# US 11,994,283 B2 · Display backlight having LED device with transparent LED frame

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- Number: US 11,994,283 B2
- Document ID: US11994283B2
- Status: Granted
- Kind: B2
- Application number: 17/787,658
- Filed: 2020-12-28
- Published: 2022-12-29
- Granted: 2024-05-28
- Earliest claimed: 2019-12-25
- Assignees: Shenzhen Jufei Optoelectronics Co., Ltd.
- Applicants: Shenzhen Jufei Optoelectronics Co., Ltd.
- Inventors: Zhonghua Jin; Lianjian Deng; Zhicai Guo; Longjie Xiong
- Web page: https://patentgrep.com/patent/US11994283B2

## CPC

- F21V 5/007: {Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane (combination of two or more refractors F21V5/008)}
- H10H 20/85: Packages
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10W 90/00: Package configurations
- F21Y 2105/00: Planar light sources
- F21Y 2115/10: Light-emitting diodes [LED]
- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/853: characterised by their shape
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

An LED backlight module includes an LED light plate, a diffusion plate, a brightening film, an MOP film, and a QBEF film. The LED light plate includes a driving circuit, a substrate, and LED devices on the substrate. Each LED device includes a transparent LED frame, an LED chip disposed on a bottom portion of the transparent LED frame, and a packaging glue layer formed inside the transparent LED frame and covering the LED chip. A diffusion agent is distributed in the packaging glue layer.

## Claims

### Claim 1

An LED device applicable to a backlight module, wherein the LED device comprises:
a transparent LED frame;
an LED chip disposed at a bottom portion of the transparent LED frame;
a packaging glue layer formed inside the transparent frame and covering the LED chip; and
an anti-glare light-blocking layer disposed on the packaging glue layer, wherein the anti-glare light-blocking layer does not completely cover an upper surface of the packaging glue layer;
wherein a diffusion agent is distributed in the packaging glue layer;
wherein a surface of the packaging glue layer away from the bottom portion of the transparent LED frame is a concave surface.

### Claim 2

An LED backlight module, comprising:
a diffusion plate;
a brightening film;
a microlens-prism composite film (MOP);
a quantum dot optical film (QBEF);
a driving circuit;
a substrate; and
a plurality of LED devices on the substrate, each of the LED devices comprises a transparent LED frame, an LED chip disposed on a bottom portion of the transparent LED frame, a packaging glue layer formed inside the transparent LED frame and covering the LED chip, and a diffusion agent distributed in the packaging glue layer;
wherein the diffusion plate, the brightening film, the microlens-prism composite film (MOP), and the quantum dot optical film (QBEF) are sequentially arranged over the plurality of LED devices.

### Claim 3 (depends on 2)

A display, comprising:
a display panel; and
an LED backlight module according to claim 2.

### Claim 4 (depends on 2)

The LED backlight module according to claim 2, wherein in each of the LED devices, a surface of the packaging glue layer away from the bottom portion of the transparent LED frame is an inwardly concave surface.

### Claim 5 (depends on 4)

The LED backlight module according to claim 4, wherein in each of the LED devices, a height of the inwardly concave surface of the packaging glue layer is in a range between 10 μm and 60 μm.

### Claim 6 (depends on 4)

The LED backlight module according to claim 4, wherein the LED device further comprises an anti-glare light-blocking layer disposed on the packaging glue layer, wherein the anti-glare light-blocking layer does not completely cover an upper surface of the packaging glue layer.

### Claim 7 (depends on 2)

The LED backlight module according to claim 2, wherein at least two adjacent rows or two adjacent columns of the LED devices on the substrate are misaligned with each other.

### Claim 8 (depends on 7)

The LED backlight module according to claim 7, wherein the substrate comprises a plurality of sections defined by the LED devices, wherein each of the sections comprises at least two of the LED devices.

### Claim 9 (depends on 8)

The LED backlight module according to claim 8, wherein each of the sections comprises a group of two, three, or four of the LED devices.