# US 11,994,554 B2 · Test apparatus for semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,994,554 B2 - Document ID: US11994554B2 - Status: Granted - Kind: B2 - Application number: 17/892,756 - Filed: 2022-08-22 - Published: 2023-03-02 - Granted: 2024-05-28 - Earliest claimed: 2021-08-27 - Assignees: Tse Co., Ltd. - Applicants: Tse Co., Ltd. - Inventors: Sol Lee; Min Cheol Kim - Web page: https://patentgrep.com/patent/US11994554B2 ## CPC - G01R 1/0433: {Sockets for IC's or transistors} - G01R 31/2889: {Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence)} - G01R 31/2863: {Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04)} - G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract The present disclosure relates to a test apparatus for a package-on-package type semiconductor package including a lower test socket mounted on a tester, and connected to a lower package to electrically connect the lower package to the tester; a pusher configured to be able to be moved vertically by receiving a driving force from a driving unit; an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package to be electrically connected to the upper package; a vacuum picker mounted on the upper test socket to be able to vacuum-adsorb the lower package; and an inelastic insulating sheet installed between the upper test socket and the upper package, having a through hole formed at a position thereof corresponding to the terminal of the upper package and the electro-conductive part. ## Claims ### Claim 1 A test apparatus for a semiconductor package, comprising: a lower test socket mounted on a tester providing a test signal, and connected to a lower terminal of a lower package to electrically connect the lower package to the tester; a pusher configured to be able to be moved vertically by receiving a driving force from a driving unit; an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package to be electrically connected to a lower terminal of the upper package; a vacuum picker mounted on a center of the upper test socket to be able to vacuum-adsorb the lower package; and an inelastic insulating sheet installed between the upper test socket and the upper package, the inelastic insulating sheet having a through hole formed at a position thereof corresponding to the terminal of the upper package and the electro-conductive part, and having a vacuum space part formed in a lower surface thereof corresponding to the upper test socket. ### Claim 2 (depends on 1) The test apparatus of claim 1, wherein the vacuum space part of the inelastic insulating sheet has a shape of concaved and elongated groove. ### Claim 3 (depends on 2) The test apparatus of claim 2, wherein the vacuum space part has a plurality of deformation-preventing pillars formed therein and having a height for compensating for the concaved groove. ### Claim 4 (depends on 1) The test apparatus of claim 1, wherein the inelastic insulating sheet is formed from any one of polyimide, FR4, engineering plastic and a metal on which an insulating plating layer is formed. ### Claim 5 (depends on 1) The test apparatus of claim 1, wherein a vacuum pressure provided to the pusher is applied to the vacuum picker through the vacuum space part. ### Claim 6 (depends on 1) The test apparatus of claim 1, wherein the upper test socket is attached to the pusher in a vacuum-sealed manner with an adhesive. ### Claim 7 (depends on 1) The test apparatus of claim 1, wherein the electro-conductive part of the upper test socket is formed by arranging a plurality of electro-conductive particles in a thickness direction in an elastic insulating material. ### Claim 8 (depends on 1) The test apparatus of claim 1, wherein the lower terminal of the upper package or the lower package is either a solder ball type or a land type. ### Claim 9 A test apparatus for a semiconductor package, comprising: a lower test socket mounted on a tester providing a test signal, and connected to a lower terminal of a lower package to electrically connect the lower package to the tester; a pusher configured to be able to be moved vertically by receiving a driving force from a driving unit; and an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package that is a defect-free package, to be electrically connected to a lower terminal of the upper package, wherein the lower terminal of the upper package is formed in the form of a solder ball, and a plating layer of oxidation-preventing metal is formed on an upper side of the lower terminal of the upper package which comes in direct contact with the electro-conductive part. ### Claim 10 (depends on 9) The test apparatus of claim 9, wherein a nickel-plating layer is formed between a surface of the lower terminal of the upper package and a plating layer of oxidation-preventing metal. ### Claim 11 (depends on 9) The test apparatus of claim 9, wherein the oxidation-preventing metal is gold, palladium, rhodium, cobalt, or an alloyed metal of two or more thereof. ### Claim 12 (depends on 10) The test apparatus of claim 10, wherein the oxidation-preventing metal is gold, palladium, rhodium, cobalt, or an alloyed metal of two or more thereof. ### Claim 13 A test apparatus for a semiconductor package, comprising: a lower test socket mounted on a tester providing a test signal, and connected to a lower terminal of a lower package; a pusher configured to be able to be moved vertically; an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package to be electrically connected to a lower terminal of the upper package; a vacuum picker mounted on a center of the upper test socket; and an inelastic insulating sheet installed between the upper test socket and the upper package, the inelastic insulating sheet having a through hole formed at a position thereof corresponding to the terminal of the upper package and the electro-conductive part, and having a vacuum space part formed in a lower surface thereof corresponding to the upper test socket. ### Claim 14 (depends on 13) The test apparatus of claim 13, wherein the vacuum space part of the inelastic insulating sheet has a shape of concaved and elongated groove. ### Claim 15 (depends on 14) The test apparatus of claim 14, wherein the vacuum space part has a plurality of deformation-preventing pillars formed therein and having a height for compensating for the concaved groove. ### Claim 16 (depends on 13) The test apparatus of claim 13, wherein the inelastic insulating sheet is formed from any one of polyimide, FR4, engineering plastic and a metal on which an insulating plating layer is formed. ### Claim 17 (depends on 13) The test apparatus of claim 13, wherein a vacuum pressure provided to the pusher is applied to the vacuum picker through the vacuum space part. ### Claim 18 (depends on 13) The test apparatus of claim 13, wherein the upper test socket is attached to the pusher in a vacuum-sealed manner with an adhesive. ### Claim 19 (depends on 13) The test apparatus of claim 13, wherein the electro-conductive part of the upper test socket is formed by arranging a plurality of electro-conductive particles in a thickness direction in an elastic insulating material. ### Claim 20 (depends on 13) The test apparatus of claim 13, wherein the lower terminal of the upper package or the lower package is either a solder ball type or a land type.