Wafer boat handling device, vertical batch furnace and method

A wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace, wherein the wafer boat handling device comprises:

• a main housing having a wall defining and bounding a wafer boat handling space;
• a boat transporter comprising at least one wafer boat support for supporting a wafer boat and configured to transport the wafer boat to a cooldown position within the wafer boat handling space;
• wherein a part of the wall adjacent the cooldown position is a wall part having a heat radiation surface absorptance of at least 0.6 at room temperature when the wafer boat having one or more wafers loaded therein is in a temperature range between 70 to 200 degrees Celsius and during a cooling of the wafer boat, so as to withdraw heat from the wafer boat which is in the cooldown position by means of heat radiation absorption,
• wherein the wall part comprises at least one of an anodized aluminum wall part or a painted metal wall part;
• wherein the wall part operates as heat sink due to one of the following features:
• the thickness of the wall part;
• and
• an outer surface of the wall part which is directed away from the wafer boat handling space having a heat exchange surface enlarging shape, wherein the heat exchange surface enlarging shape includes at least one of fins, pins, holes and a surface roughness.