Semiconductor device and method of coating a semiconductor wafer with high viscosity liquid photoresist using N2 purge

A semiconductor manufacturing device, comprising:

• an outer cup;
• an inner cup including a wafer suction mount disposed within the outer cup;
• a gas purge port disposed on the inner cup for dispensing a gas into an area between the inner cup and a bottom side of the semiconductor wafer to move contamination into an outlet disposed between the inner cup and outer cup;
• and
• an inner cup rinse port disposed on the inner cup to dispense a rinse solution into the inner cup to perform an inner cup rinse, wherein the gas from the gas purge port with the inner cup rinse move the contamination into the outlet between the inner cup and outer cup.

A semiconductor manufacturing device, comprising:

• an outer cup;
• an inner cup disposed within the outer cup and adapted for mounting a semiconductor wafer;
• a gas purge port disposed on the inner cup for dispensing a gas oriented toward the semiconductor wafer to move contamination into an outlet disposed between the inner cup and outer cup;
• and
• an inner cup rinse port disposed on the inner cup to dispense a rinse solution into the inner cup to perform an inner cup rinse, wherein the gas from the gas purge port with the inner cup rinse move the contamination into the outlet between the inner cup and outer cup.