# US 11,994,268 B2 · Illumination apparatus

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- Number: US 11,994,268 B2
- Document ID: US11994268B2
- Status: Granted
- Kind: B2
- Application number: 17/988,550
- Filed: 2022-11-16
- Published: 2023-05-04
- Granted: 2024-05-28
- Earliest claimed: 2010-10-21
- Assignees: Optovate Limited
- Applicants: Optovate Limited
- Inventors: Jonathan Harrold; Graham J. Woodgate
- Web page: https://patentgrep.com/patent/US11994268B2

## CPC

- F21V 13/04: the elements being reflectors and refractors {(for vehicle rear lights F21S43/40)}
- F21K 9/00: Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
- F21K 9/68: Details of reflectors forming part of the light source
- F21K 9/69: Details of refractors forming part of the light source
- F21K 9/90: Methods of manufacture
- F21V 5/007: {Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane (combination of two or more refractors F21V5/008)}
- F21V 9/30: Elements containing photoluminescent material distinct from or spaced from the light source (shades F21V1/17; globes, bowls or cover glasses F21V3/08, F21V3/12; refractors F21V5/10; reflectors F21V7/26, F21V7/30; elements with provision for controlling the spectral properties or intensity F21V9/40)
- G02B 19/0028: {refractive and reflective surfaces, e.g. non-imaging catadioptric systems}
- G02B 19/0066: {in the form of an LED array}
- G02F 1/133603: {with LEDs}
- G02F 1/133605: {including specially adapted reflectors}
- G09G 3/2088: {with use of a plurality of processors, each processor controlling a number of individual elements of the matrix}
- H10H 20/01: Manufacture or treatment
- H10H 20/018: {Bonding of wafers}
- H10H 20/813: having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
- H10H 20/8513: {having two or more wavelength conversion materials}
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10P 34/42: with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20)
- H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes}
- H10W 72/30: Die-attach connectors
- H10W 90/00: Package configurations
- F21V 17/00: Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages (of light sources or light holders F21V19/00)
- F21V 23/002: {Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm}
- F21Y 2101/00: Point-like light sources
- F21Y 2115/10: Light-emitting diodes [LED]
- G02F 1/133607: {the light controlling member including light directing or refracting elements, e.g. prisms or lenses}
- G02F 1/133612: {Electrical details}
- H10H 20/036: {of packages}
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0362: {of encapsulations}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/0364: {of interconnections}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49117: Conductor or circuit manufacturing
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An illumination apparatus comprises a plurality of LEDs aligned to an array of directional optical elements wherein the LEDs are substantially at the input aperture of respective optical elements. An electrode array is formed on the array of optical elements to provide at least a first electrical connection to the array of LED elements. Advantageously such an arrangement provides low cost and high efficiency from the directional LED array.

## Claims

### Claim 1

A method of manufacturing an illumination apparatus, the method comprising:
selectively removing a plurality of light emitting elements from a first monolithic array of light emitting elements such that, in at least one direction, for at least one pair of the selectively removed light-emitting elements in the at least one direction, for each respective pair there is at least one respective light-emitting element that is not selected that was positioned in the first monolithic array between the pair of selectively removed light emitting elements in the at least one direction, wherein the plurality of light emitting elements are selectively removed in a manner that preserves the relative spatial positions of the selectively removed light-emitting elements;
arranging the selectively removed light emitting elements on a substrate in a manner that preserves the relative spatial positions of the selectively removed light-emitting elements, to form a second array of light emitting elements;
providing a shadow mask with an array of apertures in alignment with the light emitting elements of the second array;
forming a conductive coating on the light emitting elements of the second array through the apertures of the shadow mask;
forming a lithographic patterned array of photoresist on the conductive coating formed on the light emitting elements of the second array; and
etching the conductive coating to provide electrode regions on the light emitting elements of the second array.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the conductive coating is increased in thickness by an electro-deposition or plating process.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the substrate is a glass, silicon, metal, or ceramic substrate.

### Claim 4 (depends on 1)

The method according to claim 1, wherein one or more electrodes and/or one or more heat spreaders are arranged on the substrate prior to the step of arranging the selectively removed light emitting elements on a substrate to form a second array of light emitting elements.

### Claim 5 (depends on 1)

The method according to claim 1, wherein the shadow mask comprises a metal or polymer material.

### Claim 6 (depends on 1)

The method according to claim 1, wherein material used for the conductive coating is also deposited on the shadow mask, and the material deposited on the shadow mask is recycled.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the light emitting elements are driven as vertical thin film (VTF) devices.

### Claim 8 (depends on 1)

The method according to claim 1, wherein the LEDs have a maximum dimension of 0.1 mm.

### Claim 9 (depends on 1)

The method according to claim 1, wherein the illumination apparatus is for display illumination.

### Claim 10 (depends on 1)

An environmental illumination apparatus comprising an illumination apparatus manufactured by the method of claim 1.

### Claim 11 (depends on 1)

A display apparatus comprising an illumination apparatus manufactured by the method of claim 1.