# US 11,993,247 B2 · Intelligent power module, electric vehicle or hybrid vehicle, and method of assembling intelligent power module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,993,247 B2 - Document ID: US11993247B2 - Status: Granted - Kind: B2 - Application number: 17/666,295 - Filed: 2022-02-07 - Published: 2022-05-26 - Granted: 2024-05-28 - Earliest claimed: 2016-05-24 - Assignees: Rohm Co., Ltd. - Applicants: Rohm Co., Ltd. - Inventors: Hideki Sawada - Web page: https://patentgrep.com/patent/US11993247B2 ## CPC - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - B60W 20/10: Controlling the power contribution of each of the prime movers to meet required power demand - H05K 7/14322: {wherein the control and power circuits of a power converter are arranged within the same casing} - H05K 7/14329: {specially adapted for the configuration of power bus bars} - H05K 7/20927: {Liquid coolant without phase change} - H10W 40/10: Arrangements for heating - H10W 40/40: involving heat exchange by flowing fluids - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 40/611: {Bolts or screws} - H10W 90/00: Package configurations - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B60W: CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION; CONTROL SYSTEMS SPECIALLY ADAPTED FOR HYBRID VEHICLES; ROAD VEHICLE DRIVE CONTROL SYSTEMS FOR PURPOSES NOT RELATED TO THE CONTROL OF A PARTICULAR SUB-UNIT - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module. ## Claims ### Claim 1 A power module device, comprising: a first heat radiation device including an integrated flow path, a front surface, and a rear surface; a plurality of power semiconductor modules disposed in a row over the front surface of the first heat radiation device and configured to individually seal a semiconductor device circuit; a second heat radiation device disposed over the plurality of power semiconductor modules; a drive circuit part configured to drive the plurality of power semiconductor modules and disposed over the second heat radiation device; a heat shield member placed between the plurality of power semiconductor modules and the drive circuit part; and an attachment frame, disposed on the front surface of the first heat radiation device, the attachment frame comprising: a frame body; and a plurality of holes formed inside the frame body, wherein the plurality of power semiconductor modules is mounted on the front surface of the first heat radiation device via respective ones of the plurality of holes, wherein the second heat radiation device is formed of a metal plate having a heat radiation property, wherein the metal plate is formed of Al, and wherein the second heat radiation device has a spring property. ### Claim 2 (depends on 1) The power module device of claim 1, wherein a power device used in the semiconductor device circuit comprises a switching element that includes an electrode and a surface on which the electrode is disposed, and wherein at least one of the plurality of power semiconductor modules constitutes a two-in-one module. ### Claim 3 (depends on 1) The power module device of claim 1, wherein the second heat radiation device has a through-hole, and wherein the first heat radiation device and the second heat radiation device are thermally connected to each other via a fixture that is inserted into the through-hole. ### Claim 4 (depends on 1) The power module device of claim 1, wherein the first heat radiation device is a water-cooled cooler. ### Claim 5 (depends on 1) The power module device of claim 1, wherein the drive circuit part comprises a primary side circuit part and a secondary side circuit part that are insulated from each other. ### Claim 6 (depends on 1) The power module device of claim 1, wherein at least one of the plurality of power semiconductor modules comprises one or more semiconductor device circuits of an IGBT, a diode, a Si-based MOSFET, a SiC-based MOSFET, and a GaN-based FET. ### Claim 7 (depends on 1) The power module device of claim 1, wherein the attachment frame is made of a resin. ### Claim 8 (depends on 1) The power module device of claim 1, further comprising a joining member configured to join the plurality of power semiconductor modules on the front surface of the first heat radiation device. ### Claim 9 (depends on 8) The power module device of claim 8, wherein the joining member comprises solder configured to fix the plurality of power semiconductor modules to the front surface. ### Claim 10 (depends on 9) The power module device of claim 9, wherein the joining member comprises a thermally conductive resin configured to hold the plurality of power semiconductor modules on the front surface. ### Claim 11 A power module device, comprising: a first heat radiation device including an integrated flow path, a front surface, and a rear surface; a plurality of power semiconductor modules, each of the plurality of power semiconductor modules constituting a two-in-one module, the plurality of power semiconductor modules being disposed in a row over the front surface of the first heat radiation device and being configured to individually seal a semiconductor device circuit therein; a second heat radiation device disposed over the plurality of power semiconductor modules; a drive circuit part configured to drive the plurality of power semiconductor modules and disposed over the second heat radiation device; a heat shield member placed between the plurality of power semiconductor modules and the drive circuit part; and an attachment frame disposed on the front surface of the first heat radiation device, the attachment frame comprising: a frame body; and a plurality of holes formed inside the frame body, wherein the plurality of power semiconductor modules is mounted on the front surface of the first heat radiation device via respective ones of the plurality of holes, wherein the plurality of power semiconductor modules constitutes a six-in-one module type inverter or converter, wherein the second heat radiation device is formed of a metal plate having a heat radiation property, wherein the metal plate is formed of Al, and wherein the second heat radiation device has a spring property. ### Claim 12 (depends on 1) The power module device of claim 1, wherein the power module device is used in a power control unit of an electric vehicle or a hybrid vehicle and is configured to operate in response to a control signal supplied from an ECU. ### Claim 13 (depends on 1) An electric vehicle or a hybrid vehicle equipped with the power module device of claim 1. ### Claim 14 (depends on 13) The electric vehicle or the hybrid vehicle of claim 13, further comprising: an ECU configured to control an operation of the power module device; and a temperature monitoring circuit configured to monitor a temperature state of the power module device.