# US 11,994,351 B2 · Cooling structural body, cooling system, heat generator and construction > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,994,351 B2 - Document ID: US11994351B2 - Status: Granted - Kind: B2 - Application number: 16/496,400 - Filed: 2018-03-16 - Published: 2021-04-15 - Granted: 2024-05-28 - Earliest claimed: 2017-03-22 - Assignees: Sasaki Beji - Applicants: Beji Sasaki - Inventors: Beji Sasaki - Web page: https://patentgrep.com/patent/US11994351B2 ## CPC - F28F 7/02: Blocks traversed by passages for heat-exchange media {(F28D7/0008 takes precedence)} - H10W 70/02: of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) - H02K 5/203: {specially adapted for liquids, e.g. cooling jackets} - H02K 9/16: wherein the cooling medium circulates through ducts or tubes within the casing - H05K 7/20: Modifications to facilitate cooling, ventilating, or heating - H10W 40/10: Arrangements for heating - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 40/40: involving heat exchange by flowing fluids - H10W 40/47: by flowing liquids, e.g. forced water cooling - F28D 7/00: Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall - F28F 1/006: {with variable shape, e.g. with modified tube ends, with different geometrical features (F28F1/025, F28F1/06, F28F1/08, F28F9/16, F28F9/18 take precedence)} - F28F 1/10: Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses (crimped or corrugated elements F28F1/06, F28F1/08) - F28F 13/06: by affecting the pattern of flow of the heat-exchange media {(F28F13/003 takes precedence; static flow control means in header boxes F28F9/026)} - F28F 13/08: by varying the cross-section of the flow channels - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/43: by flowing gases, e.g. forced air cooling - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H02K: DYNAMO-ELECTRIC MACHINES (dynamo-electric relays H01H53/00; conversion of DC or AC input power into surge output power {H03K3/53}) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) ## Abstract To provide a cooling structural body which can enhance a cooling effect and can easily correspond to small-sizing and the like. The cooling structural body includes a heat radiating part having a mounting surface 2a on which an electronic component 101 is directly or indirectly mounted. A medium flow path through which a medium can flow is provided in the heat radiating part. ## Claims ### Claim 1 A cooling system comprising: a cooling structural body including a heat radiating part having a mounting surface on which an electronic component is directly or indirectly mounted, and a medium flow path through which a medium can flow is provided in the heat radiating part; and a medium flow supply part configured to allow a medium to flow in the medium flow path of the cooling structural body, a housing which is a sealed space and in which both the electronic component and the cooling structural body are disposed, wherein a first guide pipe part configured to guide the medium to the medium flow path positioned in the housing which is the sealed space and inside the cooling structural body is provided, and wherein a second guide pipe part configured to guide the medium from the medium flow path to an outside of the housing which is the sealed space is provided, wherein the cooling structural body and the medium flow supply part are provided on a vehicle, and wherein the medium flow supply part is configured to supply running air generated at a time of running of the vehicle to the medium flow path. ### Claim 2 (depends on 1) The cooling system according to claim 1, wherein the medium flow supply part has a medium flow generator or a pressure-feed mechanism. ### Claim 3 (depends on 1) The cooling system according to claim 1, further comprising a medium storing chamber provided between the cooling structural body and the medium flow supply part and configured to store the medium. ### Claim 4 (depends on 1) The cooling system according to claim 1, wherein the medium flow supply part is configured to supply air, water or oil into the medium flow path of the cooling structural body. ### Claim 5 (depends on 1) The cooling system according to claim 1, wherein a flow of a medium in the medium flow path is generated by a heat convection. ### Claim 6 (depends on 1) The cooling system according to claim 1, wherein the medium flow path has a part where a hole cross-sectional area of the medium flow path on a medium inlet side is larger than a hole cross-sectional area of the medium flow path on a medium outlet side. ### Claim 7 (depends on 1) The cooling system according to claim 1, wherein the medium flow path is disposed so as to pass a mounting scheduled region corresponding to a region where the electronic component is scheduled to be mounted and a non-mounting scheduled region other than the mounting scheduled region, and a size of a hole cross-sectional shape of a part or all of the medium flow path positioned in the mounting scheduled region is larger than a size of a hole cross-sectional shape of the medium flow path positioned in the non-mounting scheduled region. ### Claim 8 (depends on 1) The cooling system according to claim 1, wherein a heat insulating member is provided on at least one of a first opening part which forms a medium inlet part of the medium flow path and a second opening part which forms a medium outlet part of the medium flow path. ### Claim 9 (depends on 1) The cooling system according to claim 1, wherein the heat radiating part has a protruding part in which the medium flow path is provided, and a first opening part which forms a medium inlet part of the medium flow path or a second opening part which forms a medium outlet part of the medium flow path is positioned on an edge of the protruding part. ### Claim 10 (depends on 1) A cooling system according to claim 1, wherein a chimney member having a through hole is provided to a second opening part which forms a medium outlet part of the medium flow path, and the medium flow path and the through hole formed in the chimney member communicate with each other. ### Claim 11 (depends on 1) The cooling system according to claim 1, wherein a pipe member having a through hole is provided to a first opening part which forms a medium inlet part of the medium flow path, and the medium flow path and the through hole of the pipe member communicate with each other. ### Claim 12 (depends on 1) The cooling system according to claim 1, wherein the heat radiating part has: a heat radiating body part; and a heat radiating structural part provided to the heat radiating body part, and the medium flow path is provided in the heat radiating structural part. ### Claim 13 (depends on 1) A cooling system according to claim 1, wherein an insulation substrate, on which the electronic component is directly or indirectly mounted, is provided on the mounting surface, the heat radiating part has: a heat radiating member having a heat radiating body part; and a heat conduction member provided on the heat radiating member, being made of metal, and having the mounting surface, a part of the medium flow path is provided in the heat radiating body part, a part of the medium flow path is provided in the heat conduction member, the medium flow path is not provided in the insulation substrate, the medium flow path provided in the heat conduction member communicates with the medium flow path provided in the heat radiating body part, and does not communicate with the mounting surface, and the medium is a gas. ### Claim 14 (depends on 13) The cooling system according to claim 13, wherein the heat radiating member has: a heat radiating body part; and heat radiating fins provided to the heat radiating body part, a part of the medium flow path extends in a direction along the mounting surface in the heat conduction member, and the heat radiating member is made of a material different from a material of the heat conduction member. ### Claim 15 (depends on 13) The cooling system according to claim 13, wherein the medium flow path is provided in the heat radiating fins. ### Claim 16 (depends on 13) The cooling system according to claim 13, wherein the electronic component is a semiconductor chip, an integrated circuit device, transistor or a capacitor, a part of the medium flow path extends in the heat radiating body part in a direction along the mounting surface, and a part of the medium flow path extends in the heat conduction member in a direction along the mounting surface. ### Claim 17 (depends on 1) A heat generator comprising the cooling system according to claim 1. ### Claim 18 (depends on 1) A construction comprising the cooling system according to claim 1.