Semiconductor devices and methods of manufacturing semiconductor devices

An electronic device, comprising:

• a first substrate comprising a first conductive structure;
• a second substrate comprising a second conductive structure;
• a vertical interconnect coupled with the first conductive structure and the second conductive structure;
• an encapsulant between the first substrate and the second substrate and covering the vertical interconnect;
• and
• a first electronic component between the first substrate and the second substrate, wherein the first electronic component has a first component terminal on a front side of the first electronic component and coupled with the first conductive structure;
• wherein a lateral port at a lateral side of the first electronic component is exposed;
• wherein the lateral side of the first electronic component is coplanar with an end of the second substrate;
• and
• wherein a top side of the first electronic component and the lateral side of the first electronic component are free of the encapsulant.

A method to manufacture an electronic device, comprising:

• providing a first substrate comprising a first conductive structure;
• providing a first electronic component coupled to a bottom side of the first substrate;
• providing a vertical interconnect coupled to the bottom side of the first substrate and located external to the first electronic component;
• and
• providing an encapsulant covering the vertical interconnect, a first lateral side of the first electronic component, and at least a portion of the bottom side of the first substrate;
• wherein a vertical port on the first electronic component is exposed by an aperture of the first substrate.