# US 11,999,083 B2 · Resin molding apparatus and method for producing resin molded product

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- Number: US 11,999,083 B2
- Document ID: US11999083B2
- Status: Granted
- Kind: B2
- Application number: 17/411,166
- Filed: 2021-08-25
- Published: 2022-03-03
- Granted: 2024-06-04
- Earliest claimed: 2020-08-28
- Assignees: Towa Corporation
- Applicants: Towa Corporation
- Inventors: Ryota Okamoto; Keita Mizuma
- Web page: https://patentgrep.com/patent/US11999083B2

## CPC

- B29C 43/18: incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles {(B29C43/206 takes precedence)}
- B29C 43/34: Feeding the material to the mould or the compression means {(B29C43/085 takes precedence)}
- B29C 43/58: Measuring, controlling or regulating {(for bank adjustment in calendering B29C43/245)}
- B29C 2043/181: {encapsulated}
- B29C 2043/5875: {the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses}
- B29L 2031/34: Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L 2031/3406: {Components, e.g. resistors}
- B29L 2031/3481: {Housings or casings incorporating or embedding electric or electronic elements}
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES

## Abstract

A resin molding apparatus includes: a resin supply mechanism including a nozzle for ejecting liquid resin to a supply target; a resin collection unit including: a resin-receiving member configured to receive a portion of the liquid resin which portion has dropped from the nozzle; and a movement mechanism configured to cause the resin-receiving member to move in such a manner as to follow the nozzle while keeping the resin-receiving member under the nozzle; a mold die including an upper die and a lower die facing the upper die; a mold clamp mechanism configured to clamp the mold die with the supply target between the upper die and the lower die; and a control section configured to control at least respective operations of the resin supply mechanism and the resin collection unit.

## Claims

### Claim 1

A resin molding apparatus, comprising:
a resin supply mechanism including a nozzle for ejecting liquid resin to a resin supply area of a supply target;
a resin collection unit including a resin-receiving member configured to receive a portion of the liquid resin which portion has dropped from the nozzle;
a movement mechanism configured to cause the resin-receiving member to follow the nozzle while keeping the resin-receiving member under the nozzle;
a mold die including an upper die and a lower die facing the upper die;
a mold clamp mechanism configured to clamp the mold die with the supply target between the upper die and the lower die; and
a control section configured to control at least respective operations of the resin supply mechanism and the resin collection unit, wherein
the resin collection unit further includes an arm configured to hold the resin-receiving member,
the resin supply mechanism further includes a motor configured to drive the nozzle to move,
the movement mechanism includes a cylinder configured to receive a fluid,
the arm is moved by pressure of the fluid to move the resin-receiving member from a first position to a second position,
the resin collection unit further includes a rotation mechanism configured to rotate the arm,
the movement mechanism causes the resin-receiving member to move in a straight line between the first position inside the resin supply area and the second position outside the resin supply area,
the rotation mechanism rotates the arm to cause the resin-receiving member to move between an escape position and the first position or the second position, and
immediately after finishing supplying liquid resin, the resin collection unit causes the resin-receiving member to move under the nozzle at the first position in the resin supply area, and causes the resin-receiving member to move to the second position outside the resin supply area in such manner to follow the nozzle while preventing the liquid resin from dropping from the nozzle onto the resin supply area,
wherein the movement mechanism is additionally configured to move the arm upwardly and downwardly.

### Claim 2 (depends on 1)

The resin molding apparatus according to claim 1, wherein
the resin collection unit further includes at least two position sensors, a first one of which is present at a starting end of a path of the movement of the arm and a second one of which is present at a terminal end of the path of the movement of the arm, and
the control section adjusts the fluid pressure so that the resin-receiving member is moved at a speed equal to a speed of the movement of the nozzle, the speed of the movement of the resin-receiving member being calculated on a basis of a result of detection by the position sensors.

### Claim 3 (depends on 2)

A method for producing a resin molded product with use of a resin molding apparatus according to claim 2,
the method comprising:
supplying the liquid resin to the supply target with use of the resin supply mechanism;
collecting, with use of the resin collection unit, a portion, if any, of the liquid resin which portion has dropped from the nozzle after the supplying; and
producing a resin molded product with use of the liquid resin supplied with use of the resin supply mechanism.

### Claim 4 (depends on 1)

The resin molding apparatus according to claim 1, wherein
the resin collection unit further includes a detection sensor configured to detect the nozzle during the movement of the resin-receiving member.

### Claim 5 (depends on 4)

A method for producing a resin molded product with use of a resin molding apparatus according to claim 4,
the method comprising:
supplying the liquid resin to the supply target with use of the resin supply mechanism;
collecting, with use of the resin collection unit, a portion, if any, of the liquid resin which portion has dropped from the nozzle after the supplying; and
producing a resin molded product with use of the liquid resin supplied with use of the resin supply mechanism.

### Claim 6 (depends on 1)

A method for producing a resin molded product with use of a resin molding apparatus according to claim 1,
the method comprising:
supplying the liquid resin to the supply target with use of the resin supply mechanism;
collecting, with use of the resin collection unit, a portion of the liquid resin which portion has dropped from the nozzle after the supplying; and
producing a resin molded product with use of the liquid resin supplied with use of the resin supply mechanism.

### Claim 7 (depends on 1)

The resin molding apparatus according to claim 1, wherein the control section is additionally configured to move the nozzle upwardly and downwardly.

### Claim 8 (depends on 1)

The resin molding apparatus according to claim 1, wherein the resin-receiving member is in the shape of a cup.