# US 11,999,082 B2 · Fast-curing molding process for epoxy resin based on electromagnetic induction heating

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- Number: US 11,999,082 B2
- Document ID: US11999082B2
- Status: Granted
- Kind: B2
- Application number: 18/494,793
- Filed: 2023-10-26
- Published: 2024-05-09
- Granted: 2024-06-04
- Earliest claimed: 2022-11-09
- Assignees: Huazhong University of Science and Technology
- Applicants: Huazhong University of Science and Technology
- Inventors: Renfu Li; Yichao Li; Ao Sun; Jiaji Sun
- Web page: https://patentgrep.com/patent/US11999082B2

## CPC

- B29C 35/0805: {using electromagnetic radiation}
- B29C 39/003: {characterised by the choice of material}
- B29C 39/38: Heating or cooling
- B29C 2035/0811: {using induction}
- B29K 2063/00: Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material
- B29K 2505/12: Iron
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS

## Abstract

The present invention provides a fast-curing molding process for epoxy resin. The method includes the following steps: S1, mixing epoxy resin A glue and a protein-grafted manganese-zinc-iron oxide nanomaterial well into a colloidal state, and grounding the mixture for 10 to 30 min; S2, adding epoxy resin B glue to the mixed colloid in S1, and performing ultrasonic dispersion at 20 to 30° C. for 10 to 30 min; and S3, placing the mixture obtained after ultrasonic dispersion in S2 in a vacuum environment for 20 to 40 min, then taking the mixture out and injecting the mixture into a mold, placing the mold and the mixed colloid into an electromagnetic induction heater, placing the electromagnetic induction heater in a magnetic field environment with a magnetic field intensity of 1 to 1.5 mT for 2 to 3 h, cooling and then taking them out to obtain the cured epoxy resin.

## Claims

### Claim 1

A fast-curing molding process for epoxy resin based on electromagnetic induction heating, comprising the following steps:
S1, mixing epoxy resin A glue and a protein-grafted manganese-zinc-iron oxide nanomaterial into a colloidal state to obtain a mixture, and grinding the mixture for 10 to 30 min;
S2, adding epoxy resin B glue to the mixture in S1, and performing ultrasonic dispersion at 20 to 30° C. for 10 to 30 min; and
S3, placing the mixture obtained after ultrasonic dispersion in S2 in a vacuum environment for 20 to 40 min, then taking the mixture out and injecting the mixture into a mold, placing the mold and the mixture into an electromagnetic induction heater, placing the electromagnetic induction heater in a magnetic field environment with a magnetic field intensity of 1 to 1.5 mT for 2 to 3 h, cooling and then taking them out to obtain a cured epoxy resin, wherein
a method for preparing the protein-grafted manganese-zinc-iron oxide nanomaterial comprises the following steps:
S1, dissolving gelatin powder in 50 to 60 mL of acetic acid solution, stirring magnetically at 50 to 60° C. for 50 to 60 min, then cooling to 20 to 30° C., then adding a manganese-zinc ferrite nanomaterial and performing ultrasonic treatment for 10 to 20 min; and
S2, performing suction filtration on the ultrasonically-treated mixed solution, washing the mixed solution with deionized water for 3 to 5 times, drying for 10 to 12 h, and grinding to obtain the protein-grafted manganese-zinc ferrite nanomaterial;
a mass ratio of the epoxy resin A glue to the epoxy resin B glue to the protein-grafted manganese-zinc-iron oxide nanomaterial is 10:(3-3.5):(1.8-2.5); and
a mass ratio of the gelatin powder to the manganese-zinc ferrite nanomaterial is 1:(2-3).

### Claim 2 (depends on 1)

The fast-curing molding process for epoxy resin based on electromagnetic induction heating according to claim 1, wherein the acetic acid solution is an aqueous acetic acid solution having a volume fraction of 60 to 80%.

### Claim 3 (depends on 1)

The fast-curing molding process for epoxy resin based on electromagnetic induction heating according to claim 1, wherein the protein-grafted manganese-zinc-iron oxide nanomaterial has an average particle size of 0.2 to 0.5 μm.

### Claim 4 (depends on 1)

The fast-curing molding process for epoxy resin based on electromagnetic induction heating according to claim 1, wherein the manganese-zinc ferrite nanomaterial has a magnetic permeability of 2400 to 2600 dB/dH.

### Claim 5 (depends on 1)

The fast-curing molding process for epoxy resin based on electromagnetic induction heating according to claim 1, wherein the manganese-zinc ferrite nanomaterial has a Mn/Zn mass ratio of 3:(1-1.5).

### Claim 6 (depends on 1)

The fast-curing molding process for epoxy resin based on electromagnetic induction heating according to claim 1, wherein the epoxy resin A glue is one of YH-9621 epoxy resin A glue, E-51 epoxy resin A glue, and K-960 epoxy resin A glue.

### Claim 7 (depends on 1)

The fast-curing molding process for epoxy resin based on electromagnetic induction heating according to claim 1, wherein the epoxy resin B glue is one of YH-9621 epoxy resin B glue, 650 low molecular weight polyamide resin, and K-960 epoxy resin B glue.