# US 11,998,999 B2 · Soldering or sintering system with plurality of modules and temperature control > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,998,999 B2 - Document ID: US11998999B2 - Status: Granted - Kind: B2 - Application number: 17/924,921 - Filed: 2021-05-14 - Published: 2023-06-22 - Granted: 2024-06-04 - Earliest claimed: 2020-05-15 - Assignees: Pink GmbH Thermosysteme - Applicants: Pink GmbH Thermosysteme - Inventors: Thomas Krebs; Christoph Oetzel - Web page: https://patentgrep.com/patent/US11998999B2 ## CPC - B23K 1/0016: {Soldering of electronic components} - B22F 3/003: {Apparatus, e.g. furnaces (in general F27B)} - B23K 3/085: {Cooling, heat sink or heat shielding means} - B23K 26/703: {Cooling arrangements (by using a fluid stream B23K26/14)} - B23K 35/383: {mainly containing noble gases or nitrogen} - B22F 2999/00: Aspects linked to processes or compositions used in powder metallurgy - B23K 2101/36: Electric or electronic devices - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER ## Abstract A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature. ## Claims ### Claim 1 A soldering or sintering system for connecting electronic assemblies, comprising: a transport device for conveying the electronic assemblies through the system, comprising; a plurality of gas-tightly separable modules for connecting the electronic assemblies to one another, wherein at least one of the plurality of modules is designed as a soldering or sintering module and one of the plurality of modules is designed as a cooling module; vacuum insertable gate valves by which a separation of the gas-tightly separable modules is achieved, wherein a tightness of the vacuum insertable gate valves increases as the pressure increases and/or pressure equalization using the vacuum insertable gate valves takes place when the pressure is too high; a control for controlling the plurality of modules; between the at least one soldering or sintering module and the cooling module, a further module arranged that is designed as a mid-temperature-control module for controlled cooling from a process temperature of the at least one soldering or sintering module to an intermediate temperature below a solder solidification temperature, the mid-temperature-control module comprising a vacuum pump and a bleed valve configured to provide a positive pressure for a process atmosphere of 1 bar to 4.5 bar and a negative pressure of below 1 bar to vacuum; wherein in the mid-temperature-control module, a heating and a cooling device are comprised for controlled temperature adjustment and cooling down of the electronic assemblies from the process temperature of around 500° C. to the intermediate temperature below the solder solidification temperature, which is in the range from 220° C. to 150° C.; wherein in the mid-temperature-control module, a gas purging device for purging the electronic assemblies by cold gas comprising formic acid or nitrogen is comprised. ### Claim 2 (depends on 1) The soldering or sintering system according to claim 1, wherein the mid-temperature control module is designed as a positive pressure chamber and/or vacuum chamber. ### Claim 3 (depends on 1) The soldering or sintering system according to claim 1, wherein the heating and/or a cooling device is designed as a heatable and/or coolable contact plate. ### Claim 4 (depends on 3) The soldering or sintering system according to claim 3, wherein: the contact plate is designed as a heating plate; and the cooling device is designed as a gas cooling device for cooling down the contact plate by means of a gas flow from a side of the heating plate facing away from the electronic assemblies. ### Claim 5 (depends on 3) The soldering or sintering system according to claim 3, wherein: the contact plate is mechanically movable and can be brought into contact with and kept at a distance from the electronic assemblies; and/or the contact plate comprises a gas rack. ### Claim 6 (depends on 1) The soldering or sintering system according to claim 1, wherein an inlet valve for admitting the gas into a process chamber of the mid-temperature control module is comprised on the mid-temperature control module. ### Claim 7 (depends on 1) The soldering or sintering system according to claim 1, further comprising a gas collection container outside a process chamber of the mid-temperature control module, which is connected to the inlet valve and is designed to receive the gas extracted from the process chamber of the mid-temperature control module. ### Claim 8 (depends on 1) The soldering or sintering system according to claim 1, wherein a positive pressure valve for checking a positive pressure and/or a quick bleed valve is comprised on the mid-temperature control module. ### Claim 9 (depends on 1) The soldering or sintering system according to claim 1, wherein a positive pressure of 4 to 6 bar prevails in the mid-temperature control module. ### Claim 10 (depends on 1) The soldering or sintering system according to claim 1, wherein the cooling down from a temperature below the solder solidification temperature to room temperature takes place in the cooling module. ### Claim 11 (depends on 1) The soldering or sintering system according to claim 1, wherein a normal pressure or negative pressure prevails in the cooling module. ### Claim 12 (depends on 1) The soldering or sintering system according to claim 1, further comprising a further module connected in front of the soldering or sintering module, that is designed as a preheating module. ### Claim 13 (depends on 1) The soldering or sintering system according to claim 1, further comprising a cold trap in a process chamber of the mid-temperature-control module. ### Claim 14 (depends on 1) The soldering or sintering system according to claim 1, wherein in the soldering or sintering module, or in the mid-temperature control module in a gas-tightly sealable process chamber at least one heat source contactable with the electronic assemblies for heating the electronic assemblies and at least one cold trap are arranged, the at least one cold trap having in operation a surface temperature which is lower than an operating temperature of the heat source. ### Claim 15 (depends on 14) The soldering or sintering system according to claim 14, wherein a specific process atmosphere is provided in the gas-tightly sealable process chamber, wherein the cold trap and the heat source are arranged relative to one another such that at least during a specific operating phase currents are present in the process atmosphere solely due to convection, which is generated by a temperature difference between the cold trap and the heat source. ### Claim 16 (depends on 14) The soldering or sintering system according to claim 14, wherein the surface temperature of the cold trap is between −196° C. (77 k) and 150° C. ### Claim 17 (depends on 14) The soldering or sintering system according to claim 14, further comprising at least one additional heat source for heating the gas-tightly sealable process chamber. ### Claim 18 (depends on 17) The soldering or sintering system according to claim 17, wherein the operating temperature of the heat source and/or of the additional heat source is between 150° C. and 400° C. or between 200° C. and 300° C. ### Claim 19 (depends on 14) The soldering or sintering system according to claim 14, wherein at least one assembly is arranged on a workpiece carrier and at a distance therefrom in a direction of the cold trap at least at times, such that the distance of the assemblies to the cold trap is less than a distance of the workpiece carrier to the cold trap. ### Claim 20 (depends on 14) The soldering or sintering system according to claim 14, wherein at least one partial area of the gas-tightly sealable process chamber is designed as a temperature adjustment zone, wherein said temperature adjustment zone has during operation a temperature between the surface temperature of the cold trap and the operating temperature of the heat source, wherein the temperature of the temperature adjustment zone is between 50° C. and 150° C. ### Claim 21 (depends on 14) The soldering or sintering system according to claim 14, wherein the gas-tightly sealable process chamber is connected or connectable via a pipeline to an evacuation device, wherein an outlet of the pipeline into the process chamber is provided immediately adjacent to the cold trap. ### Claim 22 (depends on 14) The soldering or sintering system according to claim 14, wherein the cold trap has a plurality of cooling fins. ### Claim 23 (depends on 14) The soldering or sintering system according to claim 14, further comprising a collection device provided underneath the cold trap to collect condensate generated at the cold trap. ### Claim 24 (depends on 19) The soldering or sintering system according to claim 19, wherein the heat source and/or the workpiece carrier with the assemblies are adjustable in their distances relative to the cold trap. ### Claim 25 (depends on 19) The soldering or sintering system according to claim 19, wherein the workpiece carrier is separately heatable. ### Claim 26 (depends on 14) The soldering or sintering system according to claim 14, further comprising a speed-controlled extraction vacuum pump with a liquid separator provided for creating a negative pressure in the gas-tightly sealable process chamber. ### Claim 27 (depends on 14) The soldering or sintering system according to claim 14, further comprising at least one heatable vacuum insertable gate valve provided for insertion and/or removal of the assemblies.