# US 11,998,397 B2 · Thermal conductive layer for transducer face temperature reduction > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,998,397 B2 - Document ID: US11998397B2 - Status: Granted - Kind: B2 - Application number: 18/166,645 - Filed: 2023-02-09 - Published: 2023-06-15 - Granted: 2024-06-04 - Earliest claimed: 2018-12-19 - Assignees: Fujifilm Sonosite, Inc. - Applicants: Fujifilm Sonosite, Inc. - Inventors: Wei Li; Keith Williams - Web page: https://patentgrep.com/patent/US11998397B2 ## CPC - A61B 8/546: {involving monitoring or regulation of device temperature} - A61B 8/4245: {involving determining the position of the probe, e.g. with respect to an external reference frame or to the patient} - A61B 8/4444: {related to the probe} - A61B 8/4494: {characterised by the arrangement of the transducer elements} - B06B 1/067: {which is used as, or combined with, an impedance matching layer} - A61B 8/4455: {Features of the external shape of the probe, e.g. ergonomic aspects} - A61B 2562/182: Electrical shielding, e.g. using a Faraday cage - B06B 1/0292: {Electrostatic transducers, e.g. electret-type} - B06B 2201/76: Medical, dental - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) ## Abstract A method and apparatus are disclosed herein for a thermally conductive layer for transducer face temperature reduction in an ultrasound transducer assembly. In one embodiment, the ultrasound transducer assembly comprises: a transducer layer configured to emit ultrasound energy; one or more matching layers overlaying the transducer layer; a thermally conductive layer overlaying the one or more matching layers; and a lens overlaying the thermally conductive layer. ## Claims ### Claim 1 An ultrasound transducer assembly comprising: a transducer layer configured to emit ultrasound energy; one or more matching layers on the transducer layer; a thermally conductive layer on the one or more matching layers; a backing layer including a channel to hold the transducer layer and outer sides coupled to the channel, wherein the thermally conductive layer is wrapped around the outer sides of the backing layer and is separated from the transducer layer by the backing layer, a first shield coupled to the thermally conductive layer at a first connection point on at least one of the outer sides of the backing layer, and a radio-interference (RFI) shield connected to the first shield at a second connection point on the at least one of the outer sides of the backing layer. ### Claim 2 (depends on 1) The ultrasound transducer assembly of claim 1 wherein the thermally conductive layer comprises a material with thermal conductivity greater or equal to 100 W/m·K. ### Claim 3 (depends on 1) The ultrasound transducer assembly of claim 1 wherein the thermally conductive layer comprises an electrically conductive material. ### Claim 4 (depends on 1) The ultrasound transducer assembly of claim 1, further comprising: a lens on the thermally conductive layer. ### Claim 5 (depends on 1) The ultrasound transducer assembly of claim 1, wherein the thermally conductive layer comprises gold, copper, silver, aluminum, magnesium, beryllium, brass, bronze, molybdenum, rhodium, tungsten, zinc, carbon, and aluminum nitride. ### Claim 6 (depends on 1) The ultrasound transducer assembly of claim 1, further comprising: a dematching layer under a bottom surface of the transducer layer in the channel in the backing layer. ### Claim 7 (depends on 1) The ultrasound transducer assembly of claim 1, wherein the thermally conductive layer is patterned with thermally conductive and electrically conductive materials. ### Claim 8 (depends on 1) The ultrasound transducer assembly of claim 1, wherein the thermally conductive layer comprises a thermally conductive layer on an electrically conductive layer. ### Claim 9 (depends on 1) The ultrasound transducer assembly of claim 1, wherein the thermally conductive layer is wrapped around the outer sides of the backing layer and is separated from the transducer layer by the backing layer to form an enclosed shielded cage. ### Claim 10 (depends on 1) The ultrasound transducer assembly of claim 1, wherein the thermally conductive layer comprises a 3000 Angstrom gold layer. ### Claim 11 An ultrasound apparatus comprising: a display screen; an ultrasound imaging subsystem coupled to the display to generate ultrasound images on the display screen; an ultrasound control subsystem coupled to control the imaging subsystem; and an ultrasound transducer assembly comprising a transducer layer configured to emit ultrasound energy, one or more matching layers on the transducer layer, a thermally conductive layer on the one or more matching layers, and a backing layer including a channel to hold the transducer layer and outer sides coupled to the channel, wherein the thermally conductive layer is wrapped around the outer sides of the backing layer and is separated from the transducer layer by the backing layer; a first shield coupled to the thermally conductive layer at a first connection point on at least one of the outer sides of the backing layer; and a radio-interference (RFI) shield connected to the first shield at a second connection point on the at least one of the outer sides of the backing layer. ### Claim 12 (depends on 11) The ultrasound apparatus of claim 11 wherein the thermally conductive layer comprises a material with thermal conductivity greater or equal to 100 W/m·K. ### Claim 13 (depends on 11) The ultrasound apparatus of claim 11 wherein the thermally conductive layer comprises an electrically conductive material. ### Claim 14 (depends on 11) The ultrasound apparatus of claim 11 wherein the thermally conductive layer comprises gold, copper, silver, aluminum, magnesium, beryllium, brass, bronze, molybdenum, rhodium, tungsten, zinc, carbon, and aluminum nitride. ### Claim 15 (depends on 11) The ultrasound apparatus of claim 11 further comprising: a dematching layer under a bottom surface of the transducer layer in the channel in the backing layer. ### Claim 16 (depends on 11) The ultrasound apparatus of claim 11, wherein the ultrasound transducer assembly further comprises: a lens on the thermally conductive layer. ### Claim 17 (depends on 11) The ultrasound apparatus of claim 11, wherein the thermally conductive layer comprises a thermally conductive layer on an electrically conductive layer. ### Claim 18 (depends on 11) The ultrasound apparatus of claim 11, wherein the thermally conductive layer is wrapped around the outer sides of the backing layer and is separated from the transducer layer by the backing layer to form an enclosed shielded cage.