second metal complex in the molecular ink, and
- wherein the first metal complex comprises silver diamine carboxylate and the second metal complex comprises copper diamine carboxylate.
Dependencies are inferred from the claim text.