# US 11,999,014 B2 · Laser cutting system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,999,014 B2 - Document ID: US11999014B2 - Status: Granted - Kind: B2 - Application number: 17/086,946 - Filed: 2020-11-02 - Published: 2021-05-27 - Granted: 2024-06-04 - Earliest claimed: 2019-11-22 - Assignees: Medtronic, Inc. - Applicants: Medtronic, Inc. - Inventors: Xiangnan He; David A. Ruben; Mark E. Henschel; Chunho Kim; Yongqian Wang; Rodney D. Toles - Web page: https://patentgrep.com/patent/US11999014B2 ## CPC - B23K 26/38: by boring or cutting - B23K 26/0604: {by a combination of beams} - B23K 26/0643: {comprising mirrors} - B23K 26/082: Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head - B23K 26/362: Laser etching - B23K 26/705: {Beam measuring devices} - B23K 2101/38: Conductors - B23K 2101/42: Printed circuits - B23K 2103/166: {Multilayered materials} - H05K 2203/0207: Partly drilling through substrate until a controlled depth, e.g. with end-point detection - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device. ## Claims ### Claim 1 A method comprising: removing a portion of a workpiece including removing a first portion of a conductor from the workpiece with a first laser beam to form an exposed surface of the workpiece, wherein a second portion of the conductor is positioned along the exposed surface of the workpiece; detecting plasma illumination caused by removal of the first portion of the conductor from the workpiece; determining a position of the second portion of the conductor along the exposed surface of the workpiece based on the detected plasma illumination; determining an angle relative to a normal to a major surface of the workpiece to emit a second laser beam based on the determined position of the second portion of the conductor; and removing a portion of the exposed surface of the workpiece with the second laser beam, the second laser beam emitted or reflected at the angle relative to the normal to the major surface. ### Claim 2 (depends on 1) The method of claim 1, wherein removing the portion of the exposed surface comprises cleaning the exposed surface. ### Claim 3 (depends on 2) The method of claim 2, wherein cleaning the exposed surface comprises removing conductive particles from the exposed surface. ### Claim 4 (depends on 1) The method of claim 1, wherein the second laser beam comprises a lower intensity than the first laser beam. ### Claim 5 (depends on 1) The method of claim 1, wherein the first laser beam is emitted by a first emitter and the second laser beam is emitted by a second emitter. ### Claim 6 (depends on 1) The method of claim 1, wherein the first laser beam is emitted by an emitter and the second laser beam is emitted by the emitter and the second laser beam is directed to the exposed surface by a mirror. ### Claim 7 (depends on 6) The method of claim 6, wherein an angle of the mirror is controllable to change an angle of the second laser beam relative to the normal to the major surface of the workpiece. ### Claim 8 (depends on 1) The method of claim 1, wherein the first laser beam is emitted at a first angle relative to the normal to the major surface of the workpiece and the second laser beam is emitted at a second angle relative to the normal to the major surface of the workpiece. ### Claim 9 (depends on 8) The method of claim 8, wherein the first angle is no greater than 10 degrees. ### Claim 10 (depends on 1) The method of claim 1, wherein removing the portion of the workpiece comprises disposing a recess in the workpiece. ### Claim 11 (depends on 1) The method of claim 1, wherein removing the portion of the exposed surface of the workpiece comprises shaping the exposed surface. ### Claim 12 (depends on 1) The method of claim 1, wherein removing the portion of the exposed surface of the workpiece comprises etching a recess at the conductor disposed on the exposed surface of the workpiece. ### Claim 13 (depends on 1) The method of claim 1, wherein removing the portion of the workpiece comprises cutting the workpiece into one or more singulated electronic packages. ### Claim 14 A system comprising: an emitting device adapted to emit a first laser beam and a second laser beam; a controller comprising one or more processors and operably coupled to the emitting device to control emission of the first and second laser beams, the controller adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device; and an optical sensor adapted to detect plasma illumination, wherein the controller is further adapted to: determine a position of a portion of a conductor positioned along the exposed surface of the workpiece based on plasma illumination emitted when the first laser beam contacts the conductor; and determine an angle relative to a normal to a major surface of the workpiece to emit the second laser beam based on the determined position of the portion of the conductor. ### Claim 15 (depends on 14) The system of claim 14, wherein the controller is further adapted to control the emitting device to emit the second laser beam at a lower intensity than the first laser beam. ### Claim 16 (depends on 14) The system of claim 14, wherein the emitting device comprises: a first emitter adapted to emit the first laser beam; and a second emitter adapted to emit the second laser beam. ### Claim 17 (depends on 14) The system of claim 14, further comprising a mirror, wherein the controller is further adapted to control the emitting device to direct at least one of the first and second laser beams to the mirror, wherein the mirror is adapted to direct the at least one of the first and second laser beams to the workpiece. ### Claim 18 (depends on 17) The system of claim 17, wherein the controller is operably coupled to the mirror to control an angle of the mirror. ### Claim 19 (depends on 14) The system of claim 14, wherein the controller is further adapted to control the emitting device to emit the first laser beam at a first angle relative to the normal to the major surface of the workpiece and the second laser beam at a second angle relative to the normal to the major surface of the workpiece. ### Claim 20 (depends on 19) The system of claim 19, wherein the first angle is no greater than 10 degrees. ### Claim 21 (depends on 14) The system of claim 14, further comprising a beam splitter, wherein the controller is further adapted to control the emitting device to emit the first and second laser beams simultaneously using the beam splitter.