Method of manufacturing light-emitting device including step of curing sealing member while applying centrifugal force
AssigneeNichia Corporation
InventorsKenji Ozeki, Atsushi Kojima, Chinami Nakai
Life of this patent
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Abstract
A method of producing a light-emitting device includes: providing a package having an upper surface and a recess including an opening located at the upper surface; disposing a light-emitting element on a surface defining a bottom of the recess of the package; disposing an uncured sealing member in the recess of the package; and curing the uncured sealing member while applying a centrifugal force to the package in which the uncured sealing member are disposed, such that the centrifugal force is applied in a direction perpendicular to the upper surface and toward the surface defining the bottom of the recess.
Claims16
A method of producing a light-emitting device, the method comprising:
- providing a lead frame comprising a plurality of package portions that are connected together, each package portion having an upper surface and a recess including an opening located at the upper surface;
- disposing, in each package portion, a light-emitting element on a surface that defines a bottom of the recess;
- disposing an uncured light reflective member in the recess of each package portion;
- curing the uncured light reflective members, thereby forming a cured light reflective member in the recess of each package portion;
- after forming the cured light reflective member in the recess of each package portion, disposing an uncured sealing member in the recess of each package portion;
- applying a centrifugal force to the lead frame, with the uncured sealing member disposed in each recess, wherein the centrifugal force is applied to each package portion in a direction toward the surface that defines the bottom of the recess, and wherein the centrifugal force causes a part of an upper surface of each uncured sealing member to be formed into a flat region;
- and
- curing the uncured sealing members while applying the centrifugal force to the lead frame such that the flat region of the upper surface of each uncured sealing member is maintained, thereby forming, in the recess of each package portion, a cured sealing member having an upper surface that includes a flat region;
- wherein:
- in the steps of applying the centrifugal force and curing the uncured sealing members, the lead frame is deformed by the centrifugal force while the centrifugal force is applied to the lead frame;
- and
- the flat region of the upper surface of each cured sealing member is located below the upper surface of the corresponding package portion.
Dependencies are inferred from the claim text.