Hybrid CMOS compatible electro-optic device
AssigneeAdvanced Micro Foundry Pte. Ltd.
InventorsPatrick Guo Qiang Lo, Shawn Yohanes Siew, Larry Lian Xi Jia
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Abstract
A hybrid photonic chip comprising a plurality of semiconductor materials arranged to define a chip providing a function, wherein at least a first part of the chip is formed of materials which can be fabricated using a CMOS technique; and at least a second part of the chip which comprises non-linear crystal material and is not subjected to etching process; wherein the second part of the chip in conjunction with the first part is configured to support a propagating low loss single mode.
Claims17
A hybrid photonic chip comprising:
- at least a first part of the chip comprising silicon and electrodes;
- and
- at least a second part of the chip comprising a nonlinear crystal material, wherein the second part of the chip has not been subjected to etching,
- wherein the at least the first part and at least the second part has been applied to each other via a flip-chip bonding technique,
- wherein the second part of the chip in conjunction with the first part of the chip is configured to support a propagating single mode, and
- wherein the first part of the chip comprises one or more silicon strips on a silicon on insulator (SOI) platform that do not support the propagating single mode alone.
A method of fabricating a hybrid photonic chip, that excludes etching of nonlinear crystal material, the method comprising:
- forming a first part of a chip from silicon using a CMOS fabrication process, wherein the first part of the chip includes a silicon on insulator (SOI) platform;
- forming electrodes as a part of the first part of the chip;
- forming one or more silicon strips on the SOI platform that do not support a propagating single mode alone;
- and
- applying a second part of the chip comprising the nonlinear crystal material to the first part of the chip by a flip-chip bonding technique, wherein the nonlinear crystal material is not subjected to the etching;
- wherein the second part of the chip in conjunction with the first part of the chip substantially supports the propagating single mode.
Dependencies are inferred from the claim text.