# US 11,993,839 B2 · Mask and method of manufacturing the same, and mask assembly

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- Number: US 11,993,839 B2
- Document ID: US11993839B2
- Status: Granted
- Kind: B2
- Application number: 17/055,508
- Filed: 2020-03-11
- Published: 2021-04-29
- Granted: 2024-05-28
- Earliest claimed: 2019-03-28
- Assignees: Chengdu Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd.
- Applicants: Chengdu Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd.
- Inventors: Yong Zheng; Shuai Du; Wenbiao Ding
- Web page: https://patentgrep.com/patent/US11993839B2

## CPC

- C23C 14/042: {using masks}
- B05C 21/005: {Masking devices (stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20)}
- C23C 14/24: Vacuum evaporation
- C25D 1/10: Moulds; Masks; Masterforms
- C25D 3/38: of copper
- C25D 3/54: of metals not provided for in groups C25D3/04 - C25D3/50
- C25D 3/58: containing more than 50% by weight of copper
- C25D 5/10: Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10)
- H10K 59/12: Active-matrix OLED [AMOLED] displays
- H10K 71/166: {using selective deposition, e.g. using a mask}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

A mask has a mask pattern region and a non-mask pattern region located at a peripheral of the mask pattern region. The mask pattern region includes at least one effective mask region. In any effective mask region, the mask includes a plurality of evaporation holes and at least one shielding; strip. Each shielding, strip is located between two adjacent evaporation holes. The mask has at least one welding region in the non-mask pattern region. A thickness of a portion of the mask in the non-mask pattern region and at least in the welding region is greater than a thickness of the shielding strip of the mask in the effective mask region, and the thickness refers to a dimension of the corresponding portion along a direction perpendicular to a plane where the mask is located.

## Claims

### Claim 1

A mask, having a mask pattern region and a non-mask pattern region located at a peripheral of the mask pattern region, wherein
the mask pattern region includes at least one effective mask region; and in any of the at least one effective mask region, the mask comprises:
a plurality of evaporation holes, and
at least one shielding strip, wherein each shielding strip is located between two adjacent evaporation holes;
the mask has at least one welding region in the non-mask pattern region; and
a thickness of a portion of the mask in the non-mask pattern region and at least in a welding region is greater than a thickness of the shielding strip of the mask in the at least one effective mask region;
and the thickness refers to a dimension of a corresponding portion along a direction perpendicular to a plane where the mask is located,
wherein the mask comprises:
a first metal layer, wherein the first metal layer at least includes the shielding strip in the at least one effective mask region, and the first metal layer covers the non-mask pattern region; and
a second metal layer stacked with the first metal layer along a thickness direction of the mask, wherein the second metal layer is located in the non-mask pattern region, and covers a portion of the first metal layer located in the non-mask pattern region,
wherein the non-mask pattern region includes a transition region adjacent to the mask pattern region,
wherein a thickness of the mask in the transition region gradually increases from a first thickness to a second thickness along a first direction, and the first direction points from a side of the transition region where the transition region is connected to the mask pattern region to a side of the transition region away from the mask pattern region, and
wherein the first thickness is equal to the thickness of the shielding strip; and the second thickness is equal to a sum of the thickness of the shielding strip and a thickness of a portion of the second metal layer outside the transition region.

### Claim 2 (depends on 1)

The mask according to claim 1, wherein the mask pattern region includes two or more effective mask regions; and
in the mask pattern region, the mask comprises
at least one space portion, wherein each space portion is located between two adjacent effective mask regions, and thickness of the space portion is the same as the thickness of the shielding strip.

### Claim 3 (depends on 1)

The mask according to claim 1, wherein the at least one welding region is arranged in the following ways:
the at least one welding region and the transition region do not overlap; and/or,
a number of the least one welding region is two, and the two welding regions are located at opposite sides of the mask pattern region.

### Claim 4 (depends on 1)

The mask according to claim 1, wherein
a width range of the transition region along the first direction is approximately 1 μm to approximately 8 μm.

### Claim 5 (depends on 1)

The mask according to claim 1, wherein the mask pattern region is substantially in a shape of a rectangle;
a width range of a portion of the transition region, which is located at opposite sides of the rectangle along a width direction of the rectangle, along the first direction is approximately 1 μm to approximately 3 μm and/or
a width range of a portion of the transition region, which is located at opposite sides of the rectangle along a length direction of the rectangle, along the first direction approximately 3 μm to approximately 8 μm.

### Claim 6 (depends on 1)

The mask according to claim 1, wherein a thickness range of a portion of the mask in the non-mask pattern region outside the transition region is approximately 20 μm to approximately 30 μm.

### Claim 7 (depends on 1)

The mask according to claim 1, wherein a material of the second metal layer includes at least one of copper or tungsten.

### Claim 8 (depends on 1)

The mask according to claim 1, wherein a thickness range of the first metal layer is approximately 3 μm to approximately 10 μm.

### Claim 9 (depends on 1)

The mask according to claim 1, wherein a thickness range of the shielding strip of the mask in the at least one effective mask region is approximately 3 μm to approximately 10 μm.

### Claim 10 (depends on 1)

A mask assembly, comprising;
a frame provided with an opening: and
at least one mask according to claim 1, wherein each mask spans the opening, and welded to the frame in the at least one welding region.

### Claim 11

A method of manufacturing a mask, the mask having a mask pattern region and a non-mask pattern region located at a peripheral of the mask pattern region; the mask pattern region including at least one effective mask region; and the mask having at least one welding region in the non-mask region;
the method comprising:
forming a first metal layer, where the first metal layer extends from the mask pattern region to the non-mask pattern region, and covers the non-mask pattern region; and in any of the at least one effective mask region, the first metal layer includes a plurality of evaporation holes and at least one shielding strip, and each shielding strip is located between two adjacent evaporation holes; and
forming a second metal layer on a side of the first metal layer, wherein the second metal layer is located in the non-mask pattern, and at least covers a portion of the first metal layer located in the at least one, welding region; and a thickness of a portion of the mask in the non-mask pattern region and at least in a welding region is greater than a thickness of the shielding strip of the mask in the at least one effective mask region,
wherein forming a second metal layer on a side of the first metal layer, including:
forming a first adhesive layer on a side of the first metal layer, wherein the first adhesive layer at least covers a portion of the first metal layer other than the evaporation holes in the mask pattern region;
forming the second metal layer on the first metal layer on which the first adhesive layer has been formed through an electroforming process, wherein the second metal layer covers an exposed surface of the first metal layer in the non-mask pattern region; and
removing the first adhesive layer,
wherein forming a first adhesive layer on a side of the first metal layer, including:
providing a mold on a side of the first metal layer, wherein the mold is located in the non-mask pattern region, and at least covers a transition region adjacent to the mask pattern region in the non-mask pattern region; a thickness of the mold in the transition region gradually increases from 0 to H along a first direction; a range of H is approximately 10 μm to approximately 27 μm; a width range of the transition region along the first direction is approximately 1 μm to approximately 3 μm; and the first direction points from a side of the transition region where the transition region is connected to the mask pattern region to a side of the transition region away from the mask pattern region;
forming the first adhesive layer on the first metal layer on which the mold has been disposed, wherein the first adhesive layer includes: a main adhesive layer pattern covering the portion of the first metal layer other than the evaporation holes in the mask pattern region, and an extending adhesive layer pattern extending to the transition region; and the extending adhesive layer pattern covers a portion of the mold located in the transition region; and
removing the mold and retaining the first adhesive layer.

### Claim 12 (depends on 11)

The method of the manufacturing the mask according to claim 11, wherein
forming the second metal layer on the first metal layer on which the first adhesive layer has been formed through an electroforming process, includes:
placing the first metal layer on which the first adhesive layer has been formed in an electroforming liquid having at least one of copper ion or tungsten ion to perform electroforming, so as to form the second metal layer containing at least one of copper of tungsten.