# US 11,993,731 B2 · Adhesive composition for semiconductor circuit connection and adhesive film containing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,993,731 B2 - Document ID: US11993731B2 - Status: Granted - Kind: B2 - Application number: 17/266,023 - Filed: 2020-06-05 - Published: 2021-09-23 - Granted: 2024-05-28 - Earliest claimed: 2019-06-10 - Assignees: LG Chem, Ltd. - Applicants: LG Chem, Ltd. - Inventors: Junghak Kim; You Jin Kyung; Kwang Joo Lee; Minsu Jeong; Ju Hyeon Kim; Youngsam Kim - Web page: https://patentgrep.com/patent/US11993731B2 ## CPC - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - C08G 59/306: {containing silicon} - C08G 59/3281: {containing silicon} - C09J 11/04: inorganic - C09J 11/06: organic - C09J 183/06: containing silicon bound to oxygen-containing groups (C09J183/12 takes precedence) - C08G 77/14: containing silicon bound to oxygen-containing groups - C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ## Abstract The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits. ## Claims ### Claim 1 An adhesive composition for semiconductor circuit connection, comprising a thermosetting resin containing an organic epoxy resin and an organic-inorganic hybrid epoxy resin having a repeating unit represented by Chemical Formula 1, wherein a weight ratio of the organic epoxy resin to the organic-inorganic hybrid epoxy resin having a repeating unit represented by Chemical Formula 1 in the thermosetting resin is the range of 1:0.03 to 1:4.0, wherein the organic epoxy resin contains (a1) an organic epoxy resin that is solid at 10 to 35° C., and (a2) an organic epoxy resin that is liquid at 10 to 35° C., wherein a weight ratio of (a1):[(a2)+(a3)] is 1:0.15 to 1:2.7, and a weight ratio of (a2):(a3) is 1:0.15 to 1:10, wherein (a3) is the organic-inorganic hybrid epoxy resin, wherein the adhesive composition further comprises a thermoplastic resin, a curing agent, an inorganic filler, and a curing catalyst, wherein the thermoplastic resin is a (meth)acrylate-based resin having a (meth)acrylate-based repeating unit containing an epoxy-based functional group, wherein the thermoplastic resin is included in an amount of 53 parts by weight to 70 parts by weight, the curing agent is included in an amount of 10 parts by weight to 150 parts by weight, the inorganic filler is included in an amount of 5 parts by weight to 200 parts by weight, and the curing agent catalyst is included in an amount of 0.1 to 20 parts by weight, based on 100 parts by weight of the thermosetting resin, and wherein the organic-inorganic hybrid epoxy resin has an average epoxy equivalent weight of 50 g/eq. to 174 g/eq.: in the Chemical Formula 1, R is each independently a monovalent functional group having at least one epoxy group, and n is 1 to 30. ### Claim 2 (depends on 1) The adhesive composition for semiconductor circuit connection of claim 1, wherein R of the Chemical Formula 1 is each independently a functional group selected from the group consisting of the following structural formulae: in the above structural formulae, represents a site where the corresponding functional group is connected to Si. ### Claim 3 (depends on 1) The adhesive composition for semiconductor circuit connection of claim 1, wherein the organic-inorganic hybrid epoxy resin has a viscosity of 0.1 Pa·s to 10000 Pa·s as measured at 25° C. ### Claim 4 (depends on 1) The adhesive composition for semiconductor circuit connection of claim 1, wherein the organic epoxy resin is at least one resin selected from the group consisting of a bisphenol-based epoxy resin, a biphenyl-based epoxy resin, a naphthalene-based epoxy resin, a fluorene-based epoxy resin, a phenol novolac-based epoxy resin, a cresol novolac-based epoxy resin, a xylok-based epoxy resin, a trishydroxyphenylmethane-based epoxy resin, a tetraphenylmethane-based epoxy resin, a dicyclopentadiene-type epoxy resin, and a dicyclopentadiene-modified phenol-type epoxy resin. ### Claim 5 (depends on 1) The adhesive composition for semiconductor circuit connection of claim 1, wherein the curing agent is at least one compound selected from the group consisting of an amine-based curing agent, a phenol-based curing agent, and an acid anhydride-based curing agent. ### Claim 6 (depends on 1) The adhesive composition for semiconductor circuit connection of claim 1, wherein the inorganic filler is at least one inorganic particle selected from the group consisting of alumina, silica, barium sulfate, magnesium hydroxide, magnesium carbonate, magnesium silicate, magnesium oxide, calcium silicate, calcium carbonate, calcium oxide, aluminum hydroxide, aluminum nitride, and aluminum borate. ### Claim 7 (depends on 1) The adhesive composition for semiconductor circuit connection of claim 1, wherein the curing catalyst is at least one compound selected from the group consisting of a phosphorus-based compound, a boron-based compound, a phosphorous-boron-based compound, and an imidazole-based compound. ### Claim 8 (depends on 1) An adhesive film containing the adhesive composition for semiconductor circuit connection of claim 1.