# US 11,994,760 B1 · Electronic devices with coherent fiber bundles and molded polymer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,994,760 B1 - Document ID: US11994760B1 - Status: Granted - Kind: B1 - Application number: 17/410,454 - Filed: 2021-08-24 - Granted: 2024-05-28 - Earliest claimed: 2020-09-18 - Assignees: Apple Inc. - Applicants: Apple Inc. - Inventors: Daniel J. Barrett; Timothy D. Burks; Tyler R. Kakuda - Web page: https://patentgrep.com/patent/US11994760B1 ## CPC - G02F 1/133331: {Cover glasses} - G02B 6/0005: {the light guides being of the fibre type (G02B6/0003 takes precedence)} - G02B 6/08: with fibre bundle in form of plate - G02F 1/0115: {in optical fibres} - H10K 50/84: Passivation; Containers; Encapsulations - H10K 59/87: {Passivation; Containers; Encapsulations} - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract An electronic device may have a display, a display cover layer, and an image transport layer formed from a coherent fiber bundle. The coherent fiber bundle may be placed between the display and the display cover layer. A gap may separate the coherent fiber bundle from the display cover layer. Adhesive in the gap may attach the coherent fiber bundle to the display cover layer. Molded polymer may be coupled to a bent edge of the display, a portion of the display with backside contacts, or components coupled to the backside contacts or other portions of the display. The molded polymer may support the coherent fiber bundle relative to the cover layer. The molded polymer may be molded to an inner surface of the cover layer and may be used to receive fasteners or otherwise facilitate mounting of housing structures and components in the device. ## Claims ### Claim 1 An electronic device, comprising: a pixel layer configured to produce an image on a first surface and having backside contacts on an opposing second surface; a coherent fiber bundle that receives the image at an input surface and provides the image at an output surface; a component coupled to the backside contacts; and molded polymer coupled to the coherent fiber bundle, an edge of the pixel layer, and the component. ### Claim 2 (depends on 1) The electronic device defined in claim 1 further comprising a display cover layer having a first portion that overlaps the output surface and a second portion that forms a housing sidewall. ### Claim 3 (depends on 2) The electronic device defined in claim 2 wherein the molded polymer has an opening configured to receive a fastener. ### Claim 4 (depends on 3) The electronic device defined in claim 3 further comprising an electrical component that is attached to the molded polymer with the fastener. ### Claim 5 (depends on 3) The electronic device defined in claim 3 further comprising a housing rear wall that is attached to the molded polymer with the fastener. ### Claim 6 (depends on 2) The electronic device defined in claim 2 wherein the molded polymer has a portion molded to an inner surface of the housing sidewall. ### Claim 7 (depends on 2) The electronic device defined in claim 2 further comprising liquid adhesive in a gap between the output surface and the display cover layer. ### Claim 8 (depends on 7) The electronic device defined in claim 7 wherein a portion of the molded polymer protrudes into the gap. ### Claim 9 (depends on 1) The electronic device defined in claim 1 wherein the component comprises a component selected from the group consisting of: a printed circuit, an integrated circuit, and a connector. ### Claim 10 (depends on 1) The electronic device defined in claim 1 wherein the coherent fiber bundle has a notch and wherein the molded polymer comprises a portion in the notch. ### Claim 11 (depends on 1) The electronic device defined in claim 1 wherein the component has mating contacts that are electrically connected to the backside contacts. ### Claim 12 (depends on 1) The electronic device defined in claim 1 wherein the molded polymer is molded over the edge of the pixel layer and the component. ### Claim 13 (depends on 12) The electronic device defined in claim 12, wherein the molded polymer is molded into a notch in the coherent fiber bundle. ### Claim 14 An electronic device, comprising: a pixel layer configured to produce an image; a coherent fiber bundle having an input surface that receives the image and having a corresponding output surface on which the image is provided; a display cover layer that overlaps the coherent fiber bundle and that is separated by a gap from the output surface; liquid adhesive in the gap; and a molded polymer member coupled to the display cover layer and coupled to the coherent fiber bundle. ### Claim 15 (depends on 14) The electronic device defined in claim 14 wherein a portion of the molded polymer member protrudes into the gap. ### Claim 16 (depends on 14) The electronic device defined in claim 14 further comprising a fastener that is received within an opening in the molded polymer member. ### Claim 17 (depends on 14) The electronic device defined in claim 14 wherein the pixel layer has a bent edge that is at least partly embedded in the molded polymer member. ### Claim 18 (depends on 14) The electronic device defined in claim 14 further comprising a housing wall, wherein the molded polymer member has a portion attached to the housing wall. ### Claim 19 An electronic device, comprising: a housing; a display in the housing that has an active area with an array of pixels configured to display an image and an inactive area without pixels at an edge of the display; a molded polymer member that covers at least the edge of the display; a coherent fiber bundle that receives the image at an input surface and that provides the received image to an output surface; a glass layer that overlaps the coherent fiber bundle; and an adhesive layer between the coherent fiber bundle and the glass layer.