# US 11,993,851 B2 · Aqueous solution for surface treatment, method for producing surface-treated alloy, and composite and method for producing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,993,851 B2 - Document ID: US11993851B2 - Status: Granted - Kind: B2 - Application number: 16/965,683 - Filed: 2019-01-23 - Published: 2021-12-09 - Granted: 2024-05-28 - Earliest claimed: 2018-02-01 - Assignees: Mitsubishi Gas Chemical Company, Inc. - Applicants: Mitsubishi Gas Chemical Company, Inc. - Inventors: Tomoko Fujii; Kazuhiko Ikeda; Shun Fukazawa - Web page: https://patentgrep.com/patent/US11993851B2 ## CPC - C23C 18/38: Coating with copper - C23F 1/20: for etching aluminium or alloys thereof - B29C 45/14311: {using means for bonding the coating to the articles (B29C45/14795 takes precedence)} - B32B 15/08: of synthetic resin - B32B 15/085: comprising polyolefins - B32B 15/088: comprising polyamides - B32B 15/09: comprising polyesters - B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} - B32B 27/20: using fillers, pigments, thixotroping agents - B32B 27/286: {comprising polysulphones; polysulfides} - B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} - B32B 27/34: comprising polyamides - B32B 27/36: comprising polyesters - B32B 27/365: {comprising polycarbonates} - C09D 167/02: Polyesters derived from dicarboxylic acids and dihydroxy compounds (C09D167/06 takes precedence) - C09D 177/00: Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain (based on polyhydrazides C09D179/06; based on polyamide-imides C09D179/08); Coating compositions based on derivatives of such polymers - C09D 181/02: Polythioethers; Polythioether-ethers - C09J 5/02: involving pretreatment of the surfaces to be joined - C23C 26/02: applying molten material to the substrate - C23F 1/02: Local etching - C23F 1/14: Aqueous compositions - B29K 2705/02: Aluminium - B32B 2250/02: 2 layers - B32B 2262/101: Glass fibres - B32B 2307/538: Roughness - B32B 2307/54: Yield strength; Tensile strength - B32B 2307/748: Releasability - B32B 2605/08: Cars - B32B 2605/18: Aircraft - C09J 2400/163: in the substrate - C09J 2400/166: in the pretreated surface to be joined - H05K 3/383: {by microetching} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less. ## Claims ### Claim 1 An aqueous solution suitable for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 45000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide at a halide ion concentration of 2000 ppm or more and 70000 ppm or less, wherein the heterocyclic nitrogen compound comprises pyrazole, wherein the copper compound comprises copper (II) sulfate and/or copper (II) bromide, wherein the halide comprises at least one selected from the group consisting of sodium chloride, potassium chloride, and potassium bromide, and wherein the aqueous solution is formulated such that copper is deposited on the surface of the alloy when the aqueous solution is contacted with the surface of the alloy. ### Claim 2 (depends on 1) The solution of claim 1, wherein the heterocyclic nitrogen compound further comprises an azole compound. ### Claim 3 (depends on 2) The solution of claim 2, wherein the azole compound comprises 5-aminotetrazole and/or imidazole. ### Claim 4 (depends on 3) The solution of claim 3, wherein the copper compound comprises copper (II) bromide. ### Claim 5 (depends on 3) The solution of claim 3, wherein the copper compound comprises copper (II) sulfate. ### Claim 6 (depends on 1) The solution of claim 1, wherein the copper compound comprises copper (II) sulfate. ### Claim 7 (depends on 1) The solution of claim 1, wherein the alloy is an aluminum alloy. ### Claim 8 (depends on 1) The solution of claim 1, wherein the heterocyclic nitrogen compound further comprises a 5-aminotetrazole. ### Claim 9 (depends on 1) The solution of claim 1, wherein the heterocyclic nitrogen compound further comprises an imidazole. ### Claim 10 (depends on 1) The solution of claim 1, wherein the heterocyclic nitrogen compound further comprises a 5-aminotetrazole and an imidazole. ### Claim 11 (depends on 1) The solution of claim 1, wherein the copper compound comprises copper (II) bromide. ### Claim 12 (depends on 1) The solution of claim 1, which does not comprise hydrogen peroxide or peracetic acid. ### Claim 13 (depends on 1) The solution of claim 1, wherein the halide comprises sodium chloride. ### Claim 14 (depends on 1) The solution of claim 1, wherein the halide comprises potassium chloride and/or potassium bromide. ### Claim 15 (depends on 1) The solution of claim 1, which comprises less than 0.5% by mass of acid. ### Claim 16 (depends on 1) A method for producing a surface-treated alloy, comprising: contacting the aqueous solution of claim 1 with a surface of an alloy; and dissolving or dispersing copper deposited on the surface of an alloy in the contacting, in an aqueous solution comprising an oxidant and an acid, to remove the copper, thereby obtaining a surface-treated alloy. ### Claim 17 (depends on 16) The method of claim 16, wherein the oxidant is peroxide. ### Claim 18 (depends on 16) The method of claim 16, wherein the acid is an inorganic acid. ### Claim 19 (depends on 16) A composite, comprising: a surface-treated alloy obtained by the method of claim 16; and a resin composition comprising a thermoplastic resin, wherein the resin composition is bonded to the surface-treated alloy. ### Claim 20 (depends on 16) A method for producing a composite, the method comprising: bonding a surface-treated alloy obtained by the method of claim 16 and a resin composition comprising a thermoplastic resin, thereby obtaining a composite. ### Claim 21 (depends on 20) The method of claim 20, further comprising: inserting the surface-treated alloy into a mold, before the obtaining of the composite, wherein the bonding comprises injecting into and molding in a mold, the resin composition comprising a thermoplastic resin, to thereby bond the surface-treated alloy and the resin composition.