# US 11,994,701 B2 · Photosensitive module having transparent plate and image sensor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,994,701 B2 - Document ID: US11994701B2 - Status: Granted - Kind: B2 - Application number: 18/085,077 - Filed: 2022-12-20 - Published: 2023-04-20 - Granted: 2024-05-28 - Earliest claimed: 2018-03-19 - Assignees: TDK Taiwan Corp. - Applicants: TDK Taiwan Corp. - Inventors: Chen-Er Hsu; Sin-Jhong Song - Web page: https://patentgrep.com/patent/US11994701B2 ## CPC - G02B 5/208: {for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation} - G02B 7/08: adapted to co-operate with a remote control mechanism - G02B 7/021: {for more than one lens} - G02B 7/04: with mechanism for focusing or varying magnification - H04N 23/52: Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H05K 5/0217: {Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03)} - H10F 39/804: {Containers or encapsulations} - H10F 39/806: {Optical elements or arrangements associated with the image sensors} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract A photosensitive module is provided, for receiving light passing through a lens in an electronic device, including a base assembly, a first plastic member, a first lead assembly, an image sensor, and an opening. The base assembly includes a substrate, an insulating layer, and a circuit layer. The substrate has a main body that includes a metal material. The first plastic member is connected to the base assembly. The first plastic member encapsulates at least part of the lead assembly. The image sensor is for receiving a light and is electrically connected to the circuit layer via the lead assembly. The opening is formed at the main body, and corresponds to the image sensor. When observed along a direction in which the light travels, the opening overlaps the image sensor. ## Claims ### Claim 1 A photosensitive module, configured to receive light passing through a lens, comprising: a base assembly, including a substrate, an insulating layer, and a circuit layer, wherein the substrate has a main body including a metal material; a first plastic member, connected to the base assembly; a circuit assembly, wherein at least part of the circuit assembly is encapsulated by the first plastic member; and an image sensor, for receiving a light, electrically connected to the circuit layer via the circuit assembly; and an opening, formed at the main body, corresponding to the image sensor, wherein when observed along a direction in which the light travels, the opening overlaps the image sensor. ### Claim 2 (depends on 1) The photosensitive module as claimed in claim 1, further comprising a first transparent plate disposed on a first side of the base assembly. ### Claim 3 (depends on 2) The photosensitive module as claimed in claim 2, wherein the image sensor is disposed on a second side of the base assembly and adjacent to the main body of the substrate, wherein the first side is opposite the second side. ### Claim 4 (depends on 3) The photosensitive module as claimed in claim 3, further comprising: a second plastic member connected to the base assembly and carrying the first transparent plate, wherein the first plastic member is disposed on the first side of the base assembly, and the second plastic member is disposed on the second side of the base assembly. ### Claim 5 (depends on 4) The photosensitive module as claimed in claim 4, further comprising a vibration assembly disposed on the second plastic member for driving the first transparent plate. ### Claim 6 (depends on 5) The photosensitive module as claimed in claim 5, further comprising a second transparent plate, wherein the first transparent plate and the second transparent plate are arranged on the second plastic member along the direction in which the light travels. ### Claim 7 (depends on 6) The photosensitive module as claimed in claim 6, wherein: the second transparent plate is located between the first transparent plate and the image sensor; and the second transparent plate is affixed to the second plastic member. ### Claim 8 (depends on 6) The photosensitive module as claimed in claim 6, wherein: the vibration assembly includes at least two vibration members: a first vibration member and a second vibration member, and both the first vibration member and the second vibration member are disposed on the second plastic member and are configured to drive the second transparent plate; wherein the first vibrating member drives the first transparent plate to move in a first direction, the second vibrating member drives the first transparent plate to move in a second direction, and the first direction is different than the second direction. ### Claim 9 (depends on 5) The photosensitive module as claimed in claim 5, further comprising: a catching member disposed outside the first plastic member and adjacent to the first transparent plate, for capturing the dust that falls from the transparent plate because of the vibration produced by the vibration assembly. ### Claim 10 (depends on 2) The photosensitive module as claimed in claim 2, wherein the substrate is disposed between the image sensor and the first transparent plate. ### Claim 11 (depends on 1) The photosensitive module as claimed in claim 1, wherein the image sensor is surrounded by the first plastic member. ### Claim 12 (depends on 1) The photosensitive module as claimed in claim 1, wherein the circuit layer is disposed on the insulating layer. ### Claim 13 (depends on 1) The photosensitive module as claimed in claim 1, further comprising a thermal adhesive disposed between the substrate and the image sensor; wherein the thermal adhesive is in contact with the main body of the substrate and the image sensor. ### Claim 14 (depends on 13) The photosensitive module as claimed in claim 13, wherein: the insulating layer has an opening in which the thermal conductive adhesive is disposed; and the thermal conductive adhesive is in contact with the main body of the substrate and the image sensor through the opening. ### Claim 15 (depends on 14) The photosensitive module as claimed in claim 14, wherein the thermal adhesive has two thermally conductive regions which are separated from each other, and the two thermally conductive regions are disposed on opposite sides of the opening of the insulating layer. ### Claim 16 (depends on 14) The photosensitive module as claimed in claim 14, wherein the opening of the main body of the substrate is smaller than the opening of the insulating layer. ### Claim 17 (depends on 1) The photosensitive module as claimed in claim 1, wherein the substrate further has an extended region connected to the main body, and the extended region has a metal material, that is different than the metal material of the main body. ### Claim 18 (depends on 1) The photosensitive module as claimed in claim 1, wherein the first plastic member has at least one through hole penetrating a side wall of the first plastic member. ### Claim 19 (depends on 18) The photosensitive module as claimed in claim 18, wherein: the first plastic member has a rectangular structure, the at least one through hole is located on the side wall of the rectangular structure, and the at least one through hole has an outer opening and an inner opening, and the outer opening is farther away from a reference surface of the substrate than the inner opening. ### Claim 20 (depends on 1) The photosensitive module as claimed in claim 1, wherein: the circuit assembly connects the image sensor and the base assembly; and the circuit assembly at least partially overlaps the image sensor in the direction in which the light travels.