# US 11,994,779 B2 · Electronic device

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- Number: US 11,994,779 B2
- Document ID: US11994779B2
- Status: Granted
- Kind: B2
- Application number: 18/171,510
- Filed: 2023-02-20
- Published: 2023-06-22
- Granted: 2024-05-28
- Earliest claimed: 2020-10-23
- Assignees: Innolux Corporation
- Applicants: InnoLux Corporation
- Inventors: Chun-Hsien Lin
- Web page: https://patentgrep.com/patent/US11994779B2

## CPC

- G02F 1/1309: {Repairing; Testing}
- G02F 1/136263: {Line defects}
- G02F 1/136227: {Through-hole connection of the pixel electrode to the active element through an insulation layer}
- G02F 1/136259: {Repairing; Defects}
- G02F 1/136272: {Auxiliary lines}
- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- G02F 2201/506: Repairing, e.g. with redundant arrangement against defective part
- H10K 59/122: Pixel-defining structures or layers, e.g. banks
- H10K 59/124: Insulating layers formed between TFT elements and OLED elements
- H10K 71/861: {Repairing}
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

An electronic device includes a conductive structure, a first insulation layer and a second insulation layer. The first insulation layer is disposed on the conductive structure. The second insulation layer is disposed on the first insulation layer. The first insulation layer includes a first hole, and the first hole overlaps a part of the conductive structure. The second insulation layer includes a second hole, and the first hole and the second hole at least partially overlap. A width of the second hole is less than a width of the first hole.

## Claims

### Claim 1

An electronic device, comprising:
a conductive structure;
a semiconductor layer, wherein a part of the semiconductor layer is electrically connected to the conductive structure;
a first insulation layer, disposed on the semiconductor layer; and
a second insulation layer, disposed on the first insulation layer;
wherein the first insulation layer comprises a first hole, the first hole overlaps a part of the conductive structure, the second insulation layer comprises a second hole, and the first hole and the second hole at least partially overlap;
wherein a width of the second hole is less than a width of the first hole.

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein the electronic device is a display device.

### Claim 3 (depends on 1)

The electronic device according to claim 1, wherein the electronic device is a liquid crystal display device.

### Claim 4 (depends on 1)

The electronic device according to claim 1, wherein the first insulation layer is a planarization layer.

### Claim 5 (depends on 1)

The electronic device according to claim 1, wherein the first insulation layer comprises an organic layer.

### Claim 6 (depends on 1)

The electronic device according to claim 1, wherein the second insulation layer comprises an inorganic layer.

### Claim 7 (depends on 1)

The electronic device according to claim 1, further comprising: a third insulation layer disposed between the conductive structure and the first insulation layer.

### Claim 8 (depends on 1)

The electronic device according to claim 1, wherein a thickness of the first insulation layer is greater than a thickness of the conductive structure.

### Claim 9 (depends on 1)

The electronic device according to claim 1, wherein a thickness of the first insulation layer is different from a thickness of the conductive structure.

### Claim 10 (depends on 1)

The electronic device according to claim 1, comprising a transistor, wherein the transistor comprises the semiconductor layer.

### Claim 11 (depends on 10)

The electronic device according to claim 10, further comprising:
a liquid crystal unit driven by the transistor.
