# US 11,993,066 B2 · Chuck, lamination process, and manufacturing method of semiconductor package using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,993,066 B2 - Document ID: US11993066B2 - Status: Granted - Kind: B2 - Application number: 17/395,440 - Filed: 2021-08-05 - Published: 2022-10-06 - Granted: 2024-05-28 - Earliest claimed: 2021-03-31 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Wei-Jie Huang; Yu-Ching Lo; Ching-Pin Yuan; Wen-Chih Lin; Cheng-Yu Kuo; Yi-Yang Lei; Ching-Hua Hsieh - Web page: https://patentgrep.com/patent/US11993066B2 ## CPC - B32B 38/1858: {using vacuum} - B32B 37/0046: {characterised by constructional aspects of the apparatus} - B32B 38/1825: {characterised by the control or constructional features of devices for tensioning, stretching or registration} - H10P 72/74: {using temporarily an auxiliary support} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 72/0198: {batch processes} - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/7426: {used as a support during build up manufacturing of active devices} - H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers} - H10P 72/7434: {used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 72/073: {of die-attach connectors} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/874: {On different surfaces} - H10W 72/9413: {on encapsulations} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer. ## Claims ### Claim 1 A lamination chuck for lamination of film materials, comprising a support layer; a top layer disposed on the support layer, a base, wherein the support layer and the top layer are stacked on the base, and the base comprises a body having a through hole formed therethrough and an insulation wall protruding from the body towards the support layer as well as encircling the through hole, wherein the top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer, and the top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer, wherein the through hole is in fluidic communications with the at least one vacuum channel, wherein a hemicylindrical concavity is formed at an outer side edge of the top layer, the hemicylindrical concavity extends from the top surface of the top layer to an opposite bottom surface of the top layer, the outer side edge connects the top surface of the top layer to the bottom surface of the top layer, the through hole is formed in the support layer aligned to the hemicylindrical concavity, and a threaded hole is formed in the body of the base, aligned to the through hole of the support layer. ### Claim 2 (depends on 1) The lamination chuck of claim 1, wherein the polymeric material of the top layer includes at least one material selected from a rubber having a Shore A hardness of 20 to 50 and a powder-free sponge material. ### Claim 3 (depends on 1) The lamination chuck of claim 1, wherein the material of the support layer includes stainless steel. ### Claim 4 (depends on 1) The lamination chuck of claim 1, wherein, when assembled, the support layer physically contacts the insulation wall so that suction applied to the through hole of the base is transmitted through the at least one vacuum channel up to the top layer. ### Claim 5 (depends on 1) The lamination chuck of claim 1, wherein the top layer and the support layer include a plurality of vacuum channels, formed at a distance from each other as segments of a region extending along an outer side edge of the top layer, the outer side edge connecting the top surface of the top layer to an opposite bottom surface of the top layer. ### Claim 6 (depends on 5) The lamination chuck of claim 5, wherein the top layer has a substantially circular outline having a first diameter, the region where the plurality of vacuum channels is formed is an annular region having a second diameter as inner diameter, a ratio of the second diameter to the first diameter is in a range from 0.98 to 0.99, and the plurality of vacuum channels have an annular arc shape. ### Claim 7 A lamination chuck, comprising a base comprising a threaded hole; a support layer disposed on the base, the support layer comprising a through hole; and a top layer disposed on the support layer, wherein the top layer and the support layer comprise at least one vacuum channel extending from a top surface of the top layer to a bottom surface of the support layer, and the at least one vacuum channel is in fluidic communications with the through hole, wherein the top layer comprises a hemicylindrical concavity located at an outer side edge of the top layer, the hemicylindrical concavity extends from the top surface of the top layer to a bottom surface of the top layer, and the hemicylindrical concavity substantially aligns to the through hole of the support layer as well as the threaded hole of the base. ### Claim 8 (depends on 7) The lamination chuck of claim 7, wherein a material of the top layer has a Shore A hardness lower than a Shore hardness of a material of the support layer. ### Claim 9 (depends on 7) The lamination chuck of claim 7, wherein the base comprises a body having the through hole and an insulation wall protruding from the body towards the support layer as well as encircling the through hole. ### Claim 10 (depends on 9) The lamination chuck of claim 9, wherein the support layer is physically in contact with the insulation wall. ### Claim 11 (depends on 7) The lamination chuck of claim 7, wherein a material of the top layer includes at least one material selected from a rubber having a Shore A hardness of 20 to 50 and a powder-free sponge material. ### Claim 12 (depends on 7) The lamination chuck of claim 7, wherein a material of the support layer includes stainless steel. ### Claim 13 (depends on 7) The lamination chuck of claim 7, wherein the top layer and the support layer include a plurality of vacuum channels, and the plurality of vacuum channels are formed at a distance from each other as segments of a region extending along the outer side edge of the top layer. ### Claim 14 (depends on 13) The lamination chuck of claim 13, wherein the top layer has a substantially circular outline having a first diameter, the region where the plurality of vacuum channels are distributed is an annular region having a second diameter as inner diameter, a ratio of the second diameter to the first diameter is in a range from 0.98 to 0.99, and the plurality of vacuum channels have an annular arc shape. ### Claim 15 A lamination chuck, comprising a base comprising a threaded hole; a support layer disposed on the base, the support layer comprising a through hole; and a top layer disposed on the support layer, wherein the top layer and the support layer comprise a plurality of vacuum channels extending from a top surface of the top layer to a bottom surface of the support layer, the plurality of vacuum channels are formed at a distance from each other as segments of a region extending along an outer side edge of the top layer, and the at least one vacuum channel is in fluidic communications with the through hole, wherein the top layer has a substantially circular outline having a first diameter, the region where the plurality of vacuum channels are distributed is an annular region having a second diameter as inner diameter, a ratio of the second diameter to the first diameter is in a range from 0.98 to 0.99, and the plurality of vacuum channels have an annular arc shape. ### Claim 16 (depends on 15) The lamination chuck of claim 15, wherein a material of the top layer has a Shore A hardness lower than a Shore hardness of a material of the support layer. ### Claim 17 (depends on 15) The lamination chuck of claim 15, wherein the base comprises a body having the through hole and an insulation wall protruding from the body towards the support layer as well as encircling the through hole. ### Claim 18 (depends on 15) The lamination chuck of claim 15, wherein the support layer is physically in contact with the insulation wall so that suction applied to the through hole of the base is transmitted through the plurality of vacuum channels up to the top layer. ### Claim 19 (depends on 15) The lamination chuck of claim 15, wherein a material of the top layer includes at least one material selected from a rubber having a Shore A hardness of 20 to 50 and a powder-free sponge material. ### Claim 20 (depends on 15) The lamination chuck of claim 15, wherein a material of the support layer includes stainless steel.